KR100320545B1 - Sn계저융점땜납재 - Google Patents
Sn계저융점땜납재 Download PDFInfo
- Publication number
- KR100320545B1 KR100320545B1 KR1019950048319A KR19950048319A KR100320545B1 KR 100320545 B1 KR100320545 B1 KR 100320545B1 KR 1019950048319 A KR1019950048319 A KR 1019950048319A KR 19950048319 A KR19950048319 A KR 19950048319A KR 100320545 B1 KR100320545 B1 KR 100320545B1
- Authority
- KR
- South Korea
- Prior art keywords
- soldering
- melting point
- solder material
- solder
- low melting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 47
- 239000000463 material Substances 0.000 title claims abstract description 41
- 238000002844 melting Methods 0.000 title claims abstract description 28
- 230000008018 melting Effects 0.000 title claims abstract description 28
- 229910052802 copper Inorganic materials 0.000 claims abstract description 13
- 229910052709 silver Inorganic materials 0.000 claims abstract description 13
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 8
- 239000012535 impurity Substances 0.000 claims abstract description 5
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 238000005476 soldering Methods 0.000 abstract description 45
- 239000010935 stainless steel Substances 0.000 abstract description 18
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 18
- 229910045601 alloy Inorganic materials 0.000 description 26
- 239000000956 alloy Substances 0.000 description 26
- 238000012360 testing method Methods 0.000 description 17
- 238000000034 method Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 10
- 238000007792 addition Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 239000010408 film Substances 0.000 description 7
- 230000008020 evaporation Effects 0.000 description 6
- 238000001704 evaporation Methods 0.000 description 6
- 230000004907 flux Effects 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 229910052698 phosphorus Inorganic materials 0.000 description 6
- 239000010963 304 stainless steel Substances 0.000 description 5
- 229910000589 SAE 304 stainless steel Inorganic materials 0.000 description 5
- 238000005219 brazing Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 4
- 230000001747 exhibiting effect Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 230000007480 spreading Effects 0.000 description 3
- 229910020816 Sn Pb Inorganic materials 0.000 description 2
- 229910020836 Sn-Ag Inorganic materials 0.000 description 2
- 229910020922 Sn-Pb Inorganic materials 0.000 description 2
- 229910020988 Sn—Ag Inorganic materials 0.000 description 2
- 229910008783 Sn—Pb Inorganic materials 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 238000005275 alloying Methods 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000002076 thermal analysis method Methods 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910018054 Ni-Cu Inorganic materials 0.000 description 1
- 229910018481 Ni—Cu Inorganic materials 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004453 electron probe microanalysis Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000001235 sensitizing effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (2)
- P의 0.05∼1.5 중량%, Ni의 0.5∼5.0 중량%, 잔부 Sn 및 불가피 불순물로 이루어진 Sn계 저융점 땜납재
- P의 0.05∼1.5 중량%, Ni의 0.5∼5.0 중량%, Cu 30 중량% 이하, 및/또는 Ag의 10 중량% 이하이며, Ni와 Cu와 Ag의 합계가 35 중량% 이하이며, 잔부 Sn 및 불가피 불순물로 이루어진 Sn계 저융점 땜납재.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950048319A KR100320545B1 (ko) | 1995-12-11 | 1995-12-11 | Sn계저융점땜납재 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950048319A KR100320545B1 (ko) | 1995-12-11 | 1995-12-11 | Sn계저융점땜납재 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970033398A KR970033398A (ko) | 1997-07-22 |
KR100320545B1 true KR100320545B1 (ko) | 2002-04-22 |
Family
ID=66594453
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950048319A Expired - Fee Related KR100320545B1 (ko) | 1995-12-11 | 1995-12-11 | Sn계저융점땜납재 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100320545B1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20170072980A (ko) * | 2015-12-17 | 2017-06-28 | 한국기계연구원 | 가스분무법을 이용한 자성솔더 복합분말의 제조방법 및 이에 의하여 제조되는 자성솔더 복합분말 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030021718A1 (en) * | 2001-06-28 | 2003-01-30 | Osamu Munekata | Lead-free solder alloy |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6186091A (ja) * | 1984-10-03 | 1986-05-01 | Furukawa Electric Co Ltd:The | Sn−Sb系合金はんだ |
-
1995
- 1995-12-11 KR KR1019950048319A patent/KR100320545B1/ko not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6186091A (ja) * | 1984-10-03 | 1986-05-01 | Furukawa Electric Co Ltd:The | Sn−Sb系合金はんだ |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20170072980A (ko) * | 2015-12-17 | 2017-06-28 | 한국기계연구원 | 가스분무법을 이용한 자성솔더 복합분말의 제조방법 및 이에 의하여 제조되는 자성솔더 복합분말 |
KR102379931B1 (ko) | 2015-12-17 | 2022-03-30 | 한국재료연구원 | 가스분무법을 이용한 자성솔더 복합분말의 제조방법 및 이에 의하여 제조되는 자성솔더 복합분말 |
Also Published As
Publication number | Publication date |
---|---|
KR970033398A (ko) | 1997-07-22 |
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