AU2001284756A1 - Silver containing copper alloy - Google Patents
Silver containing copper alloyInfo
- Publication number
- AU2001284756A1 AU2001284756A1 AU2001284756A AU8475601A AU2001284756A1 AU 2001284756 A1 AU2001284756 A1 AU 2001284756A1 AU 2001284756 A AU2001284756 A AU 2001284756A AU 8475601 A AU8475601 A AU 8475601A AU 2001284756 A1 AU2001284756 A1 AU 2001284756A1
- Authority
- AU
- Australia
- Prior art keywords
- alloy
- excess
- forming
- copper alloy
- containing copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Thermal Sciences (AREA)
- Physics & Mathematics (AREA)
- Conductive Materials (AREA)
- Contacts (AREA)
- Adornments (AREA)
- Laminated Bodies (AREA)
- Extrusion Of Metal (AREA)
- Dental Preparations (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Wire Processing (AREA)
Abstract
A copper alloy that consists essentially of, by weight, from 0.15% to 0.7% of chromium, from 0.005% to 0.3% of silver, from 0.01% to 0.15% of titanium, from 0.01% to 0.10% of silicon, up to 0.2% of iron, up to 0.5% of tin, and the balance copper and inevitable impurities has high strength, a yield strength in excess of 552 MPa, and high electrical conductivity, in excess of 80% IACS. The alloy further has substantially isotropic bend characteristics when the processing route includes a solution heat anneal (14) above 850 DEG C and subsequent cold rolling (20) into sheet, strip or foil interspersed by bell annealing (22). As a result, the alloy is particularly suited for forming into box-type electrical connectors for both automotive or multimedia applications. The alloy is also suitable for forming into a rod, wire or section. <IMAGE>
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US22405400P | 2000-08-09 | 2000-08-09 | |
US60224054 | 2000-08-09 | ||
PCT/US2001/024854 WO2002012583A1 (en) | 2000-08-09 | 2001-08-07 | Silver containing copper alloy |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001284756A1 true AU2001284756A1 (en) | 2002-02-18 |
Family
ID=22839111
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001284756A Abandoned AU2001284756A1 (en) | 2000-08-09 | 2001-08-07 | Silver containing copper alloy |
Country Status (16)
Country | Link |
---|---|
US (2) | US6749699B2 (en) |
EP (1) | EP1179606B1 (en) |
JP (2) | JP2002180159A (en) |
KR (1) | KR100842726B1 (en) |
CN (2) | CN1302145C (en) |
AT (1) | ATE252651T1 (en) |
AU (1) | AU2001284756A1 (en) |
CA (1) | CA2416574C (en) |
DE (1) | DE60101026T2 (en) |
ES (1) | ES2204790T3 (en) |
HK (1) | HK1042732B (en) |
HU (2) | HU227988B1 (en) |
MX (1) | MXPA03000958A (en) |
PL (1) | PL196643B1 (en) |
TW (1) | TWI237665B (en) |
WO (1) | WO2002012583A1 (en) |
Families Citing this family (59)
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US7696092B2 (en) * | 2001-11-26 | 2010-04-13 | Globalfoundries Inc. | Method of using ternary copper alloy to obtain a low resistance and large grain size interconnect |
US6703308B1 (en) | 2001-11-26 | 2004-03-09 | Advanced Micro Devices, Inc. | Method of inserting alloy elements to reduce copper diffusion and bulk diffusion |
US6703307B2 (en) | 2001-11-26 | 2004-03-09 | Advanced Micro Devices, Inc. | Method of implantation after copper seed deposition |
US6835655B1 (en) | 2001-11-26 | 2004-12-28 | Advanced Micro Devices, Inc. | Method of implanting copper barrier material to improve electrical performance |
US6861349B1 (en) | 2002-05-15 | 2005-03-01 | Advanced Micro Devices, Inc. | Method of forming an adhesion layer with an element reactive with a barrier layer |
AU2003272276A1 (en) * | 2002-09-13 | 2004-04-30 | Olin Corporation | Age-hardening copper-base alloy and processing |
JP2004353011A (en) * | 2003-05-27 | 2004-12-16 | Ykk Corp | Electrode material and manufacturing method therefor |
US7169706B2 (en) * | 2003-10-16 | 2007-01-30 | Advanced Micro Devices, Inc. | Method of using an adhesion precursor layer for chemical vapor deposition (CVD) copper deposition |
CN1293212C (en) * | 2004-02-23 | 2007-01-03 | 西安交通大学 | Alloy of copper |
JP4524471B2 (en) * | 2004-08-30 | 2010-08-18 | Dowaメタルテック株式会社 | Copper alloy foil and manufacturing method thereof |
US20060086437A1 (en) * | 2004-10-22 | 2006-04-27 | Russell Nippert | Method for manufacturing copper alloys |
DE102007001525A1 (en) * | 2007-01-10 | 2008-07-17 | Gustav Klauke Gmbh | Cable lug, has pipe section-outer surface with point angle that amounts to preset degree, where lug is made of copper material, which exhibits chromium, silver, iron, and titanium as alloy element, and is nickel-plated |
KR100797682B1 (en) * | 2007-02-07 | 2008-01-23 | 삼성전기주식회사 | Method for manufacturing printed circuit board |
US20100294534A1 (en) * | 2007-11-01 | 2010-11-25 | The Furukawa Electric Co., Ltd. | Conductor wire for electronic apparatus and electrical wire for wiring using the same |
JP4974197B2 (en) * | 2009-08-28 | 2012-07-11 | 古河電気工業株式会社 | Copper material for sputtering target and method for producing the same |
WO2011034127A1 (en) * | 2009-09-18 | 2011-03-24 | 古河電気工業株式会社 | Copper material for use as sputtering target and process for producing same |
US20110123643A1 (en) * | 2009-11-24 | 2011-05-26 | Biersteker Robert A | Copper alloy enclosures |
CN101724798B (en) * | 2009-12-22 | 2011-04-20 | 浙江大学 | Multiplex heat treatment method for Cu-12 percent Fe alloy |
KR101185548B1 (en) * | 2010-02-24 | 2012-09-24 | 주식회사 풍산 | Copper alloy having high strength and high conductivity, and method for manufacture the same |
CN101812651A (en) * | 2010-04-15 | 2010-08-25 | 中南大学 | Method for refining grains of precipitation- or dispersion-strengthened copper alloy plate strip |
US8821655B1 (en) * | 2010-12-02 | 2014-09-02 | Fisk Alloy Inc. | High strength, high conductivity copper alloys and electrical conductors made therefrom |
JP5818724B2 (en) * | 2011-03-29 | 2015-11-18 | 株式会社神戸製鋼所 | Copper alloy material for electric and electronic parts, copper alloy material for plated electric and electronic parts |
TWI571518B (en) * | 2011-08-29 | 2017-02-21 | Furukawa Electric Co Ltd | Copper alloy material and manufacturing method thereof |
CN102383078B (en) * | 2011-11-10 | 2013-07-24 | 中色(宁夏)东方集团有限公司 | Preparation method of high-strength and high-conductivity beryllium copper alloy |
JP6265582B2 (en) * | 2011-12-22 | 2018-01-24 | 古河電気工業株式会社 | Copper alloy material and method for producing the same |
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JP2016211054A (en) * | 2015-05-12 | 2016-12-15 | 株式会社神戸製鋼所 | Copper alloy |
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CN107377657A (en) * | 2017-06-14 | 2017-11-24 | 绍兴市力博电气有限公司 | A kind of pole coil copper material and its production method |
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WO2020210444A1 (en) * | 2019-04-12 | 2020-10-15 | Materion Corporation | Copper alloys with high strength and high conductivity, and processes for making such copper alloys |
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CN111690838B (en) * | 2020-06-22 | 2021-10-15 | 宁波金田铜业(集团)股份有限公司 | Easily-wound transformer-used red copper strip and preparation method thereof |
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-
2001
- 2001-08-06 US US09/923,137 patent/US6749699B2/en not_active Expired - Lifetime
- 2001-08-07 HU HU0300498A patent/HU227988B1/en unknown
- 2001-08-07 WO PCT/US2001/024854 patent/WO2002012583A1/en active Application Filing
- 2001-08-07 MX MXPA03000958A patent/MXPA03000958A/en active IP Right Grant
- 2001-08-07 CN CNB018130291A patent/CN1302145C/en not_active Expired - Lifetime
- 2001-08-07 CN CNA2007100054340A patent/CN101012519A/en active Pending
- 2001-08-07 PL PL365670A patent/PL196643B1/en unknown
- 2001-08-07 CA CA2416574A patent/CA2416574C/en not_active Expired - Lifetime
- 2001-08-07 HU HU0600421A patent/HU228707B1/en unknown
- 2001-08-07 KR KR1020037001373A patent/KR100842726B1/en active IP Right Grant
- 2001-08-07 AU AU2001284756A patent/AU2001284756A1/en not_active Abandoned
- 2001-08-08 AT AT01119160T patent/ATE252651T1/en not_active IP Right Cessation
- 2001-08-08 DE DE60101026T patent/DE60101026T2/en not_active Expired - Lifetime
- 2001-08-08 TW TW090119333A patent/TWI237665B/en not_active IP Right Cessation
- 2001-08-08 EP EP01119160A patent/EP1179606B1/en not_active Expired - Lifetime
- 2001-08-08 ES ES01119160T patent/ES2204790T3/en not_active Expired - Lifetime
- 2001-08-08 JP JP2001275764A patent/JP2002180159A/en active Pending
-
2002
- 2002-06-17 HK HK02104488.9A patent/HK1042732B/en not_active IP Right Cessation
-
2004
- 2004-02-19 US US10/782,019 patent/US20040159379A1/en not_active Abandoned
-
2007
- 2007-10-15 JP JP2007268003A patent/JP5847987B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
ATE252651T1 (en) | 2003-11-15 |
CA2416574A1 (en) | 2002-02-14 |
PL196643B1 (en) | 2008-01-31 |
KR20030031139A (en) | 2003-04-18 |
KR100842726B1 (en) | 2008-07-01 |
PL365670A1 (en) | 2005-01-10 |
EP1179606A3 (en) | 2002-08-14 |
HU227988B1 (en) | 2012-07-30 |
US20040159379A1 (en) | 2004-08-19 |
HUP0300498A2 (en) | 2003-09-29 |
ES2204790T3 (en) | 2004-05-01 |
JP5847987B2 (en) | 2016-01-27 |
JP2008057046A (en) | 2008-03-13 |
CA2416574C (en) | 2011-05-31 |
US6749699B2 (en) | 2004-06-15 |
CN101012519A (en) | 2007-08-08 |
WO2002012583A1 (en) | 2002-02-14 |
HUP0300498A3 (en) | 2005-04-28 |
DE60101026T2 (en) | 2004-04-22 |
EP1179606A2 (en) | 2002-02-13 |
CN1455823A (en) | 2003-11-12 |
HU228707B1 (en) | 2013-05-28 |
CN1302145C (en) | 2007-02-28 |
DE60101026D1 (en) | 2003-11-27 |
EP1179606B1 (en) | 2003-10-22 |
MXPA03000958A (en) | 2004-08-02 |
US20020039542A1 (en) | 2002-04-04 |
HU0600421D0 (en) | 2006-07-28 |
HK1042732A1 (en) | 2002-08-23 |
HK1042732B (en) | 2004-04-23 |
TWI237665B (en) | 2005-08-11 |
JP2002180159A (en) | 2002-06-26 |
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