MXPA03000958A - Aleacion de cobre que contiene plata. - Google Patents
Aleacion de cobre que contiene plata.Info
- Publication number
- MXPA03000958A MXPA03000958A MXPA03000958A MXPA03000958A MXPA03000958A MX PA03000958 A MXPA03000958 A MX PA03000958A MX PA03000958 A MXPA03000958 A MX PA03000958A MX PA03000958 A MXPA03000958 A MX PA03000958A MX PA03000958 A MXPA03000958 A MX PA03000958A
- Authority
- MX
- Mexico
- Prior art keywords
- alloy
- excess
- forming
- copper
- copper alloy
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Conductive Materials (AREA)
- Adornments (AREA)
- Contacts (AREA)
- Laminated Bodies (AREA)
- Extrusion Of Metal (AREA)
- Wire Processing (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Dental Preparations (AREA)
Abstract
Una aleacion de cobre que consiste esencialmente de, en peso, de 0.15% a 0.7% de cromo, de 0.005% a 0.3% de plata, de 0.01% a 0.15% de titanio, de 0.01% a 0.10% de silicio, hasta 0.2% de hierro, hasta 0.5% de estano, y el resto es cobre e impurezas inevitables, tiene una resistencia alta, un limite elastico superior a 552 MPa y una conductividad electrica alta superior a 80% IACS. La aleacion tiene ademas caracteristicas de flexion sustancialmente isotropica cuando la ruta de procesamiento incluye un recocido con calor por solubilizacion (14) superior a 850degree C y laminado en frio posterior (20) en hoja, banda de lamina, intercalados con recocido por campana (22). Como resultado, la aleacion es particularmente adecuada para conformar en conectores electricos de tipo caja, tanto para aplicaciones automotrices como para aplicaciones de multimedia. Asimismo, la aleacion es adecuada para conformar en una varilla, alambre o seccion.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US22405400P | 2000-08-09 | 2000-08-09 | |
PCT/US2001/024854 WO2002012583A1 (en) | 2000-08-09 | 2001-08-07 | Silver containing copper alloy |
Publications (1)
Publication Number | Publication Date |
---|---|
MXPA03000958A true MXPA03000958A (es) | 2004-08-02 |
Family
ID=22839111
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MXPA03000958A MXPA03000958A (es) | 2000-08-09 | 2001-08-07 | Aleacion de cobre que contiene plata. |
Country Status (16)
Country | Link |
---|---|
US (2) | US6749699B2 (es) |
EP (1) | EP1179606B1 (es) |
JP (2) | JP2002180159A (es) |
KR (1) | KR100842726B1 (es) |
CN (2) | CN101012519A (es) |
AT (1) | ATE252651T1 (es) |
AU (1) | AU2001284756A1 (es) |
CA (1) | CA2416574C (es) |
DE (1) | DE60101026T2 (es) |
ES (1) | ES2204790T3 (es) |
HK (1) | HK1042732B (es) |
HU (2) | HU228707B1 (es) |
MX (1) | MXPA03000958A (es) |
PL (1) | PL196643B1 (es) |
TW (1) | TWI237665B (es) |
WO (1) | WO2002012583A1 (es) |
Families Citing this family (58)
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CN101724798B (zh) * | 2009-12-22 | 2011-04-20 | 浙江大学 | 一种Cu-12%Fe合金的复合热处理方法 |
KR101185548B1 (ko) * | 2010-02-24 | 2012-09-24 | 주식회사 풍산 | 고강도, 고전도성 동합금 및 그 제조방법 |
CN101812651A (zh) * | 2010-04-15 | 2010-08-25 | 中南大学 | 一种细化析出或弥散强化型铜合金板带晶粒的方法 |
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JP6265582B2 (ja) * | 2011-12-22 | 2018-01-24 | 古河電気工業株式会社 | 銅合金材およびその製造方法 |
JP5802150B2 (ja) * | 2012-02-24 | 2015-10-28 | 株式会社神戸製鋼所 | 銅合金 |
CN104169447B (zh) * | 2012-07-02 | 2017-03-01 | 古河电气工业株式会社 | 铜合金线材及其制造方法 |
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CN107377657A (zh) * | 2017-06-14 | 2017-11-24 | 绍兴市力博电气有限公司 | 一种磁极线圈用铜材及其生产方法 |
KR102641049B1 (ko) * | 2017-08-10 | 2024-02-27 | 다나카 기킨조쿠 고교 가부시키가이샤 | 고강도·고도전성 구리 합금 판재 및 그 제조 방법 |
CN107755451B (zh) * | 2017-09-30 | 2019-02-12 | 重庆鸽牌电线电缆有限公司 | 大容量调相机用含银铜排的制备方法 |
CN107739878B (zh) * | 2017-11-23 | 2019-10-18 | 全南晶环科技有限责任公司 | 一种高强高导抗软化铜合金及其制备方法 |
CN109226323A (zh) * | 2018-09-11 | 2019-01-18 | 安徽楚江科技新材料股份有限公司 | 一种极耳铜带的冷轧热处理工艺 |
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CN113950535A (zh) * | 2019-04-12 | 2022-01-18 | 万腾荣公司 | 具有高强度和高电导率的铜合金以及制造这种铜合金的方法 |
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JP3800279B2 (ja) | 1998-08-31 | 2006-07-26 | 株式会社神戸製鋼所 | プレス打抜き性が優れた銅合金板 |
US6471792B1 (en) | 1998-11-16 | 2002-10-29 | Olin Corporation | Stress relaxation resistant brass |
US6241831B1 (en) | 1999-06-07 | 2001-06-05 | Waterbury Rolling Mills, Inc. | Copper alloy |
-
2001
- 2001-08-06 US US09/923,137 patent/US6749699B2/en not_active Expired - Lifetime
- 2001-08-07 CN CNA2007100054340A patent/CN101012519A/zh active Pending
- 2001-08-07 PL PL365670A patent/PL196643B1/pl unknown
- 2001-08-07 CA CA2416574A patent/CA2416574C/en not_active Expired - Lifetime
- 2001-08-07 MX MXPA03000958A patent/MXPA03000958A/es active IP Right Grant
- 2001-08-07 KR KR1020037001373A patent/KR100842726B1/ko active IP Right Grant
- 2001-08-07 HU HU0600421A patent/HU228707B1/hu unknown
- 2001-08-07 AU AU2001284756A patent/AU2001284756A1/en not_active Abandoned
- 2001-08-07 CN CNB018130291A patent/CN1302145C/zh not_active Expired - Lifetime
- 2001-08-07 HU HU0300498A patent/HU227988B1/hu unknown
- 2001-08-07 WO PCT/US2001/024854 patent/WO2002012583A1/en active Application Filing
- 2001-08-08 DE DE60101026T patent/DE60101026T2/de not_active Expired - Lifetime
- 2001-08-08 ES ES01119160T patent/ES2204790T3/es not_active Expired - Lifetime
- 2001-08-08 TW TW090119333A patent/TWI237665B/zh not_active IP Right Cessation
- 2001-08-08 EP EP01119160A patent/EP1179606B1/en not_active Expired - Lifetime
- 2001-08-08 AT AT01119160T patent/ATE252651T1/de not_active IP Right Cessation
- 2001-08-08 JP JP2001275764A patent/JP2002180159A/ja active Pending
-
2002
- 2002-06-17 HK HK02104488.9A patent/HK1042732B/zh not_active IP Right Cessation
-
2004
- 2004-02-19 US US10/782,019 patent/US20040159379A1/en not_active Abandoned
-
2007
- 2007-10-15 JP JP2007268003A patent/JP5847987B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
ATE252651T1 (de) | 2003-11-15 |
EP1179606B1 (en) | 2003-10-22 |
DE60101026T2 (de) | 2004-04-22 |
ES2204790T3 (es) | 2004-05-01 |
HUP0300498A3 (en) | 2005-04-28 |
AU2001284756A1 (en) | 2002-02-18 |
WO2002012583A1 (en) | 2002-02-14 |
HK1042732A1 (en) | 2002-08-23 |
KR100842726B1 (ko) | 2008-07-01 |
HK1042732B (zh) | 2004-04-23 |
CN1455823A (zh) | 2003-11-12 |
HU228707B1 (en) | 2013-05-28 |
JP2008057046A (ja) | 2008-03-13 |
DE60101026D1 (de) | 2003-11-27 |
CA2416574A1 (en) | 2002-02-14 |
EP1179606A3 (en) | 2002-08-14 |
PL365670A1 (en) | 2005-01-10 |
JP5847987B2 (ja) | 2016-01-27 |
KR20030031139A (ko) | 2003-04-18 |
HU227988B1 (en) | 2012-07-30 |
CN1302145C (zh) | 2007-02-28 |
EP1179606A2 (en) | 2002-02-13 |
TWI237665B (en) | 2005-08-11 |
CN101012519A (zh) | 2007-08-08 |
JP2002180159A (ja) | 2002-06-26 |
US6749699B2 (en) | 2004-06-15 |
US20020039542A1 (en) | 2002-04-04 |
PL196643B1 (pl) | 2008-01-31 |
US20040159379A1 (en) | 2004-08-19 |
CA2416574C (en) | 2011-05-31 |
HUP0300498A2 (hu) | 2003-09-29 |
HU0600421D0 (en) | 2006-07-28 |
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