JPS622559A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS622559A
JPS622559A JP14016385A JP14016385A JPS622559A JP S622559 A JPS622559 A JP S622559A JP 14016385 A JP14016385 A JP 14016385A JP 14016385 A JP14016385 A JP 14016385A JP S622559 A JPS622559 A JP S622559A
Authority
JP
Japan
Prior art keywords
lead frame
zr
cr
ingot
ti
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14016385A
Other versions
JPH0669076B2 (en
Inventor
Tatsuya Hatanaka
Hisaharu Sakurai
Sumiyo Uzawa
Kazuhiro Yamamori
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP60140163A priority Critical patent/JPH0669076B2/en
Publication of JPS622559A publication Critical patent/JPS622559A/en
Publication of JPH0669076B2 publication Critical patent/JPH0669076B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To realize a lead frame strong enough to withstand repeated bends, demonstrating an excellent wire bondability in the absence of a plated layer, and excellent in terms of resistance to solder weathering by a method wherein a Cr-Zr-Cu alloy containing a specified quantity of Ti is used for the construction of the leacd frame. CONSTITUTION:A lead frame is built of an alloy containing Cr occupying not more than 1.5wt% and Zr not more than 1.0wt%, with the sum of Cr and Zr not less than 0.3wt% not more than 2.0wt%, Ti not less than 0.1wt% not more than 1.0wt%, and Cu occopying the remaining percentage. For the manufacture of this lead frame, said component are fused into an ingot. The ingot is then subjectd to such heat treatment processes as forging, annealing, and hot working, for development into an alloy plate. The alloy plate is next pressed into a prescribed pattern. A process follows wherein an IC chip is mounted on the lead frame, the two are bonded to with each other with an Au wire, and the entirety is developed into an IC package by using a plastic or ceramic material.
JP60140163A 1985-06-28 1985-06-28 Lead frame Expired - Lifetime JPH0669076B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60140163A JPH0669076B2 (en) 1985-06-28 1985-06-28 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60140163A JPH0669076B2 (en) 1985-06-28 1985-06-28 Lead frame

Publications (2)

Publication Number Publication Date
JPS622559A true JPS622559A (en) 1987-01-08
JPH0669076B2 JPH0669076B2 (en) 1994-08-31

Family

ID=15262340

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60140163A Expired - Lifetime JPH0669076B2 (en) 1985-06-28 1985-06-28 Lead frame

Country Status (1)

Country Link
JP (1) JPH0669076B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5210441A (en) * 1990-12-20 1993-05-11 Kabushiki Kaisha Toshiba Lead frame formed of a copper-zirconium alloy

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60218440A (en) * 1984-04-13 1985-11-01 Furukawa Electric Co Ltd:The Copper alloy for lead frame

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60218440A (en) * 1984-04-13 1985-11-01 Furukawa Electric Co Ltd:The Copper alloy for lead frame

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5210441A (en) * 1990-12-20 1993-05-11 Kabushiki Kaisha Toshiba Lead frame formed of a copper-zirconium alloy
US5341025A (en) * 1990-12-20 1994-08-23 Kabushiki Kaisha Toshiba IC package and LSI package using a lead frame formed of a copper-zirconium alloy

Also Published As

Publication number Publication date
JPH0669076B2 (en) 1994-08-31

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term