CN103369827B - 印制电路板 - Google Patents
印制电路板 Download PDFInfo
- Publication number
- CN103369827B CN103369827B CN201310301254.2A CN201310301254A CN103369827B CN 103369827 B CN103369827 B CN 103369827B CN 201310301254 A CN201310301254 A CN 201310301254A CN 103369827 B CN103369827 B CN 103369827B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- structure material
- hole
- electronic structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310301254.2A CN103369827B (zh) | 2013-07-18 | 2013-07-18 | 印制电路板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310301254.2A CN103369827B (zh) | 2013-07-18 | 2013-07-18 | 印制电路板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103369827A CN103369827A (zh) | 2013-10-23 |
CN103369827B true CN103369827B (zh) | 2017-05-17 |
Family
ID=49370052
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310301254.2A Active CN103369827B (zh) | 2013-07-18 | 2013-07-18 | 印制电路板 |
Country Status (1)
Country | Link |
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CN (1) | CN103369827B (zh) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN203399393U (zh) * | 2013-07-18 | 2014-01-15 | 上海华勤通讯技术有限公司 | 印制电路板 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW552839B (en) * | 2002-06-18 | 2003-09-11 | Phoenix Prec Technology Corp | Multi-layer circuit board through hole forming method and structure for integrated circuit package |
JP2004311919A (ja) * | 2003-02-21 | 2004-11-04 | Shinko Electric Ind Co Ltd | スルーホールフィル方法 |
US7834273B2 (en) * | 2005-07-07 | 2010-11-16 | Ibiden Co., Ltd. | Multilayer printed wiring board |
US8431833B2 (en) * | 2008-12-29 | 2013-04-30 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing the same |
US20110048775A1 (en) * | 2009-08-31 | 2011-03-03 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing the same |
US9049808B2 (en) * | 2010-08-21 | 2015-06-02 | Ibiden Co., Ltd. | Printed wiring board and a method of manufacturing a printed wiring board |
KR101167466B1 (ko) * | 2010-12-30 | 2012-07-26 | 삼성전기주식회사 | 다층 인쇄회로기판 그 제조방법 |
CN202551493U (zh) * | 2012-04-06 | 2012-11-21 | 百富计算机技术(深圳)有限公司 | 一种印刷线路板 |
-
2013
- 2013-07-18 CN CN201310301254.2A patent/CN103369827B/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN203399393U (zh) * | 2013-07-18 | 2014-01-15 | 上海华勤通讯技术有限公司 | 印制电路板 |
Also Published As
Publication number | Publication date |
---|---|
CN103369827A (zh) | 2013-10-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 201203 Building 1, 399 Zhangyuan Road, Zhangjiang, Pudong New Area, Shanghai Patentee after: HUAQIN TELECOM TECHNOLOGY Co.,Ltd. Address before: 201203 Building 1, 399 Zhangyuan Road, Zhangjiang, Pudong New Area, Shanghai Patentee before: SHANGHAI HUAQIN TELECOM TECHNOLOGY Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Building 1, No. 399 Keyuan Road, Zhangjiang hi tech park, Pudong New Area, Shanghai, 201203 Patentee after: Huaqin Technology Co.,Ltd. Address before: Building 1, No. 399 Keyuan Road, Zhangjiang hi tech park, Pudong New Area, Shanghai, 201203 Patentee before: Huaqin Technology Co.,Ltd. |
|
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: Building 1, No. 399 Keyuan Road, Zhangjiang hi tech park, Pudong New Area, Shanghai, 201203 Patentee after: Huaqin Technology Co.,Ltd. Address before: 201203 Building 1, 399 Zhangyuan Road, Zhangjiang, Pudong New Area, Shanghai Patentee before: HUAQIN TELECOM TECHNOLOGY Co.,Ltd. |