TW587252B - Semiconductor memory device and data processing device - Google Patents
Semiconductor memory device and data processing device Download PDFInfo
- Publication number
- TW587252B TW587252B TW090100864A TW90100864A TW587252B TW 587252 B TW587252 B TW 587252B TW 090100864 A TW090100864 A TW 090100864A TW 90100864 A TW90100864 A TW 90100864A TW 587252 B TW587252 B TW 587252B
- Authority
- TW
- Taiwan
- Prior art keywords
- memory
- semiconductor memory
- item
- memory cell
- patent application
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B10/00—Static random access memory [SRAM] devices
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/005—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor comprising combined but independently operative RAM-ROM, RAM-PROM, RAM-EPROM cells
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0408—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
- G11C16/0416—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors comprising cells containing a single floating gate transistor and no select transistor, e.g. UV EPROM
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/10—Programming or data input circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/34—Determination of programming status, e.g. threshold voltage, overprogramming or underprogramming, retention
- G11C16/3436—Arrangements for verifying correct programming or erasure
- G11C16/3454—Arrangements for verifying correct programming or for detecting overprogrammed cells
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/34—Determination of programming status, e.g. threshold voltage, overprogramming or underprogramming, retention
- G11C16/3436—Arrangements for verifying correct programming or erasure
- G11C16/3454—Arrangements for verifying correct programming or for detecting overprogrammed cells
- G11C16/3459—Circuits or methods to verify correct programming of nonvolatile memory cells
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
- G11C5/025—Geometric lay-out considerations of storage- and peripheral-blocks in a semiconductor storage device
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/24—Memory cell safety or protection circuits, e.g. arrangements for preventing inadvertent reading or writing; Status cells; Test cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B10/00—Static random access memory [SRAM] devices
- H10B10/12—Static random access memory [SRAM] devices comprising a MOSFET load element
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B10/00—Static random access memory [SRAM] devices
- H10B10/18—Peripheral circuit regions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/50—Peripheral circuit region structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/20—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional [3D] arrangements, e.g. with cells on different height levels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D88/00—Three-dimensional [3D] integrated devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/10—Integrated device layouts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W42/00—Arrangements for protection of devices
- H10W42/40—Arrangements for protection of devices protecting against tampering, e.g. unauthorised inspection or reverse engineering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2216/00—Indexing scheme relating to G11C16/00 and subgroups, for features not directly covered by these groups
- G11C2216/02—Structural aspects of erasable programmable read-only memories
- G11C2216/06—Floating gate cells in which the floating gate consists of multiple isolated silicon islands, e.g. nanocrystals
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Theoretical Computer Science (AREA)
- Mathematical Physics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
- Read Only Memory (AREA)
- Dram (AREA)
- Static Random-Access Memory (AREA)
- Mram Or Spin Memory Techniques (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000013893 | 2000-01-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW587252B true TW587252B (en) | 2004-05-11 |
Family
ID=18541424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW090100864A TW587252B (en) | 2000-01-18 | 2001-01-15 | Semiconductor memory device and data processing device |
Country Status (4)
| Country | Link |
|---|---|
| US (5) | US6839260B2 (https=) |
| JP (2) | JP2001274355A (https=) |
| KR (1) | KR100817657B1 (https=) |
| TW (1) | TW587252B (https=) |
Families Citing this family (119)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5673218A (en) | 1996-03-05 | 1997-09-30 | Shepard; Daniel R. | Dual-addressed rectifier storage device |
| TW587252B (en) * | 2000-01-18 | 2004-05-11 | Hitachi Ltd | Semiconductor memory device and data processing device |
| EP1130516A1 (en) * | 2000-03-01 | 2001-09-05 | Hewlett-Packard Company, A Delaware Corporation | Address mapping in solid state storage device |
| DE10020128A1 (de) * | 2000-04-14 | 2001-10-18 | Infineon Technologies Ag | MRAM-Speicher |
| US6956757B2 (en) * | 2000-06-22 | 2005-10-18 | Contour Semiconductor, Inc. | Low cost high density rectifier matrix memory |
| JP4353393B2 (ja) | 2001-06-05 | 2009-10-28 | 株式会社ルネサステクノロジ | 半導体集積回路装置 |
| CN100426417C (zh) * | 2001-07-17 | 2008-10-15 | 三洋电机株式会社 | 半导体存储装置 |
| US6504742B1 (en) * | 2001-10-31 | 2003-01-07 | Hewlett-Packard Company | 3-D memory device for large storage capacity |
| JP2003151262A (ja) | 2001-11-15 | 2003-05-23 | Toshiba Corp | 磁気ランダムアクセスメモリ |
| US6743641B2 (en) | 2001-12-20 | 2004-06-01 | Micron Technology, Inc. | Method of improving surface planarity prior to MRAM bit material deposition |
| US6621739B2 (en) * | 2002-01-18 | 2003-09-16 | Sandisk Corporation | Reducing the effects of noise in non-volatile memories through multiple reads |
| JP2004023062A (ja) * | 2002-06-20 | 2004-01-22 | Nec Electronics Corp | 半導体装置とその製造方法 |
| US6856030B2 (en) * | 2002-07-08 | 2005-02-15 | Viciciv Technology | Semiconductor latches and SRAM devices |
| US7042035B2 (en) * | 2002-08-02 | 2006-05-09 | Unity Semiconductor Corporation | Memory array with high temperature wiring |
| US20040098545A1 (en) * | 2002-11-15 | 2004-05-20 | Pline Steven L. | Transferring data in selectable transfer modes |
| WO2004084228A1 (en) * | 2003-03-18 | 2004-09-30 | Kabushiki Kaisha Toshiba | Phase change memory device |
| JP2005353912A (ja) * | 2004-06-11 | 2005-12-22 | Renesas Technology Corp | 半導体記憶装置 |
| US7286439B2 (en) | 2004-12-30 | 2007-10-23 | Sandisk 3D Llc | Apparatus and method for hierarchical decoding of dense memory arrays using multiple levels of multiple-headed decoders |
| USD557347S1 (en) * | 2005-01-04 | 2007-12-11 | Sdd Company Limited | Mat type controller |
| KR100586553B1 (ko) * | 2005-01-07 | 2006-06-08 | 주식회사 하이닉스반도체 | 반도체 소자의 게이트 및 이의 형성 방법 |
| WO2006080908A1 (en) * | 2005-01-25 | 2006-08-03 | Chien-Chiang Chan | A single chip having a magnetoresistive memory |
| US7338894B2 (en) * | 2005-01-26 | 2008-03-04 | Freescale Semiconductor, Inc. | Semiconductor device having nitridated oxide layer and method therefor |
| JP2006221364A (ja) * | 2005-02-09 | 2006-08-24 | Toshiba Corp | 半導体装置及びbios認証システム |
| KR100675517B1 (ko) * | 2005-09-09 | 2007-01-30 | 주식회사 엑셀반도체 | 시리얼 플래쉬 메모리 장치 및 프리차아지 방법 |
| KR100723569B1 (ko) * | 2005-09-30 | 2007-05-31 | 가부시끼가이샤 도시바 | 상 변화 메모리 장치 |
| US7593256B2 (en) * | 2006-03-28 | 2009-09-22 | Contour Semiconductor, Inc. | Memory array with readout isolation |
| US8120949B2 (en) * | 2006-04-27 | 2012-02-21 | Avalanche Technology, Inc. | Low-cost non-volatile flash-RAM memory |
| US7539046B2 (en) * | 2007-01-31 | 2009-05-26 | Northern Lights Semiconductor Corp. | Integrated circuit with magnetic memory |
| TWI381385B (zh) * | 2007-05-04 | 2013-01-01 | Macronix Int Co Ltd | 具有嵌入式多類型記憶體的記憶體結構 |
| US7477545B2 (en) * | 2007-06-14 | 2009-01-13 | Sandisk Corporation | Systems for programmable chip enable and chip address in semiconductor memory |
| US7715255B2 (en) * | 2007-06-14 | 2010-05-11 | Sandisk Corporation | Programmable chip enable and chip address in semiconductor memory |
| JP5557419B2 (ja) * | 2007-10-17 | 2014-07-23 | スパンション エルエルシー | 半導体装置 |
| US7813157B2 (en) * | 2007-10-29 | 2010-10-12 | Contour Semiconductor, Inc. | Non-linear conductor memory |
| KR20090082784A (ko) | 2008-01-28 | 2009-07-31 | 삼성전자주식회사 | Nvram 셀을 채용한 플래쉬 메모리 장치 |
| US20090225621A1 (en) * | 2008-03-05 | 2009-09-10 | Shepard Daniel R | Split decoder storage array and methods of forming the same |
| US8521979B2 (en) | 2008-05-29 | 2013-08-27 | Micron Technology, Inc. | Memory systems and methods for controlling the timing of receiving read data |
| WO2009149061A2 (en) * | 2008-06-02 | 2009-12-10 | Contour Semiconductor, Inc. | Diode decoder array with non-sequential layout and methods of forming the same |
| US7979757B2 (en) * | 2008-06-03 | 2011-07-12 | Micron Technology, Inc. | Method and apparatus for testing high capacity/high bandwidth memory devices |
| KR20090126077A (ko) * | 2008-06-03 | 2009-12-08 | 삼성전자주식회사 | 메모리 반도체 장치 및 그 제조 방법 |
| US8756486B2 (en) | 2008-07-02 | 2014-06-17 | Micron Technology, Inc. | Method and apparatus for repairing high capacity/high bandwidth memory devices |
| US7855931B2 (en) | 2008-07-21 | 2010-12-21 | Micron Technology, Inc. | Memory system and method using stacked memory device dice, and system using the memory system |
| US8289760B2 (en) | 2008-07-02 | 2012-10-16 | Micron Technology, Inc. | Multi-mode memory device and method having stacked memory dice, a logic die and a command processing circuit and operating in direct and indirect modes |
| US8127204B2 (en) | 2008-08-15 | 2012-02-28 | Micron Technology, Inc. | Memory system and method using a memory device die stacked with a logic die using data encoding, and system using the memory system |
| US8130528B2 (en) | 2008-08-25 | 2012-03-06 | Sandisk 3D Llc | Memory system with sectional data lines |
| US8325556B2 (en) * | 2008-10-07 | 2012-12-04 | Contour Semiconductor, Inc. | Sequencing decoder circuit |
| US20100195393A1 (en) * | 2009-01-30 | 2010-08-05 | Unity Semiconductor Corporation | Data storage system with refresh in place |
| JP5632584B2 (ja) | 2009-02-05 | 2014-11-26 | ピーエスフォー ルクスコ エスエイアールエルPS4 Luxco S.a.r.l. | 半導体装置 |
| US8054673B2 (en) | 2009-04-16 | 2011-11-08 | Seagate Technology Llc | Three dimensionally stacked non volatile memory units |
| US8223525B2 (en) * | 2009-12-15 | 2012-07-17 | Sandisk 3D Llc | Page register outside array and sense amplifier interface |
| US8213243B2 (en) | 2009-12-15 | 2012-07-03 | Sandisk 3D Llc | Program cycle skip |
| KR101473684B1 (ko) * | 2009-12-25 | 2014-12-18 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| JP5289353B2 (ja) * | 2010-02-05 | 2013-09-11 | 株式会社東芝 | 半導体記憶装置 |
| WO2011114866A1 (en) | 2010-03-17 | 2011-09-22 | Semiconductor Energy Laboratory Co., Ltd. | Memory device and semiconductor device |
| US8355281B2 (en) * | 2010-04-20 | 2013-01-15 | Micron Technology, Inc. | Flash memory having multi-level architecture |
| US8416624B2 (en) | 2010-05-21 | 2013-04-09 | SanDisk Technologies, Inc. | Erase and programming techniques to reduce the widening of state distributions in non-volatile memories |
| WO2012002186A1 (en) * | 2010-07-02 | 2012-01-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP2012256821A (ja) * | 2010-09-13 | 2012-12-27 | Semiconductor Energy Lab Co Ltd | 記憶装置 |
| TWI670711B (zh) * | 2010-09-14 | 2019-09-01 | 日商半導體能源研究所股份有限公司 | 記憶體裝置和半導體裝置 |
| KR101188263B1 (ko) | 2010-10-14 | 2012-10-05 | 에스케이하이닉스 주식회사 | 반도체 메모리 장치 |
| KR101924231B1 (ko) | 2010-10-29 | 2018-11-30 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 기억 장치 |
| WO2012061633A2 (en) | 2010-11-03 | 2012-05-10 | Netlist, Inc. | Method and apparatus for optimizing driver load in a memory package |
| KR102130257B1 (ko) * | 2010-11-05 | 2020-07-03 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| US8400808B2 (en) | 2010-12-16 | 2013-03-19 | Micron Technology, Inc. | Phase interpolators and push-pull buffers |
| US9601178B2 (en) * | 2011-01-26 | 2017-03-21 | Semiconductor Energy Laboratory Co., Ltd. | Memory device and semiconductor device |
| US8780614B2 (en) * | 2011-02-02 | 2014-07-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor memory device |
| TWI520273B (zh) * | 2011-02-02 | 2016-02-01 | 半導體能源研究所股份有限公司 | 半導體儲存裝置 |
| WO2012121265A1 (en) * | 2011-03-10 | 2012-09-13 | Semiconductor Energy Laboratory Co., Ltd. | Memory device and method for manufacturing the same |
| US8446772B2 (en) | 2011-08-04 | 2013-05-21 | Sandisk Technologies Inc. | Memory die self-disable if programmable element is not trusted |
| US9779814B2 (en) * | 2011-08-09 | 2017-10-03 | Flashsilicon Incorporation | Non-volatile static random access memory devices and methods of operations |
| US20130083048A1 (en) * | 2011-09-29 | 2013-04-04 | Advanced Micro Devices, Inc. | Integrated circuit with active memory and passive variable resistive memory with shared memory control logic and method of making same |
| US9230615B2 (en) * | 2011-10-24 | 2016-01-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor memory device and method for driving the same |
| JP6105266B2 (ja) * | 2011-12-15 | 2017-03-29 | 株式会社半導体エネルギー研究所 | 記憶装置 |
| JP2013161878A (ja) * | 2012-02-02 | 2013-08-19 | Renesas Electronics Corp | 半導体装置、および半導体装置の製造方法 |
| US9312257B2 (en) | 2012-02-29 | 2016-04-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| KR101975528B1 (ko) | 2012-07-17 | 2019-05-07 | 삼성전자주식회사 | 패스트 어레이 영역을 갖는 반도체 메모리 셀 어레이 및 그것을 포함하는 반도체 메모리 |
| WO2014112758A1 (ko) * | 2013-01-18 | 2014-07-24 | (주)실리콘화일 | 듀얼 기판 스택 메모리 |
| US9536840B2 (en) | 2013-02-12 | 2017-01-03 | Qualcomm Incorporated | Three-dimensional (3-D) integrated circuits (3DICS) with graphene shield, and related components and methods |
| US8947944B2 (en) | 2013-03-15 | 2015-02-03 | Sandisk 3D Llc | Program cycle skip evaluation before write operations in non-volatile memory |
| US8947972B2 (en) | 2013-03-15 | 2015-02-03 | Sandisk 3D Llc | Dynamic address grouping for parallel programming in non-volatile memory |
| US9171608B2 (en) * | 2013-03-15 | 2015-10-27 | Qualcomm Incorporated | Three-dimensional (3D) memory cell separation among 3D integrated circuit (IC) tiers, and related 3D integrated circuits (3DICS), 3DIC processor cores, and methods |
| US9165088B2 (en) | 2013-07-08 | 2015-10-20 | Hewlett-Packard Development Company, L.P. | Apparatus and method for multi-mode storage |
| US9171597B2 (en) | 2013-08-30 | 2015-10-27 | Micron Technology, Inc. | Apparatuses and methods for providing strobe signals to memories |
| US9165623B2 (en) * | 2013-10-13 | 2015-10-20 | Taiwan Semiconductor Manufacturing Company Limited | Memory arrangement |
| US9711225B2 (en) | 2013-10-16 | 2017-07-18 | Sandisk Technologies Llc | Regrouping and skipping cycles in non-volatile memory |
| JP6139370B2 (ja) * | 2013-10-17 | 2017-05-31 | 株式会社東芝 | 不揮発性半導体記憶装置 |
| WO2015116188A1 (en) * | 2014-01-31 | 2015-08-06 | Hewlett-Packard Development Company, L.P. | Non-volatile memory with multiple latency tiers |
| WO2015170220A1 (en) * | 2014-05-09 | 2015-11-12 | Semiconductor Energy Laboratory Co., Ltd. | Memory device and electronic device |
| JP6580863B2 (ja) * | 2014-05-22 | 2019-09-25 | 株式会社半導体エネルギー研究所 | 半導体装置、健康管理システム |
| WO2015195083A1 (en) | 2014-06-16 | 2015-12-23 | Intel Corporation | Silicon die with integrated high voltage devices |
| US9564215B2 (en) | 2015-02-11 | 2017-02-07 | Sandisk Technologies Llc | Independent sense amplifier addressing and quota sharing in non-volatile memory |
| KR20160124294A (ko) | 2015-04-16 | 2016-10-27 | 삼성전자주식회사 | 주변 영역 상에 적층된 셀 영역을 갖는 반도체 소자 및 그의 제조방법 |
| WO2016181256A1 (ja) * | 2015-05-12 | 2016-11-17 | 株式会社半導体エネルギー研究所 | 半導体装置、電子部品および電子機器 |
| US9697874B1 (en) * | 2015-06-09 | 2017-07-04 | Crossbar, Inc. | Monolithic memory comprising 1T1R code memory and 1TnR storage class memory |
| US9892800B2 (en) * | 2015-09-30 | 2018-02-13 | Sunrise Memory Corporation | Multi-gate NOR flash thin-film transistor strings arranged in stacked horizontal active strips with vertical control gates |
| US11120884B2 (en) | 2015-09-30 | 2021-09-14 | Sunrise Memory Corporation | Implementing logic function and generating analog signals using NOR memory strings |
| US9842651B2 (en) | 2015-11-25 | 2017-12-12 | Sunrise Memory Corporation | Three-dimensional vertical NOR flash thin film transistor strings |
| US12537057B2 (en) | 2015-09-30 | 2026-01-27 | Sunrise Memory Corporation | Three-dimensional vertical nor flash thin film transistor strings |
| KR102366798B1 (ko) * | 2017-06-13 | 2022-02-25 | 삼성전자주식회사 | 반도체 소자 |
| US10861902B2 (en) | 2017-06-13 | 2020-12-08 | Samsung Electronics Co., Ltd. | Semiconductor device having magnetic tunnel junction pattern |
| KR102482896B1 (ko) | 2017-12-28 | 2022-12-30 | 삼성전자주식회사 | 이종 휘발성 메모리 칩들을 포함하는 메모리 장치 및 이를 포함하는 전자 장치 |
| CN110010170B (zh) * | 2018-01-05 | 2021-04-02 | 旺宏电子股份有限公司 | 存储装置的操作方法及其存储系统 |
| JP7061524B2 (ja) | 2018-06-28 | 2022-04-28 | 株式会社Screenホールディングス | 基板処理装置のメンテナンス装置およびメンテナンス方法 |
| US11569243B2 (en) | 2018-09-25 | 2023-01-31 | Intel Corporation | Stacked-substrate DRAM semiconductor devices |
| JP2020064969A (ja) | 2018-10-17 | 2020-04-23 | キオクシア株式会社 | 半導体装置およびその製造方法 |
| CN113488505B (zh) * | 2019-04-30 | 2022-09-30 | 长江存储科技有限责任公司 | 具有三维相变存储器的三维存储设备 |
| CN110291586B (zh) | 2019-05-17 | 2020-10-30 | 长江存储科技有限责任公司 | 具有静态随机存取存储器的三维存储器件的高速缓存程序操作 |
| WO2020232573A1 (en) * | 2019-05-17 | 2020-11-26 | Yangtze Memory Technologies Co., Ltd. | Three-dimensional memory device with static random-access memory |
| WO2020232574A1 (en) * | 2019-05-17 | 2020-11-26 | Yangtze Memory Technologies Co., Ltd. | Data buffering operation of three-dimensional memory device with static random-access memory |
| JP7320227B2 (ja) * | 2019-09-13 | 2023-08-03 | 本田技研工業株式会社 | 半導体装置 |
| US11515309B2 (en) | 2019-12-19 | 2022-11-29 | Sunrise Memory Corporation | Process for preparing a channel region of a thin-film transistor in a 3-dimensional thin-film transistor array |
| US12550382B2 (en) | 2020-01-22 | 2026-02-10 | Sunrise Memory Corporation | Thin-film storage transistor with ferroelectric storage layer |
| TWI767512B (zh) | 2020-01-22 | 2022-06-11 | 美商森恩萊斯記憶體公司 | 薄膜儲存電晶體中冷電子抹除 |
| WO2021159028A1 (en) | 2020-02-07 | 2021-08-12 | Sunrise Memory Corporation | High capacity memory circuit with low effective latency |
| US11705496B2 (en) | 2020-04-08 | 2023-07-18 | Sunrise Memory Corporation | Charge-trapping layer with optimized number of charge-trapping sites for fast program and erase of a memory cell in a 3-dimensional NOR memory string array |
| WO2022043826A1 (ja) | 2020-08-27 | 2022-03-03 | 株式会社半導体エネルギー研究所 | 半導体装置、表示装置、及び電子機器 |
| US11842777B2 (en) | 2020-11-17 | 2023-12-12 | Sunrise Memory Corporation | Methods for reducing disturb errors by refreshing data alongside programming or erase operations |
| WO2023287908A1 (en) | 2021-07-16 | 2023-01-19 | Sunrise Memory Corporation | 3-dimensional memory string array of thin-film ferroelectric transistors |
| US12402319B2 (en) | 2021-09-14 | 2025-08-26 | Sunrise Memory Corporation | Three-dimensional memory string array of thin-film ferroelectric transistors formed with an oxide semiconductor channel |
| US11974422B2 (en) * | 2021-11-04 | 2024-04-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62219550A (ja) | 1986-03-19 | 1987-09-26 | Sharp Corp | 半導体記憶素子 |
| JP2778977B2 (ja) * | 1989-03-14 | 1998-07-23 | 株式会社東芝 | 半導体装置及びその製造方法 |
| JP3167036B2 (ja) | 1991-06-26 | 2001-05-14 | 川崎製鉄株式会社 | 半導体記憶装置 |
| JPH0582787A (ja) | 1991-09-19 | 1993-04-02 | Sony Corp | 薄膜トランジスタ型不揮発性半導体メモリ装置 |
| JP3354937B2 (ja) * | 1993-04-23 | 2002-12-09 | イルビン センサーズ コーポレーション | それぞれが積層体表面に固定されたicチップと相互作用するicチップの積層体を含んだ電子モジュール |
| EP0713609B1 (en) * | 1993-08-13 | 2003-05-07 | Irvine Sensors Corporation | Stack of ic chips as substitute for single ic chip |
| JPH07153286A (ja) | 1993-11-30 | 1995-06-16 | Sony Corp | 半導体不揮発性記憶装置 |
| US5488579A (en) * | 1994-04-29 | 1996-01-30 | Motorola Inc. | Three-dimensionally integrated nonvolatile SRAM cell and process |
| JP3319667B2 (ja) * | 1994-12-20 | 2002-09-03 | 松下電器産業株式会社 | 映像フォーマット変換装置 |
| JP2977023B2 (ja) * | 1996-09-30 | 1999-11-10 | 日本電気株式会社 | 不揮発性半導体記憶装置及びその製造方法 |
| US6335565B1 (en) * | 1996-12-04 | 2002-01-01 | Hitachi, Ltd. | Semiconductor device |
| US6492719B2 (en) * | 1999-07-30 | 2002-12-10 | Hitachi, Ltd. | Semiconductor device |
| US5915167A (en) * | 1997-04-04 | 1999-06-22 | Elm Technology Corporation | Three dimensional structure memory |
| JP3670449B2 (ja) * | 1997-07-09 | 2005-07-13 | 株式会社東芝 | 半導体装置 |
| JPH11149788A (ja) * | 1997-11-17 | 1999-06-02 | Oki Electric Ind Co Ltd | 半導体記憶装置及びその制御方法 |
| JP3638770B2 (ja) | 1997-12-05 | 2005-04-13 | 東京エレクトロンデバイス株式会社 | テスト機能を備える記憶装置 |
| JPH11204742A (ja) * | 1998-01-20 | 1999-07-30 | Sony Corp | メモリ及び情報機器 |
| WO1999038078A1 (fr) * | 1998-01-21 | 1999-07-29 | Tokyo Electron Limited | Dispositif de stockage, dispositif de cryptage/decryptage et procede permettant d'acceder a une memoire remanente |
| JP4538693B2 (ja) | 1998-01-26 | 2010-09-08 | ソニー株式会社 | メモリ素子およびその製造方法 |
| JPH11214640A (ja) * | 1998-01-28 | 1999-08-06 | Hitachi Ltd | 半導体記憶素子、半導体記憶装置とその制御方法 |
| US6040605A (en) | 1998-01-28 | 2000-03-21 | Hitachi, Ltd. | Semiconductor memory device |
| JP4085459B2 (ja) | 1998-03-02 | 2008-05-14 | セイコーエプソン株式会社 | 3次元デバイスの製造方法 |
| JP4409018B2 (ja) | 1999-12-08 | 2010-02-03 | パナソニック株式会社 | 半導体メモリ装置 |
| TW587252B (en) * | 2000-01-18 | 2004-05-11 | Hitachi Ltd | Semiconductor memory device and data processing device |
| JP3871853B2 (ja) * | 2000-05-26 | 2007-01-24 | 株式会社ルネサステクノロジ | 半導体装置及びその動作方法 |
| US6915167B2 (en) * | 2001-01-05 | 2005-07-05 | Medtronic, Inc. | Method and apparatus for hardware/firmware trap |
| US6795326B2 (en) * | 2001-12-12 | 2004-09-21 | Micron Technology, Inc. | Flash array implementation with local and global bit lines |
| JP4499982B2 (ja) * | 2002-09-11 | 2010-07-14 | 株式会社日立製作所 | メモリシステム |
-
2001
- 2001-01-15 TW TW090100864A patent/TW587252B/zh not_active IP Right Cessation
- 2001-01-17 JP JP2001008434A patent/JP2001274355A/ja not_active Withdrawn
- 2001-01-17 KR KR1020010002601A patent/KR100817657B1/ko not_active Expired - Fee Related
- 2001-01-18 US US09/764,487 patent/US6839260B2/en not_active Expired - Fee Related
-
2004
- 2004-12-28 US US11/022,779 patent/US7177187B2/en not_active Expired - Fee Related
-
2007
- 2007-01-31 US US11/700,088 patent/US7336519B2/en not_active Expired - Fee Related
- 2007-12-19 US US11/959,606 patent/US7570516B2/en not_active Expired - Fee Related
-
2009
- 2009-06-15 JP JP2009142286A patent/JP2009260364A/ja active Pending
- 2009-07-07 US US12/498,911 patent/US7826266B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US7570516B2 (en) | 2009-08-04 |
| KR20010076308A (ko) | 2001-08-11 |
| JP2009260364A (ja) | 2009-11-05 |
| US7177187B2 (en) | 2007-02-13 |
| US20010017798A1 (en) | 2001-08-30 |
| JP2001274355A (ja) | 2001-10-05 |
| US6839260B2 (en) | 2005-01-04 |
| US20050105317A1 (en) | 2005-05-19 |
| US7336519B2 (en) | 2008-02-26 |
| US7826266B2 (en) | 2010-11-02 |
| US20080106938A1 (en) | 2008-05-08 |
| US20090268519A1 (en) | 2009-10-29 |
| KR100817657B1 (ko) | 2008-03-27 |
| US20070127297A1 (en) | 2007-06-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW587252B (en) | Semiconductor memory device and data processing device | |
| CN114446348B (zh) | 存储器单元布置及其方法 | |
| TW494575B (en) | Semiconductor device and transistor | |
| CN101461064B (zh) | 半导体磁性存储器 | |
| TW477068B (en) | Semiconductor memory device and semiconductor memory apparatus | |
| JP4846979B2 (ja) | 誘電体格納エレメントを用いる多状態不揮発性メモリ及び電荷レベルを格納する方法 | |
| US7489551B2 (en) | Memory architecture and method of manufacture and operation thereof | |
| JP2001156275A (ja) | 半導体集積回路 | |
| JPH09508240A (ja) | 強誘電体メモリ | |
| TWI823432B (zh) | 使用半導體元件的記憶裝置的製造方法 | |
| TWI793968B (zh) | 半導體元件記憶裝置 | |
| TWI849635B (zh) | 半導體記憶裝置 | |
| JP3920550B2 (ja) | 不揮発性半導体記憶装置 | |
| JP2004200641A (ja) | Nand型磁気抵抗ラム | |
| US20040262665A1 (en) | Semiconductor storage device, method for operating thereof, semiconductor device and portable electronic equipment | |
| JPH06244384A (ja) | Dramセルと不揮発性メモリセルが複合された複合メモリセル及びその作製方法 | |
| TWI760122B (zh) | 多閘極鐵電記憶體以及記憶體陣列裝置 | |
| US20240292607A1 (en) | Self-aligned line contacts | |
| JP3614231B2 (ja) | 半導体記憶素子および半導体記憶装置 | |
| JP2004343015A (ja) | 半導体記憶装置及びその動作方法、並びに、携帯電子機器 | |
| JP2004349352A (ja) | 半導体記憶装置およびその動作方法、半導体装置ならびに携帯電子機器 | |
| WO2024249505A1 (en) | Digit line / cell plate isolation | |
| JP2007066984A (ja) | 不揮発性半導体記憶素子およびそれを用いた不揮発性半導体記憶装置 | |
| JPH05110112A (ja) | 不揮発性半導体メモリおよびその読み出し方法 | |
| JP2000182369A (ja) | 磁気記録半導体メモリ装置およびその製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |