TW200632328A - Probe card interposer - Google Patents

Probe card interposer

Info

Publication number
TW200632328A
TW200632328A TW095108106A TW95108106A TW200632328A TW 200632328 A TW200632328 A TW 200632328A TW 095108106 A TW095108106 A TW 095108106A TW 95108106 A TW95108106 A TW 95108106A TW 200632328 A TW200632328 A TW 200632328A
Authority
TW
Taiwan
Prior art keywords
conductive
substrate
conductive bumps
interposer
probe card
Prior art date
Application number
TW095108106A
Other languages
Chinese (zh)
Other versions
TWI274165B (en
Inventor
An-Hong Liu
Yeong-Her Wang
Yao-Jung Lee
Original Assignee
Chipmos Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/076,935 external-priority patent/US20060091510A1/en
Application filed by Chipmos Technologies Inc filed Critical Chipmos Technologies Inc
Publication of TW200632328A publication Critical patent/TW200632328A/en
Application granted granted Critical
Publication of TWI274165B publication Critical patent/TWI274165B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

A probe card interposer includes a substrate with a plurality of conductive bumps disposed on first surface of the substrate. Each conductive bump comprises a dielectric core and a plurality of conductive leads. The suspended ends of the conductive leads extend toward the centers of the corresponding dielectric cores and are elastically supported by the corresponding dielectric cores. Therefore, the interposer can be installed between a probe head and a multi-layer PCB to make good electrical contacts to the probe head through the conductive bumps. In the embodiment, a plurality of symmetric conductive bumps are disposed on second surface of the substrate and are electrically connected to the conductive bumps on first surface of the substrate through vias or conductive posts. The conductive bumps can electrically contact the multi-layer PCB.
TW95108106A 2005-03-11 2006-03-10 Probe card interposer TWI274165B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/076,935 US20060091510A1 (en) 2004-03-11 2005-03-11 Probe card interposer

Publications (2)

Publication Number Publication Date
TW200632328A true TW200632328A (en) 2006-09-16
TWI274165B TWI274165B (en) 2007-02-21

Family

ID=36994274

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95108106A TWI274165B (en) 2005-03-11 2006-03-10 Probe card interposer

Country Status (2)

Country Link
CN (1) CN1832122A (en)
TW (1) TWI274165B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8330481B2 (en) * 2007-07-02 2012-12-11 Jae Ha Lee Probe assembly and manufacturing method thereof
TWI392872B (en) * 2009-04-10 2013-04-11 Chipmos Technologies Inc Probe card assembly and probe holder thereof
JP2013102035A (en) * 2011-11-08 2013-05-23 Ngk Spark Plug Co Ltd Ceramic substrate and manufacturing method thereof

Also Published As

Publication number Publication date
CN1832122A (en) 2006-09-13
TWI274165B (en) 2007-02-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees