CN103369827A - 印制电路板 - Google Patents
印制电路板 Download PDFInfo
- Publication number
- CN103369827A CN103369827A CN2013103012542A CN201310301254A CN103369827A CN 103369827 A CN103369827 A CN 103369827A CN 2013103012542 A CN2013103012542 A CN 2013103012542A CN 201310301254 A CN201310301254 A CN 201310301254A CN 103369827 A CN103369827 A CN 103369827A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- via hole
- hole
- electronic structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Combinations Of Printed Boards (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310301254.2A CN103369827B (zh) | 2013-07-18 | 2013-07-18 | 印制电路板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310301254.2A CN103369827B (zh) | 2013-07-18 | 2013-07-18 | 印制电路板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103369827A true CN103369827A (zh) | 2013-10-23 |
CN103369827B CN103369827B (zh) | 2017-05-17 |
Family
ID=49370052
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310301254.2A Active CN103369827B (zh) | 2013-07-18 | 2013-07-18 | 印制电路板 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103369827B (zh) |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW552839B (en) * | 2002-06-18 | 2003-09-11 | Phoenix Prec Technology Corp | Multi-layer circuit board through hole forming method and structure for integrated circuit package |
JP2004311919A (ja) * | 2003-02-21 | 2004-11-04 | Shinko Electric Ind Co Ltd | スルーホールフィル方法 |
CN101069458A (zh) * | 2005-07-07 | 2007-11-07 | 揖斐电株式会社 | 多层印刷电路板 |
CN102265709A (zh) * | 2008-12-29 | 2011-11-30 | 揖斐电株式会社 | 印刷电路板及其制造方法 |
CN102378478A (zh) * | 2010-08-21 | 2012-03-14 | 揖斐电株式会社 | 印刷电路板和印刷电路板的制造方法 |
CN102484945A (zh) * | 2009-08-31 | 2012-05-30 | 揖斐电株式会社 | 印刷电路板及其制造方法 |
US20120168220A1 (en) * | 2010-12-30 | 2012-07-05 | Samsung Electro-Mechanics Co., Ltd. | Multi-layer printed circuit board and method of manufacturing the same |
CN202551493U (zh) * | 2012-04-06 | 2012-11-21 | 百富计算机技术(深圳)有限公司 | 一种印刷线路板 |
CN203399393U (zh) * | 2013-07-18 | 2014-01-15 | 上海华勤通讯技术有限公司 | 印制电路板 |
-
2013
- 2013-07-18 CN CN201310301254.2A patent/CN103369827B/zh active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW552839B (en) * | 2002-06-18 | 2003-09-11 | Phoenix Prec Technology Corp | Multi-layer circuit board through hole forming method and structure for integrated circuit package |
JP2004311919A (ja) * | 2003-02-21 | 2004-11-04 | Shinko Electric Ind Co Ltd | スルーホールフィル方法 |
CN101069458A (zh) * | 2005-07-07 | 2007-11-07 | 揖斐电株式会社 | 多层印刷电路板 |
CN102265709A (zh) * | 2008-12-29 | 2011-11-30 | 揖斐电株式会社 | 印刷电路板及其制造方法 |
CN102484945A (zh) * | 2009-08-31 | 2012-05-30 | 揖斐电株式会社 | 印刷电路板及其制造方法 |
CN102378478A (zh) * | 2010-08-21 | 2012-03-14 | 揖斐电株式会社 | 印刷电路板和印刷电路板的制造方法 |
US20120168220A1 (en) * | 2010-12-30 | 2012-07-05 | Samsung Electro-Mechanics Co., Ltd. | Multi-layer printed circuit board and method of manufacturing the same |
CN202551493U (zh) * | 2012-04-06 | 2012-11-21 | 百富计算机技术(深圳)有限公司 | 一种印刷线路板 |
CN203399393U (zh) * | 2013-07-18 | 2014-01-15 | 上海华勤通讯技术有限公司 | 印制电路板 |
Also Published As
Publication number | Publication date |
---|---|
CN103369827B (zh) | 2017-05-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8248091B2 (en) | Universal array type probe card design for semiconductor device testing | |
JP4775554B2 (ja) | Bga用lsiテストソケット | |
US20090050358A1 (en) | Electrical connector with elastomeric element | |
CN202889786U (zh) | 一种通过表面贴装方式互连的pcb板结构 | |
CN203661415U (zh) | 软硬电路板结合装置及手机相机模组 | |
US20140077833A1 (en) | Probe card and manufacturing method thereof | |
CN102869189B (zh) | 焊盘加固pcb板 | |
US20110203838A1 (en) | Electrical connector with solder columns | |
CN203399393U (zh) | 印制电路板 | |
CN101173973B (zh) | 柔性电路板的线路通断检测方法 | |
CN201315702Y (zh) | 焊盘结构以及印刷电路板 | |
JP2004347591A (ja) | 集積回路用プローブ・カード | |
CN103369827A (zh) | 印制电路板 | |
CN105764233A (zh) | 多层式电路板 | |
WO2018066540A1 (ja) | 異方導電性シート | |
CN205657915U (zh) | 防脱焊印制电路板 | |
CN206010249U (zh) | 一种pcb板焊接夹具 | |
TW200716994A (en) | Circuit board inspecting apparatus and circuit board inspecting method | |
CN206585848U (zh) | 夹具 | |
TWM524554U (zh) | 晶圓測試裝置 | |
TW200632328A (en) | Probe card interposer | |
TWM487434U (zh) | 具嵌埋式彈性導電元件之測試母板及其晶圓測試介面組件 | |
CN107976560A (zh) | 一种pcb板测试治具 | |
CN201066958Y (zh) | 印刷电路板 | |
CN208523048U (zh) | 一种新型线路板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 201203 Building 1, 399 Zhangyuan Road, Zhangjiang, Pudong New Area, Shanghai Patentee after: HUAQIN TELECOM TECHNOLOGY Co.,Ltd. Address before: 201203 Building 1, 399 Zhangyuan Road, Zhangjiang, Pudong New Area, Shanghai Patentee before: SHANGHAI HUAQIN TELECOM TECHNOLOGY Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Building 1, No. 399 Keyuan Road, Zhangjiang hi tech park, Pudong New Area, Shanghai, 201203 Patentee after: Huaqin Technology Co.,Ltd. Address before: Building 1, No. 399 Keyuan Road, Zhangjiang hi tech park, Pudong New Area, Shanghai, 201203 Patentee before: Huaqin Technology Co.,Ltd. |
|
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: Building 1, No. 399 Keyuan Road, Zhangjiang hi tech park, Pudong New Area, Shanghai, 201203 Patentee after: Huaqin Technology Co.,Ltd. Address before: 201203 Building 1, 399 Zhangyuan Road, Zhangjiang, Pudong New Area, Shanghai Patentee before: HUAQIN TELECOM TECHNOLOGY Co.,Ltd. |