TW200718323A - Multilayered printed wiring board - Google Patents
Multilayered printed wiring boardInfo
- Publication number
- TW200718323A TW200718323A TW095124798A TW95124798A TW200718323A TW 200718323 A TW200718323 A TW 200718323A TW 095124798 A TW095124798 A TW 095124798A TW 95124798 A TW95124798 A TW 95124798A TW 200718323 A TW200718323 A TW 200718323A
- Authority
- TW
- Taiwan
- Prior art keywords
- wiring board
- printed wiring
- insulating layers
- multilayered printed
- viaholes
- Prior art date
Links
- 239000004020 conductor Substances 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0352—Differences between the conductors of different layers of a multilayer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09709—Staggered pads, lands or terminals; Parallel conductors in different planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09827—Tapered, e.g. tapered hole, via or groove
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005199443 | 2005-07-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200718323A true TW200718323A (en) | 2007-05-01 |
TWI335784B TWI335784B (zh) | 2011-01-01 |
Family
ID=37637236
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW099128529A TW201101955A (en) | 2005-07-07 | 2006-07-07 | Multilayer printed wiring board |
TW095124798A TW200718323A (en) | 2005-07-07 | 2006-07-07 | Multilayered printed wiring board |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW099128529A TW201101955A (en) | 2005-07-07 | 2006-07-07 | Multilayer printed wiring board |
Country Status (7)
Country | Link |
---|---|
US (3) | US7834273B2 (zh) |
EP (4) | EP2312922B1 (zh) |
JP (2) | JP5172340B2 (zh) |
KR (1) | KR100987619B1 (zh) |
CN (2) | CN101772261B (zh) |
TW (2) | TW201101955A (zh) |
WO (1) | WO2007007857A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8569630B2 (en) | 2010-01-22 | 2013-10-29 | Ibiden Co., Ltd. | Flex-rigid wiring board and method for manufacturing the same |
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2006
- 2006-07-06 US US11/480,824 patent/US7834273B2/en active Active
- 2006-07-07 WO PCT/JP2006/314011 patent/WO2007007857A1/ja active Application Filing
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- 2006-07-07 EP EP11001002A patent/EP2312922B1/en active Active
- 2006-07-07 EP EP11001003A patent/EP2312923B1/en active Active
- 2006-07-07 KR KR1020077011447A patent/KR100987619B1/ko active IP Right Grant
- 2006-07-07 CN CN2010101032938A patent/CN101772261B/zh active Active
- 2006-07-07 EP EP06781086A patent/EP1858307B1/en active Active
- 2006-07-07 CN CN2006800012939A patent/CN101069458B/zh active Active
- 2006-07-07 JP JP2007524715A patent/JP5172340B2/ja active Active
- 2006-07-07 TW TW095124798A patent/TW200718323A/zh unknown
- 2006-07-07 EP EP11001004A patent/EP2312924B1/en active Active
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- 2010-06-21 US US12/819,805 patent/US8212363B2/en active Active
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8569630B2 (en) | 2010-01-22 | 2013-10-29 | Ibiden Co., Ltd. | Flex-rigid wiring board and method for manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
TWI335784B (zh) | 2011-01-01 |
EP2312922B1 (en) | 2012-09-12 |
JP2012156525A (ja) | 2012-08-16 |
EP1858307A1 (en) | 2007-11-21 |
JP5415580B2 (ja) | 2014-02-12 |
JP5172340B2 (ja) | 2013-03-27 |
US7834273B2 (en) | 2010-11-16 |
CN101069458A (zh) | 2007-11-07 |
KR100987619B1 (ko) | 2010-10-13 |
US8481424B2 (en) | 2013-07-09 |
EP2312923B1 (en) | 2012-09-12 |
US20100252318A1 (en) | 2010-10-07 |
EP2312922A1 (en) | 2011-04-20 |
EP2312924B1 (en) | 2012-09-12 |
WO2007007857A1 (ja) | 2007-01-18 |
US20120005889A1 (en) | 2012-01-12 |
US20070096328A1 (en) | 2007-05-03 |
TWI345438B (zh) | 2011-07-11 |
CN101772261B (zh) | 2012-08-29 |
CN101069458B (zh) | 2010-04-07 |
EP1858307B1 (en) | 2012-05-16 |
TW201101955A (en) | 2011-01-01 |
EP2312924A1 (en) | 2011-04-20 |
EP1858307A4 (en) | 2010-08-11 |
CN101772261A (zh) | 2010-07-07 |
US8212363B2 (en) | 2012-07-03 |
JPWO2007007857A1 (ja) | 2009-01-29 |
KR20070070225A (ko) | 2007-07-03 |
EP2312923A1 (en) | 2011-04-20 |
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