JPH0380858B2 - - Google Patents
Info
- Publication number
- JPH0380858B2 JPH0380858B2 JP62035325A JP3532587A JPH0380858B2 JP H0380858 B2 JPH0380858 B2 JP H0380858B2 JP 62035325 A JP62035325 A JP 62035325A JP 3532587 A JP3532587 A JP 3532587A JP H0380858 B2 JPH0380858 B2 JP H0380858B2
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- relay
- content
- conductivity
- thermal creep
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000881 Cu alloy Inorganic materials 0.000 description 17
- 239000000463 material Substances 0.000 description 15
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000000956 alloy Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 239000010949 copper Substances 0.000 description 6
- 229910001369 Brass Inorganic materials 0.000 description 4
- 239000010951 brass Substances 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- FHTCLMVMBMJAEE-UHFFFAOYSA-N bis($l^{2}-silanylidene)manganese Chemical compound [Si]=[Mn]=[Si] FHTCLMVMBMJAEE-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 238000009749 continuous casting Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
- H01H1/025—Composite material having copper as the basic material
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Composite Materials (AREA)
- Materials Engineering (AREA)
- Contacts (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62035325A JPS63203738A (ja) | 1987-02-18 | 1987-02-18 | Ｃｕ合金製電気機器用リレー材 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62035325A JPS63203738A (ja) | 1987-02-18 | 1987-02-18 | Ｃｕ合金製電気機器用リレー材 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3197088A Division JPH05247564A (ja) | 1991-07-11 | 1991-07-11 | Ｃｕ合金製電気機器用スイッチ材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63203738A JPS63203738A (ja) | 1988-08-23 |
| JPH0380858B2 true JPH0380858B2 (es) | 1991-12-26 |
Family
ID=12438665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62035325A Granted JPS63203738A (ja) | 1987-02-18 | 1987-02-18 | Ｃｕ合金製電気機器用リレー材 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63203738A (es) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9587299B2 (en) | 2011-10-28 | 2017-03-07 | Mitsubishi Materials Corporation | Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, rolled copper alloy material for electronic equipment, and part for electronic equipment |
| US10032536B2 (en) | 2010-05-14 | 2018-07-24 | Mitsubishi Materials Corporation | Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device |
| US10153063B2 (en) | 2011-11-07 | 2018-12-11 | Mitsubishi Materials Corporation | Copper alloy for electronic devices, method of manufacturing copper alloy for electronic devices, copper alloy plastic working material for electronic devices, and component for electronic devices |
| US10458003B2 (en) | 2011-11-14 | 2019-10-29 | Mitsubishi Materials Corporation | Copper alloy and copper alloy forming material |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6452034A (en) * | 1987-08-19 | 1989-02-28 | Mitsubishi Electric Corp | Copper alloy for terminal and connector |
| JP4516154B1 (ja) * | 2009-12-23 | 2010-08-04 | 三菱伸銅株式会社 | Ｃｕ−Ｍｇ−Ｐ系銅合金条材及びその製造方法 |
| JP4563508B1 (ja) * | 2010-02-24 | 2010-10-13 | 三菱伸銅株式会社 | Ｃｕ−Ｍｇ−Ｐ系銅合金条材及びその製造方法 |
| JP5054160B2 (ja) * | 2010-06-28 | 2012-10-24 | 三菱伸銅株式会社 | Ｃｕ−Ｍｇ−Ｐ系銅合金条材及びその製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4910894A (es) * | 1972-05-31 | 1974-01-30 |
-
1987
- 1987-02-18 JP JP62035325A patent/JPS63203738A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4910894A (es) * | 1972-05-31 | 1974-01-30 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10032536B2 (en) | 2010-05-14 | 2018-07-24 | Mitsubishi Materials Corporation | Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device |
| US10056165B2 (en) | 2010-05-14 | 2018-08-21 | Mitsubishi Materials Corporation | Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device |
| US9587299B2 (en) | 2011-10-28 | 2017-03-07 | Mitsubishi Materials Corporation | Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, rolled copper alloy material for electronic equipment, and part for electronic equipment |
| US10153063B2 (en) | 2011-11-07 | 2018-12-11 | Mitsubishi Materials Corporation | Copper alloy for electronic devices, method of manufacturing copper alloy for electronic devices, copper alloy plastic working material for electronic devices, and component for electronic devices |
| US10458003B2 (en) | 2011-11-14 | 2019-10-29 | Mitsubishi Materials Corporation | Copper alloy and copper alloy forming material |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63203738A (ja) | 1988-08-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |