JPS58124254A - Copper alloy for lead material of semiconductor device - Google Patents

Copper alloy for lead material of semiconductor device

Info

Publication number
JPS58124254A
JPS58124254A JP606182A JP606182A JPS58124254A JP S58124254 A JPS58124254 A JP S58124254A JP 606182 A JP606182 A JP 606182A JP 606182 A JP606182 A JP 606182A JP S58124254 A JPS58124254 A JP S58124254A
Authority
JP
Japan
Prior art keywords
lead material
semiconductor device
alloy
copper alloy
total amount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP606182A
Other versions
JPS6314056B2 (en
Inventor
Masahiro Tsuji
Michiharu Yamamoto
Original Assignee
Nippon Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co Ltd filed Critical Nippon Mining Co Ltd
Priority to JP57006061A priority Critical patent/JPS6314056B2/ja
Publication of JPS58124254A publication Critical patent/JPS58124254A/en
Publication of JPS6314056B2 publication Critical patent/JPS6314056B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To improve all heat dissipating property, heat resistance, strength, solderability, plating bondabilty required for a lead material. CONSTITUTION:0.001-2.0wt% of total amount of one or more selected from a group which consists of 0.001-0.1wt%, 0.001-0.1wt% of As, 0.001-0.1wt% of Sb, 0.01-1.0wt% of Fe, 0.01-1.0wt% of Co, 0.01-1.0wt% of Cr, 0.01-1.0wt% of Sn 0.01-1.0wt% of Al, 0.01-1.0wt% of Ti, 0.01-10.0wt% of Zr, 0.01-1.0wt% of Mg, 0.01-1.0wt% of Be, 0.01-1.0wt% of Mn and 0.01-1.0wt% of Zn is added as sub content to an alloy which contains 0.4-4.0wt% of Ni, 0.1-1.0wt% of Si and the residue of copper and unavoidable impurities. When the Si content exceeds 1.0wt%, the workability and the conductivity are remarkably reduced, and the soldability is reduced. Further, when the total amount of the sub content is less than 0.001wt%, an alloy having high strength and corrosion resistance cannot be obtained.
JP57006061A 1982-01-20 1982-01-20 Expired JPS6314056B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57006061A JPS6314056B2 (en) 1982-01-20 1982-01-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57006061A JPS6314056B2 (en) 1982-01-20 1982-01-20

Publications (2)

Publication Number Publication Date
JPS58124254A true JPS58124254A (en) 1983-07-23
JPS6314056B2 JPS6314056B2 (en) 1988-03-29

Family

ID=11628069

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57006061A Expired JPS6314056B2 (en) 1982-01-20 1982-01-20

Country Status (1)

Country Link
JP (1) JPS6314056B2 (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58213847A (en) * 1982-06-05 1983-12-12 Kobe Steel Ltd Copper alloy for electric and electronic parts and its manufacture
JPS59136439A (en) * 1983-01-26 1984-08-06 Sanpo Shindo Kogyo Kk Copper base alloy
JPS6043448A (en) * 1983-08-16 1985-03-08 Kobe Steel Ltd Copper alloy for terminal or connector and its manufacture
JPS60218442A (en) * 1984-04-13 1985-11-01 Furukawa Electric Co Ltd:The Copper alloy for lead frame
JPS60218440A (en) * 1984-04-13 1985-11-01 Furukawa Electric Co Ltd:The Copper alloy for lead frame
JPS61177348A (en) * 1985-02-01 1986-08-09 Kobe Steel Ltd Lead material for ceramic packaged ic
US4650123A (en) * 1986-03-25 1987-03-17 Toyota Jidosha Kabushiki Kaisha Rotary type electrostatic spray painting device
US4700896A (en) * 1986-04-11 1987-10-20 Toyota Jidosha Kabushiki Kaisha Rotary type electrostatic spray painting device
JPH0741887A (en) * 1992-09-24 1995-02-10 Young Gil Kim Copper alloy for electric and electronic part and its preparation
JP2007017926A (en) * 2005-06-07 2007-01-25 Kobe Steel Ltd Display device
JP2008282887A (en) * 2007-05-09 2008-11-20 Sentan Haisen Zairyo Kenkyusho:Kk Liquid crystal display device, and manufacturing method of the same
DE19643378C5 (en) * 1995-12-08 2010-12-16 Poongsan Corp, Pyeongtaek Copper alloy product and process for its production
US8451394B2 (en) 2007-05-09 2013-05-28 Altiam Services Ltd. Llc Liquid crystal display device and manufacturing method therefor

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5011586B2 (en) * 2005-09-30 2012-08-29 Dowaメタルテック株式会社 Copper alloy sheet with improved bending workability and fatigue characteristics and its manufacturing method

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5314612A (en) * 1976-07-28 1978-02-09 Toshiba Corp Lead wire
US4191601A (en) * 1979-02-12 1980-03-04 Ampco-Pittsburgh Corporation Copper-nickel-silicon-chromium alloy having improved electrical conductivity
JPS55104449A (en) * 1979-02-02 1980-08-09 Hitachi Ltd High-strength high-electrically-conductive copper alloy with superior weldability
JPS55158246A (en) * 1979-04-30 1980-12-09 Delta Enfield Metals Precipitation hardenable copper alloy
JPS56142840A (en) * 1980-04-04 1981-11-07 Hitachi Ltd Copper alloy having minute crystal grain
JPS572851A (en) * 1980-06-06 1982-01-08 Nippon Mining Co Ltd Copper alloy for lead material of semiconductor device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5314612A (en) * 1976-07-28 1978-02-09 Toshiba Corp Lead wire
JPS55104449A (en) * 1979-02-02 1980-08-09 Hitachi Ltd High-strength high-electrically-conductive copper alloy with superior weldability
US4191601A (en) * 1979-02-12 1980-03-04 Ampco-Pittsburgh Corporation Copper-nickel-silicon-chromium alloy having improved electrical conductivity
JPS55158246A (en) * 1979-04-30 1980-12-09 Delta Enfield Metals Precipitation hardenable copper alloy
JPS56142840A (en) * 1980-04-04 1981-11-07 Hitachi Ltd Copper alloy having minute crystal grain
JPS572851A (en) * 1980-06-06 1982-01-08 Nippon Mining Co Ltd Copper alloy for lead material of semiconductor device

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58213847A (en) * 1982-06-05 1983-12-12 Kobe Steel Ltd Copper alloy for electric and electronic parts and its manufacture
JPS5949293B2 (en) * 1982-06-05 1984-12-01 Kobe Steel Ltd
JPS59136439A (en) * 1983-01-26 1984-08-06 Sanpo Shindo Kogyo Kk Copper base alloy
JPS6043448A (en) * 1983-08-16 1985-03-08 Kobe Steel Ltd Copper alloy for terminal or connector and its manufacture
JPH0323620B2 (en) * 1983-08-16 1991-03-29 Kobe Steel Ltd
JPS60218442A (en) * 1984-04-13 1985-11-01 Furukawa Electric Co Ltd:The Copper alloy for lead frame
JPS60218440A (en) * 1984-04-13 1985-11-01 Furukawa Electric Co Ltd:The Copper alloy for lead frame
JPH0357175B2 (en) * 1984-04-13 1991-08-30
JPS61177348A (en) * 1985-02-01 1986-08-09 Kobe Steel Ltd Lead material for ceramic packaged ic
JPS6250535B2 (en) * 1985-02-01 1987-10-26 Kobe Steel Ltd
US4650123A (en) * 1986-03-25 1987-03-17 Toyota Jidosha Kabushiki Kaisha Rotary type electrostatic spray painting device
US4700896A (en) * 1986-04-11 1987-10-20 Toyota Jidosha Kabushiki Kaisha Rotary type electrostatic spray painting device
JPH0741887A (en) * 1992-09-24 1995-02-10 Young Gil Kim Copper alloy for electric and electronic part and its preparation
DE19643378C5 (en) * 1995-12-08 2010-12-16 Poongsan Corp, Pyeongtaek Copper alloy product and process for its production
JP2007017926A (en) * 2005-06-07 2007-01-25 Kobe Steel Ltd Display device
JP4542008B2 (en) * 2005-06-07 2010-09-08 株式会社神戸製鋼所 Display device
JP2008282887A (en) * 2007-05-09 2008-11-20 Sentan Haisen Zairyo Kenkyusho:Kk Liquid crystal display device, and manufacturing method of the same
US8451394B2 (en) 2007-05-09 2013-05-28 Altiam Services Ltd. Llc Liquid crystal display device and manufacturing method therefor

Also Published As

Publication number Publication date
JPS6314056B2 (en) 1988-03-29

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