JPS6036638A - Copper alloy - Google Patents

Abstract

PURPOSE:To obtain a Cu alloy having superior solderability and enduring well an environment by adding specified amounts of Ti and Cu. CONSTITUTION:This Cu alloy contains 0.01-15wt% Ti and 20-99.99wt% Cu, has high solderability, and endures well an environment. In case of <0.01% Ti, the effects are not produced, and >15% Ti is uneconomical. It is preferable that Ti is contained by 0.01-5.6%, especially 0.01-4.0%, more especially 0.01-3.0%. The Cu alloy can be used in the form of a supersatd. solid soln. or a solid soln. The Cu alloy contains 0-7% Fe, 0-10% Sn and 0-5% Pb, 0-5% Mn, 0-5% Be, 0-8% P and 0-1% As, or 0-0.5% C, 0-5% Co, 0-3% Cr and 0-3% Ag.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a copper alloy having good solderability (J properties).

Copper alloys have good solderability and conductivity, so they are used in a wide variety of applications, mainly in the electronics industry (for example, in electronic parts, as lead wires, printed circuit boards, and pastes).

However, during storage, many copper alloys are
．． 1”201SO×,CO2,1”CI! ,,NOX,
The surface of the copper alloy reacts with l-12s, etc., forming oxides that make soldering difficult.

Conventionally, in order to solve this problem, surface treatments such as tin plating, silver plating, and solder plating have been applied to the surface of copper alloys to improve their environmental resistance. (It requires a T-shaped culm, and soldering requires a large amount of expensive silver to improve soldering properties, making it economically unfavorable.)

The Ministry of the Invention and others have completed the present invention as a result of intensive research to improve soldering of copper alloys and to improve environmental resistance.

That is, the present invention relates to a copper alloy containing 0.01% to 15% by weight of Ti and having good solderability.

The copper alloy of the present invention may contain 0.01 to 15% by weight of rl. - [When the i content is less than 0.01% by weight, the effect of T1 does not appear. If the amount exceeds 15% by weight, although the effect of Ti is good, it is undesirable because it is expensive and the benefits are small. Preferably the Ti content is 0.01
% by weight to 5.6% by weight. More preferably, Ti
Contains less than 0.011 sum-1 4.0Φ mass%. Within this range, the temperature range for forming a uniform solid solution is wide, and production is easy. Most preferably 0.01% by weight to 3.
It is 0% by weight. When the content is 3.0ffiffi% or less, the solution treatment temperature is low and a uniform solid solution can be obtained very easily. Solid solubility limit of T1 in Cu (5.6% monomer, 885°C
) with the addition of l-i, TiC113 or Ti2Cu? There exists an intermetallic compound of Ti expressed as . This compound itself impairs solder wetting 111-
Therefore, the wettability of the 71-helix solid solution for copper alloys containing 5.6% or more of Ti is that of pure copper J, although it is eroded by T.
As i increases, metal u11 polymerization/ba increases, causing wetting f'l to become il'F, resulting in a decrease in solderability compared to a homogeneous solid solution.In general, the solid solubility limit of an additive element is Since it decreases at low temperatures, it is possible to prevent the formation of metal 1B1 compounds such as T + Cu 3 by performing solution treatment at room temperature (for copper alloys containing Ti exceeding the solid solubility limit, manufacture the alloy). prevent and ensure good soldering (1't-J properties).

The copper alloy of the present invention can be used in the form of a supersaturated solid solution or a solid solution, and may be used in any structural state. In other words, any history may be used in any type of history and any type of texture may be used. The reason why good solderability is obtained by including Ti in a copper alloy is not limited, but T
In copper alloys containing i, the rate of oxide formation is low;
The adhesion of the oxide to the base material is poor, it contains many cracks, and the oxide is more susceptible to the 7 lux action than the oxides of other copper alloys. Due to these factors, when soldering copper alloys containing TI, the oxide layer with poor adhesion to the base material peels off due to thermal expansion of the solder, and the remaining thin oxide film is easily removed by flux. This is understood to be due to the fact that wetting between the base material and the solder occurs every 15 minutes.

The effect of the present invention is that oxides with copper are formed on the surface (
Can be applied to copper alloys. That is, in a copper alloy containing various metals, Ni is 0,01 to 15% (B% content is 1J-1, J is 1,000%). ~70 wt%, 7n 0~50 mm%
, AJl (!-o ~ 15% by weight) may be used.Also, it may be a copper alloy containing 0 to 7% by weight of Fe, S n wo 0''
10 F? It may be a copper alloy containing Pb in an amount of 0 to 5% by weight. Furthermore, 0 to 5% by weight of Mn
, 3e 0~5% by weight, P@o~8 width hanging%, AS 0~5% by weight
It may also be applied to copper alloys containing 1% by weight. Other, C
0 to 0.5% by weight, CO to 5% by weight, Cr to O to 5% by weight
Copper alloy containing 0 to 3 weight% Ag or 0 to 0.5 weight 1% oxygen, (') to 0.2 weight % S, and 0 to 0.311 weight % B1. %, Cd in an amount of O to 0.3% by weight, and Zr in an amount of O to 1% by weight. In addition, sb is 0 to 1% by weight, Te is 06-2% by weight, Ca is 0 to 1% by weight, and Mg is O to 1,000Ω.
%, 1-1 to O~1%, copper alloy containing
C4v is good. It is also possible for these alloys to contain impurities other than the F elements in a total amount of 1% by weight. good. For example, a method of vacuum melting may be used.

The flux used in the steel alloy of the present invention may be any commonly used flux. For example, chlorine-based or
Examples include elementary fluxes.

The copper alloy of the present invention has excellent solderability and environmental resistance f[
-6 Excellent. By using the copper alloy of the present invention for copper wire, copper plate, copper foil, etc., soldering can be performed more easily. In addition, when used as a base alloy for plating, the base metal is less likely to undergo deterioration due to corrosion such as oxidation, and in order to maintain excellent properties, the plating thickness must be increased. 'JIJ <-d, which leads to savings in plating materials.Furthermore, when the copper alloy of the present invention is used as a powder with copper paste, good solderability can be expected.

Hereinafter, the present invention will be explained in detail using examples.

The wetting times of copper alloys with various contents of ``Hiobo''--11 were measured. The results are shown in Figure '1. For comparison, the wetting time of pure copper is shown by the dotted line 'J' +1 Measuring method: A copper alloy is inserted into a solder bath melted at 250°C at a constant speed fff (4 mm/sec), and the copper alloy comes into contact with the hammer. The surface of the pin is at the same height as the surface of the molten solder (measured between 1 and 1).

■Pure copper, T1 0. Copper alloy containing /1% by weight, -1-1
Copper alloy containing 1% by weight of T1 and 5% by weight of T1
Tu! copper alloys were oxidized for 1 hour at various temperatures. L,
Check the wetting time after washing. The results are shown in Figure 2.

[Brief explanation of the drawing]

Figure 1 is a J-graph showing the wetting time of copper alloys with various contents of Ti, Figure 2 is pure copper, Ti is O4/1Φω%.
The graph shows the wetting time after oxidizing a copper alloy containing 4% Ti, a copper alloy containing 1% by weight of Ti, and a copper alloy containing 5% by weight of Ti at various levels for 1 hour. In FIG. 1, (1) represents the wetting time of pure copper, and (2) represents the wetting time of the copper alloy of the present invention. −〇−

Claims (1)

[Claims] 1. 0.01% to 15% by weight of Ti and 20% by weight of copper
2. Copper alloy according to item 1 containing 0.01% to 5.6% by weight of T1. 3. Copper alloy with 0.01% to 5.6% by weight of Ti. 4. The copper alloy according to item 1, wherein the copper alloy is a supersaturated solid solution or a solid solution. 5. Ti in an amount of 0.01 to 3% by weight. 6. Items 1 to 5, wherein the copper alloy contains 0 to 70% by weight of N1, O to 50% by weight of Zn, and O to 15% by weight of A-poor. 7. The copper alloy according to any one of items 1 to j5, wherein the copper alloy contains 0 to 7% by weight of Fe, 0 to 10% by weight of Sn, and 0 to 5% by weight of PB. 8. Any one of Items 1 to 5 in which the copper alloy contains 0 to 5% by weight of Mn, 0 to 5% by weight of Be, 0 to 8% by weight of one, and 0 to 1% by weight of As. Copper alloy as described. The copper alloy according to any one of Items 10. The copper alloy contains oxygen in an amount of O to 0.5% by weight and S in an amount of O to 0.5% by weight.
2Φ5%, Bi O~0.3% by weight, Cd O~0.3
The copper alloy according to any one of Items 1 to 5, containing Zr in an amount of 0 to 1% by weight. 11. The copper alloy contains Sb at 0~1% and Te at 0~2%.
% by weight, 0 to 1% by weight of Ca, 0 to 1% by weight of MO, l
The copper alloy according to any one of items 1 to 5, containing 1% by weight of i to O.