JPS58221246A - Electrically conductive copper alloy with high strength and superior heat resistance - Google Patents

Electrically conductive copper alloy with high strength and superior heat resistance

Info

Publication number
JPS58221246A
JPS58221246A JP5275383A JP5275383A JPS58221246A JP S58221246 A JPS58221246 A JP S58221246A JP 5275383 A JP5275383 A JP 5275383A JP 5275383 A JP5275383 A JP 5275383A JP S58221246 A JPS58221246 A JP S58221246A
Authority
JP
Japan
Prior art keywords
heat resistance
electrically conductive
high strength
sn
superior heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5275383A
Other versions
JPS6033890B2 (en
Inventor
Masahiro Tsuji
Original Assignee
Nippon Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co Ltd filed Critical Nippon Mining Co Ltd
Priority to JP5275383A priority Critical patent/JPS6033890B2/ja
Publication of JPS58221246A publication Critical patent/JPS58221246A/en
Publication of JPS6033890B2 publication Critical patent/JPS6033890B2/ja
Expired legal-status Critical Current

Links

Abstract

PURPOSE: To improve the heat resistance, electric conductivity, heat conductivity, suitability to plating, solderability, mechanical strength, etc. of the resulting alloy by providing a specified composition consisting of small amounts of Ti and Sn and the balance Cu.
CONSTITUTION: This electrically conductive Cu alloy with high strength and superior heat resistance has a composition consisting of, by weight, 0.01W<1.0% Ti, 0.01W1.0% Sn and the balance essentially Cu or further contg. >0.04W0.2% P and/or 0.01W0.5% Si. The total amount of Sn, P and Si is 0.02W1.0%.
COPYRIGHT: (C)1983,JPO&Japio
JP5275383A 1983-03-30 1983-03-30 Expired JPS6033890B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5275383A JPS6033890B2 (en) 1983-03-30 1983-03-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5275383A JPS6033890B2 (en) 1983-03-30 1983-03-30

Publications (2)

Publication Number Publication Date
JPS58221246A true JPS58221246A (en) 1983-12-22
JPS6033890B2 JPS6033890B2 (en) 1985-08-06

Family

ID=12923652

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5275383A Expired JPS6033890B2 (en) 1983-03-30 1983-03-30

Country Status (1)

Country Link
JP (1) JPS6033890B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60174841A (en) * 1984-02-21 1985-09-09 Furukawa Electric Co Ltd:The Phosphor-bronze for electronic and electrical instrument
JPS60218440A (en) * 1984-04-13 1985-11-01 Furukawa Electric Co Ltd:The Copper alloy for lead frame
JPH0770674A (en) * 1994-06-06 1995-03-14 Toshiba Corp Semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60174841A (en) * 1984-02-21 1985-09-09 Furukawa Electric Co Ltd:The Phosphor-bronze for electronic and electrical instrument
JPH0352524B2 (en) * 1984-02-21 1991-08-12 Furukawa Electric Co Ltd
JPS60218440A (en) * 1984-04-13 1985-11-01 Furukawa Electric Co Ltd:The Copper alloy for lead frame
JPH0770674A (en) * 1994-06-06 1995-03-14 Toshiba Corp Semiconductor device

Also Published As

Publication number Publication date
JPS6033890B2 (en) 1985-08-06

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