JPS59145749A - Copper alloy for lead material of semiconductor apparatus - Google Patents

Copper alloy for lead material of semiconductor apparatus

Info

Publication number
JPS59145749A
JPS59145749A JP23370283A JP23370283A JPS59145749A JP S59145749 A JPS59145749 A JP S59145749A JP 23370283 A JP23370283 A JP 23370283A JP 23370283 A JP23370283 A JP 23370283A JP S59145749 A JPS59145749 A JP S59145749A
Authority
JP
Japan
Prior art keywords
copper alloy
semiconductor apparatus
lead material
solderability
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23370283A
Other versions
JPS6215622B2 (en
Inventor
Masahiro Tsuji
Michiharu Yamamoto
Original Assignee
Nippon Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
Application filed by Nippon Mining Co Ltd filed Critical Nippon Mining Co Ltd
Priority to JP58233702A priority Critical patent/JPS6215622B2/ja
Publication of JPS59145749A publication Critical patent/JPS59145749A/en
Publication of JPS6215622B2 publication Critical patent/JPS6215622B2/ja
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=16959204&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JPS59145749(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Expired legal-status Critical Current

Links

Abstract

PURPOSE: To improve the heat radiating properties, heat resistance, solderability and adhesive strength to plating by adding Mn and P, As or the like as secondary components to prescribed percentages of Ni, Si and Cu.
CONSTITUTION: The titled alloy is obtd. by adding, by weight, 0.01W1% Mn and 0.001W2% in total of one or more among 0.001W0.1% P, 0.001W0.1% As, 0.001W 0.1% Sb, 0.01W1% Fe, 0.01W1% Co, 0.01W1% Cr, 0.01W1% Sn, 0.01W1% Al, 0.01W1% Ti, etc. as secondary components to an alloy consisting of 1W4% Ni, 0.3W1% Si and the balance Cu. The titled alloy has superior heat radiating properties, heat resistance, solderability and adhesive strength to plating.
COPYRIGHT: (C)1984,JPO&Japio
JP58233702A 1983-12-13 1983-12-13 Expired JPS6215622B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58233702A JPS6215622B2 (en) 1983-12-13 1983-12-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58233702A JPS6215622B2 (en) 1983-12-13 1983-12-13

Publications (2)

Publication Number Publication Date
JPS59145749A true JPS59145749A (en) 1984-08-21
JPS6215622B2 JPS6215622B2 (en) 1987-04-08

Family

ID=16959204

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58233702A Expired JPS6215622B2 (en) 1983-12-13 1983-12-13

Country Status (1)

Country Link
JP (1) JPS6215622B2 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58213847A (en) * 1982-06-05 1983-12-12 Kobe Steel Ltd Copper alloy for electric and electronic parts and its manufacture
JPS60218440A (en) * 1984-04-13 1985-11-01 Furukawa Electric Co Ltd:The Copper alloy for lead frame
JPS61157651A (en) * 1984-12-28 1986-07-17 Hitachi Metals Ltd Copper alloy for lead frame
US4606889A (en) * 1985-11-07 1986-08-19 Cabot Corporation Copper-titanium-beryllium alloy
US4656003A (en) * 1984-10-20 1987-04-07 Kabushiki Kaisha Kobe Seiko Sho Copper alloy and production of the same
US4692192A (en) * 1984-10-30 1987-09-08 Ngk Insulators, Ltd. Electroconductive spring material
JPS6396232A (en) * 1986-10-09 1988-04-27 Kobe Steel Ltd Copper alloy for plastic pin grid array ic lead pin and its production
JPH08325681A (en) * 1985-04-26 1996-12-10 Olin Corp Production of copper-based alloy having improved combinationof ultimate tensile strength, electrical conductivity and stress relaxation resistance
US7182823B2 (en) 2002-07-05 2007-02-27 Olin Corporation Copper alloy containing cobalt, nickel and silicon

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5278621A (en) * 1975-12-26 1977-07-02 Tamagawa Kikai Kinzoku Kk Copper alloy for lead frames of semiconductor elements
JPS54402A (en) * 1977-06-02 1979-01-05 Kokusai Kikou Kk Work of protecting normal plane suitable for planting and its method of construction
JPS54100257A (en) * 1978-01-25 1979-08-07 Toshiba Corp Lead frame
JPS5616642A (en) * 1979-07-20 1981-02-17 Furukawa Kinzoku Kogyo Kk High-strength corrosion-resistant copper alloy
JPS572851A (en) * 1980-06-06 1982-01-08 Nippon Mining Co Ltd Copper alloy for lead material of semiconductor device
JPS5895850A (en) * 1981-12-02 1983-06-07 Kobe Steel Ltd Copper alloy for lead frame of integrated circuit
JPH05106A (en) * 1991-06-25 1993-01-08 Matsushita Electric Works Ltd Mirror cabinet

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5278621A (en) * 1975-12-26 1977-07-02 Tamagawa Kikai Kinzoku Kk Copper alloy for lead frames of semiconductor elements
JPS54402A (en) * 1977-06-02 1979-01-05 Kokusai Kikou Kk Work of protecting normal plane suitable for planting and its method of construction
JPS54100257A (en) * 1978-01-25 1979-08-07 Toshiba Corp Lead frame
JPS5616642A (en) * 1979-07-20 1981-02-17 Furukawa Kinzoku Kogyo Kk High-strength corrosion-resistant copper alloy
JPS572851A (en) * 1980-06-06 1982-01-08 Nippon Mining Co Ltd Copper alloy for lead material of semiconductor device
JPS5895850A (en) * 1981-12-02 1983-06-07 Kobe Steel Ltd Copper alloy for lead frame of integrated circuit
JPH05106A (en) * 1991-06-25 1993-01-08 Matsushita Electric Works Ltd Mirror cabinet

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5949293B2 (en) * 1982-06-05 1984-12-01 Kobe Steel Ltd
JPS58213847A (en) * 1982-06-05 1983-12-12 Kobe Steel Ltd Copper alloy for electric and electronic parts and its manufacture
JPS60218440A (en) * 1984-04-13 1985-11-01 Furukawa Electric Co Ltd:The Copper alloy for lead frame
US4656003A (en) * 1984-10-20 1987-04-07 Kabushiki Kaisha Kobe Seiko Sho Copper alloy and production of the same
US4692192A (en) * 1984-10-30 1987-09-08 Ngk Insulators, Ltd. Electroconductive spring material
JPS61157651A (en) * 1984-12-28 1986-07-17 Hitachi Metals Ltd Copper alloy for lead frame
JPS6330979B2 (en) * 1984-12-28 1988-06-21 Hitachi Metals Ltd
JPH08325681A (en) * 1985-04-26 1996-12-10 Olin Corp Production of copper-based alloy having improved combinationof ultimate tensile strength, electrical conductivity and stress relaxation resistance
US4606889A (en) * 1985-11-07 1986-08-19 Cabot Corporation Copper-titanium-beryllium alloy
JPS6396232A (en) * 1986-10-09 1988-04-27 Kobe Steel Ltd Copper alloy for plastic pin grid array ic lead pin and its production
US7182823B2 (en) 2002-07-05 2007-02-27 Olin Corporation Copper alloy containing cobalt, nickel and silicon
US8257515B2 (en) 2002-07-05 2012-09-04 Gbc Metals, Llc Copper alloy containing cobalt, nickel and silicon
US8430979B2 (en) 2002-07-05 2013-04-30 Gbc Metals, Llc Copper alloy containing cobalt, nickel and silicon

Also Published As

Publication number Publication date
JPS6215622B2 (en) 1987-04-08

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