AU2001284756A1 - Silver containing copper alloy - Google Patents

Silver containing copper alloy

Info

Publication number
AU2001284756A1
AU2001284756A1 AU2001284756A AU8475601A AU2001284756A1 AU 2001284756 A1 AU2001284756 A1 AU 2001284756A1 AU 2001284756 A AU2001284756 A AU 2001284756A AU 8475601 A AU8475601 A AU 8475601A AU 2001284756 A1 AU2001284756 A1 AU 2001284756A1
Authority
AU
Australia
Prior art keywords
alloy
excess
forming
copper alloy
containing copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001284756A
Inventor
Dr Andreas Bogel
John F. Breedis
Ronald N. Caron
Hans-Achim Kuhn
Jorg Seeger
Derek E. Tyler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wieland Werke AG
Olin Corp
Original Assignee
Wieland Werke AG
Olin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wieland Werke AG, Olin Corp filed Critical Wieland Werke AG
Publication of AU2001284756A1 publication Critical patent/AU2001284756A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Conductive Materials (AREA)
  • Contacts (AREA)
  • Adornments (AREA)
  • Laminated Bodies (AREA)
  • Extrusion Of Metal (AREA)
  • Dental Preparations (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Processing (AREA)

Abstract

A copper alloy that consists essentially of, by weight, from 0.15% to 0.7% of chromium, from 0.005% to 0.3% of silver, from 0.01% to 0.15% of titanium, from 0.01% to 0.10% of silicon, up to 0.2% of iron, up to 0.5% of tin, and the balance copper and inevitable impurities has high strength, a yield strength in excess of 552 MPa, and high electrical conductivity, in excess of 80% IACS. The alloy further has substantially isotropic bend characteristics when the processing route includes a solution heat anneal (14) above 850 DEG C and subsequent cold rolling (20) into sheet, strip or foil interspersed by bell annealing (22). As a result, the alloy is particularly suited for forming into box-type electrical connectors for both automotive or multimedia applications. The alloy is also suitable for forming into a rod, wire or section. <IMAGE>
AU2001284756A 2000-08-09 2001-08-07 Silver containing copper alloy Abandoned AU2001284756A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US22405400P 2000-08-09 2000-08-09
US60224054 2000-08-09
PCT/US2001/024854 WO2002012583A1 (en) 2000-08-09 2001-08-07 Silver containing copper alloy

Publications (1)

Publication Number Publication Date
AU2001284756A1 true AU2001284756A1 (en) 2002-02-18

Family

ID=22839111

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001284756A Abandoned AU2001284756A1 (en) 2000-08-09 2001-08-07 Silver containing copper alloy

Country Status (16)

Country Link
US (2) US6749699B2 (en)
EP (1) EP1179606B1 (en)
JP (2) JP2002180159A (en)
KR (1) KR100842726B1 (en)
CN (2) CN1302145C (en)
AT (1) ATE252651T1 (en)
AU (1) AU2001284756A1 (en)
CA (1) CA2416574C (en)
DE (1) DE60101026T2 (en)
ES (1) ES2204790T3 (en)
HK (1) HK1042732B (en)
HU (2) HU227988B1 (en)
MX (1) MXPA03000958A (en)
PL (1) PL196643B1 (en)
TW (1) TWI237665B (en)
WO (1) WO2002012583A1 (en)

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JP6611222B2 (en) * 2015-02-24 2019-11-27 株式会社神戸製鋼所 Copper alloy plate for electric and electronic parts having high strength, high conductivity and excellent stress relaxation characteristics, and method for producing the same
JP6359758B2 (en) 2015-03-23 2018-07-18 株式会社東芝 Permanent magnets, motors, and generators
JP2016211054A (en) * 2015-05-12 2016-12-15 株式会社神戸製鋼所 Copper alloy
CN105349819B (en) * 2015-11-26 2017-11-28 山西春雷铜材有限责任公司 A kind of preparation method of copper alloy with high strength and high conductivity strip
CN107716885B (en) * 2016-08-12 2019-09-10 北京科技大学 A kind of copper alloy with high strength and high conductivity band short-flow production method
KR102075199B1 (en) * 2017-03-31 2020-02-07 주식회사 솔루에타 Method for Manufacturing Copper Alloy and Ultra Thin Foil Using the Same
CN107377657A (en) * 2017-06-14 2017-11-24 绍兴市力博电气有限公司 A kind of pole coil copper material and its production method
WO2019031612A1 (en) * 2017-08-10 2019-02-14 田中貴金属工業株式会社 High strength/highly conductive copper alloy plate material and method for producing same
CN107755451B (en) * 2017-09-30 2019-02-12 重庆鸽牌电线电缆有限公司 The preparation method of large capacity phase modifier argentiferous copper bar
CN107739878B (en) * 2017-11-23 2019-10-18 全南晶环科技有限责任公司 A kind of anti-softening copper alloy of high-strength highly-conductive and preparation method thereof
CN109226323A (en) * 2018-09-11 2019-01-18 安徽楚江科技新材料股份有限公司 A kind of cold rolling heat treatment process of tab copper strips
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WO2020210444A1 (en) * 2019-04-12 2020-10-15 Materion Corporation Copper alloys with high strength and high conductivity, and processes for making such copper alloys
CN111014286B (en) * 2019-12-12 2022-04-26 西安圣泰金属材料有限公司 Preparation method of titanium alloy wire with high torsion performance based on texture regulation
CN111118335B (en) * 2020-01-17 2022-04-08 河北中泊防爆工具集团股份有限公司 Titanium bronze alloy material and preparation method and application thereof
CN111690838B (en) * 2020-06-22 2021-10-15 宁波金田铜业(集团)股份有限公司 Easily-wound transformer-used red copper strip and preparation method thereof
CN111996411B (en) * 2020-07-15 2021-11-30 宁波博威合金板带有限公司 High-strength high-conductivity copper alloy material and preparation method and application thereof
CN112322917A (en) * 2020-10-16 2021-02-05 山西春雷铜材有限责任公司 Preparation method of Cu-Cr-Si-Ti copper alloy plate strip
CN112680623A (en) * 2021-01-08 2021-04-20 北京中超伟业信息安全技术股份有限公司 Low-radiation high-strength high-conductivity copper alloy wire and preparation method and application thereof
CN113913642B (en) * 2021-09-26 2022-07-05 宁波博威合金板带有限公司 Copper alloy strip and preparation method thereof
CN114507830A (en) * 2022-01-20 2022-05-17 浙江力博实业股份有限公司 Manufacturing method of high-strength high-conductivity copper-chromium-silver alloy
CN115171973B (en) * 2022-06-30 2023-03-03 上海超导科技股份有限公司 Copper-silver alloy reinforced superconducting tape, reinforcing method and superconducting coil
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Also Published As

Publication number Publication date
ATE252651T1 (en) 2003-11-15
CA2416574A1 (en) 2002-02-14
PL196643B1 (en) 2008-01-31
KR20030031139A (en) 2003-04-18
KR100842726B1 (en) 2008-07-01
PL365670A1 (en) 2005-01-10
EP1179606A3 (en) 2002-08-14
HU227988B1 (en) 2012-07-30
US20040159379A1 (en) 2004-08-19
HUP0300498A2 (en) 2003-09-29
ES2204790T3 (en) 2004-05-01
JP5847987B2 (en) 2016-01-27
JP2008057046A (en) 2008-03-13
CA2416574C (en) 2011-05-31
US6749699B2 (en) 2004-06-15
CN101012519A (en) 2007-08-08
WO2002012583A1 (en) 2002-02-14
HUP0300498A3 (en) 2005-04-28
DE60101026T2 (en) 2004-04-22
EP1179606A2 (en) 2002-02-13
CN1455823A (en) 2003-11-12
HU228707B1 (en) 2013-05-28
CN1302145C (en) 2007-02-28
DE60101026D1 (en) 2003-11-27
EP1179606B1 (en) 2003-10-22
MXPA03000958A (en) 2004-08-02
US20020039542A1 (en) 2002-04-04
HU0600421D0 (en) 2006-07-28
HK1042732A1 (en) 2002-08-23
HK1042732B (en) 2004-04-23
TWI237665B (en) 2005-08-11
JP2002180159A (en) 2002-06-26

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