TW200632328A - Probe card interposer - Google Patents
Probe card interposerInfo
- Publication number
- TW200632328A TW200632328A TW095108106A TW95108106A TW200632328A TW 200632328 A TW200632328 A TW 200632328A TW 095108106 A TW095108106 A TW 095108106A TW 95108106 A TW95108106 A TW 95108106A TW 200632328 A TW200632328 A TW 200632328A
- Authority
- TW
- Taiwan
- Prior art keywords
- conductive
- substrate
- conductive bumps
- interposer
- probe card
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
A probe card interposer includes a substrate with a plurality of conductive bumps disposed on first surface of the substrate. Each conductive bump comprises a dielectric core and a plurality of conductive leads. The suspended ends of the conductive leads extend toward the centers of the corresponding dielectric cores and are elastically supported by the corresponding dielectric cores. Therefore, the interposer can be installed between a probe head and a multi-layer PCB to make good electrical contacts to the probe head through the conductive bumps. In the embodiment, a plurality of symmetric conductive bumps are disposed on second surface of the substrate and are electrically connected to the conductive bumps on first surface of the substrate through vias or conductive posts. The conductive bumps can electrically contact the multi-layer PCB.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/076,935 US20060091510A1 (en) | 2004-03-11 | 2005-03-11 | Probe card interposer |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200632328A true TW200632328A (en) | 2006-09-16 |
TWI274165B TWI274165B (en) | 2007-02-21 |
Family
ID=36994274
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW95108106A TWI274165B (en) | 2005-03-11 | 2006-03-10 | Probe card interposer |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN1832122A (en) |
TW (1) | TWI274165B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8330481B2 (en) * | 2007-07-02 | 2012-12-11 | Jae Ha Lee | Probe assembly and manufacturing method thereof |
TWI392872B (en) * | 2009-04-10 | 2013-04-11 | Chipmos Technologies Inc | Probe card assembly and probe holder thereof |
JP2013102035A (en) * | 2011-11-08 | 2013-05-23 | Ngk Spark Plug Co Ltd | Ceramic substrate and manufacturing method thereof |
-
2005
- 2005-09-09 CN CN 200510098693 patent/CN1832122A/en active Pending
-
2006
- 2006-03-10 TW TW95108106A patent/TWI274165B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN1832122A (en) | 2006-09-13 |
TWI274165B (en) | 2007-02-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |