JPS60218440A - Copper alloy for lead frame - Google Patents

Copper alloy for lead frame

Info

Publication number
JPS60218440A
JPS60218440A JP7398684A JP7398684A JPS60218440A JP S60218440 A JPS60218440 A JP S60218440A JP 7398684 A JP7398684 A JP 7398684A JP 7398684 A JP7398684 A JP 7398684A JP S60218440 A JPS60218440 A JP S60218440A
Authority
JP
Japan
Prior art keywords
cu
lead frame
ti
cu alloy
zr
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7398684A
Inventor
Kiichi Akasaka
Masato Asai
Hirohisa Iwai
Shigeo Shinozaki
Original Assignee
Furukawa Electric Co Ltd:The
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd:The filed Critical Furukawa Electric Co Ltd:The
Priority to JP7398684A priority Critical patent/JPS60218440A/en
Publication of JPS60218440A publication Critical patent/JPS60218440A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To obtain a Cu alloy for a lead frame having superior strength, electric conductivity, heat resistance and workability by adding specified amounts of Ti and one or more among Sb, Ag, Te, Si, Cr, Co, Fe, P, Sn, Mg, Zr, Al, Mn, Be and Ni to Cu.
CONSTITUTION: The composition of a Cu alloy for a lead frame is composed of 0.05W2wt% Ti, <3wt% one or more among Sb, Ag, Te, SI, Cr, Co, Fe, P, Sn, Mg, Zr, Al, Mn, Be and Ni as the 3rd element and the balance Cu. Cu is melted in a graphite crucible, Ti is added, and then the 3rd element is added to manufacture said Cu alloy.
COPYRIGHT: (C)1985,JPO&Japio
JP7398684A 1984-04-13 1984-04-13 Copper alloy for lead frame Pending JPS60218440A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7398684A JPS60218440A (en) 1984-04-13 1984-04-13 Copper alloy for lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7398684A JPS60218440A (en) 1984-04-13 1984-04-13 Copper alloy for lead frame

Publications (1)

Publication Number Publication Date
JPS60218440A true JPS60218440A (en) 1985-11-01

Family

ID=13533937

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7398684A Pending JPS60218440A (en) 1984-04-13 1984-04-13 Copper alloy for lead frame

Country Status (1)

Country Link
JP (1) JPS60218440A (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61183427A (en) * 1985-02-08 1986-08-16 Mitsui Mining & Smelting Co Ltd High strength copper alloy
EP0198159A1 (en) * 1985-04-02 1986-10-22 Wieland-Werke Ag Use of a copper-titanium-cobalt alloy as a material for electronic components
JPS61242052A (en) * 1985-04-19 1986-10-28 Mitsubishi Shindo Kk Copper alloy lead material for semiconductor device
JPS622559A (en) * 1985-06-28 1987-01-08 Toshiba Corp Lead frame
JPS6250428A (en) * 1985-08-29 1987-03-05 Furukawa Electric Co Ltd:The Copper alloy for electronic appliance
JPS62130247A (en) * 1985-11-29 1987-06-12 Furukawa Electric Co Ltd:The Copper alloy for electronic appliance
JPS62278243A (en) * 1986-05-27 1987-12-03 Dowa Mining Co Ltd Copper alloy for lead frame and its production
JPS63317635A (en) * 1988-05-19 1988-12-26 Furukawa Electric Co Ltd:The Copper alloy for electronic equipment and its production
JPH0285330A (en) * 1988-09-20 1990-03-26 Mitsui Mining & Smelting Co Ltd Copper alloy having good press bendability and its manufacture
JP2002069550A (en) * 2000-09-04 2002-03-08 Furuya Kinzoku:Kk Metallic material, sputtering target material for thin film deposition and thin film
JP2002075101A (en) * 2000-09-04 2002-03-15 Furuya Kinzoku:Kk Wiring, electrode, and contact point
US6749699B2 (en) 2000-08-09 2004-06-15 Olin Corporation Silver containing copper alloy

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS549117A (en) * 1977-06-24 1979-01-23 Toshiba Corp High strength copper alloy
JPS5539612A (en) * 1978-09-12 1980-03-19 Fujitsu Ltd Semiconductor laser device
JPS5836058A (en) * 1981-08-27 1983-03-02 Canon Inc Acoustic coupler
JPS58124254A (en) * 1982-01-20 1983-07-23 Nippon Mining Co Ltd Copper alloy for lead material of semiconductor device
JPS58221246A (en) * 1983-03-30 1983-12-22 Nippon Mining Co Ltd Electrically conductive copper alloy with high strength and superior heat resistance
JPS59145746A (en) * 1983-12-13 1984-08-21 Nippon Mining Co Ltd Copper alloy for lead material of semiconductor apparatus
JPS59145749A (en) * 1983-12-13 1984-08-21 Nippon Mining Co Ltd Copper alloy for lead material of semiconductor apparatus
JPS6036638A (en) * 1983-08-06 1985-02-25 Nippon Genma:Kk Copper alloy
JPS6039139A (en) * 1983-08-12 1985-02-28 Mitsui Mining & Smelting Co Ltd Softening resistant copper alloy with high conductivity
JPS60114556A (en) * 1983-11-24 1985-06-21 Mitsui Mining & Smelting Co Ltd Production of copper-base alloy
JPS60181250A (en) * 1984-02-28 1985-09-14 Mitsubishi Metal Corp Copper alloy for material of lead for semiconductor apparatus
JPS60184655A (en) * 1984-03-02 1985-09-20 Hitachi Metals Ltd High-strength copper alloy having high electric conductivity

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS549117A (en) * 1977-06-24 1979-01-23 Toshiba Corp High strength copper alloy
JPS5539612A (en) * 1978-09-12 1980-03-19 Fujitsu Ltd Semiconductor laser device
JPS5836058A (en) * 1981-08-27 1983-03-02 Canon Inc Acoustic coupler
JPS58124254A (en) * 1982-01-20 1983-07-23 Nippon Mining Co Ltd Copper alloy for lead material of semiconductor device
JPS58221246A (en) * 1983-03-30 1983-12-22 Nippon Mining Co Ltd Electrically conductive copper alloy with high strength and superior heat resistance
JPS6036638A (en) * 1983-08-06 1985-02-25 Nippon Genma:Kk Copper alloy
JPS6039139A (en) * 1983-08-12 1985-02-28 Mitsui Mining & Smelting Co Ltd Softening resistant copper alloy with high conductivity
JPS60114556A (en) * 1983-11-24 1985-06-21 Mitsui Mining & Smelting Co Ltd Production of copper-base alloy
JPS59145746A (en) * 1983-12-13 1984-08-21 Nippon Mining Co Ltd Copper alloy for lead material of semiconductor apparatus
JPS59145749A (en) * 1983-12-13 1984-08-21 Nippon Mining Co Ltd Copper alloy for lead material of semiconductor apparatus
JPS60181250A (en) * 1984-02-28 1985-09-14 Mitsubishi Metal Corp Copper alloy for material of lead for semiconductor apparatus
JPS60184655A (en) * 1984-03-02 1985-09-20 Hitachi Metals Ltd High-strength copper alloy having high electric conductivity

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0356292B2 (en) * 1985-02-08 1991-08-27
JPS61183427A (en) * 1985-02-08 1986-08-16 Mitsui Mining & Smelting Co Ltd High strength copper alloy
EP0198159A1 (en) * 1985-04-02 1986-10-22 Wieland-Werke Ag Use of a copper-titanium-cobalt alloy as a material for electronic components
JPS62211337A (en) * 1985-04-02 1987-09-17 Wieland Werke Ag Copper, titanium and cobalt alloy as material for electronics parts
JPH0380856B2 (en) * 1985-04-19 1991-12-26 Mitsubishi Shindo Kk
JPS61242052A (en) * 1985-04-19 1986-10-28 Mitsubishi Shindo Kk Copper alloy lead material for semiconductor device
JPS622559A (en) * 1985-06-28 1987-01-08 Toshiba Corp Lead frame
JPS6250428A (en) * 1985-08-29 1987-03-05 Furukawa Electric Co Ltd:The Copper alloy for electronic appliance
JPS62130247A (en) * 1985-11-29 1987-06-12 Furukawa Electric Co Ltd:The Copper alloy for electronic appliance
JPS62278243A (en) * 1986-05-27 1987-12-03 Dowa Mining Co Ltd Copper alloy for lead frame and its production
JPS63317635A (en) * 1988-05-19 1988-12-26 Furukawa Electric Co Ltd:The Copper alloy for electronic equipment and its production
JPH0285330A (en) * 1988-09-20 1990-03-26 Mitsui Mining & Smelting Co Ltd Copper alloy having good press bendability and its manufacture
JPH0469217B2 (en) * 1988-09-20 1992-11-05 Mitsui Mining & Smelting Co
US6749699B2 (en) 2000-08-09 2004-06-15 Olin Corporation Silver containing copper alloy
JP2002069550A (en) * 2000-09-04 2002-03-08 Furuya Kinzoku:Kk Metallic material, sputtering target material for thin film deposition and thin film
JP2002075101A (en) * 2000-09-04 2002-03-15 Furuya Kinzoku:Kk Wiring, electrode, and contact point
JP4494610B2 (en) * 2000-09-04 2010-06-30 株式会社フルヤ金属 Sputtering target material for thin film formation

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