CN102869189B - 焊盘加固pcb板 - Google Patents
焊盘加固pcb板 Download PDFInfo
- Publication number
- CN102869189B CN102869189B CN201210348261.3A CN201210348261A CN102869189B CN 102869189 B CN102869189 B CN 102869189B CN 201210348261 A CN201210348261 A CN 201210348261A CN 102869189 B CN102869189 B CN 102869189B
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- CN
- China
- Prior art keywords
- pad
- top layer
- pcb board
- layer pad
- paster
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201210348261.3A CN102869189B (zh) | 2012-09-18 | 2012-09-18 | 焊盘加固pcb板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210348261.3A CN102869189B (zh) | 2012-09-18 | 2012-09-18 | 焊盘加固pcb板 |
Publications (2)
Publication Number | Publication Date |
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CN102869189A CN102869189A (zh) | 2013-01-09 |
CN102869189B true CN102869189B (zh) | 2016-03-30 |
Family
ID=47447689
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201210348261.3A Active CN102869189B (zh) | 2012-09-18 | 2012-09-18 | 焊盘加固pcb板 |
Country Status (1)
Country | Link |
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CN (1) | CN102869189B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103857181A (zh) * | 2012-12-06 | 2014-06-11 | 华为终端有限公司 | Pcb板以及具有该pcb板的电子设备 |
CN105163482B (zh) * | 2015-08-31 | 2017-11-07 | 广东欧珀移动通信有限公司 | 一种印刷电路板 |
CN105163481A (zh) * | 2015-08-31 | 2015-12-16 | 广东欧珀移动通信有限公司 | 一种印刷电路板 |
CN105472879A (zh) * | 2016-01-12 | 2016-04-06 | 深圳市立洋光电子股份有限公司 | 一种alc pcb板的辅助焊接结构及其制备工艺 |
CN110996508A (zh) * | 2019-12-26 | 2020-04-10 | 新华三技术有限公司合肥分公司 | 电路板及其制作方法和电子设备 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100725838B1 (ko) * | 2006-06-02 | 2007-06-08 | 프롬써어티 주식회사 | 웨이퍼 테스트용 프로브 카드 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2824954A1 (fr) * | 2001-05-18 | 2002-11-22 | St Microelectronics Sa | Plot de connexion d'un circuit integre |
CN101336048A (zh) * | 2007-06-27 | 2008-12-31 | 英华达(上海)电子有限公司 | 一种柔性电路板加固定位方法与装置 |
CN201156865Y (zh) * | 2007-12-14 | 2008-11-26 | 天津太精电子有限公司 | 柔性印刷电路板fpc检测用夹具 |
CN201636581U (zh) * | 2010-01-20 | 2010-11-17 | 南京鑫伟斯特科技有限公司 | 层叠式led灯泡 |
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2012
- 2012-09-18 CN CN201210348261.3A patent/CN102869189B/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100725838B1 (ko) * | 2006-06-02 | 2007-06-08 | 프롬써어티 주식회사 | 웨이퍼 테스트용 프로브 카드 |
Also Published As
Publication number | Publication date |
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CN102869189A (zh) | 2013-01-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 201203 Shanghai city Pudong New Area Zhangjiang Keyuan Road No. 399 Building No. 1 Patentee after: HUAQIN TELECOM TECHNOLOGY Co.,Ltd. Address before: 201203 Shanghai city Pudong New Area Zhangjiang Keyuan Road No. 399 Building No. 1 Patentee before: SHANGHAI HUAQIN TELECOM TECHNOLOGY Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Building 1, No. 399 Keyuan Road, Zhangjiang hi tech park, Pudong New Area, Shanghai, 201203 Patentee after: Huaqin Technology Co.,Ltd. Address before: Building 1, No. 399 Keyuan Road, Zhangjiang hi tech park, Pudong New Area, Shanghai, 201203 Patentee before: Huaqin Technology Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
CP03 | Change of name, title or address |
Address after: Building 1, No. 399 Keyuan Road, Zhangjiang hi tech park, Pudong New Area, Shanghai, 201203 Patentee after: Huaqin Technology Co.,Ltd. Address before: 201203 Building 1, 399 Zhangyuan Road, Zhangjiang, Pudong New Area, Shanghai Patentee before: HUAQIN TELECOM TECHNOLOGY Co.,Ltd. |
|
CP03 | Change of name, title or address |