JPH0718355A - Copper alloy for electronic appliance and its production - Google Patents

Abstract

PURPOSE:To obtain a Cu alloy suppressed in magnetization while making use of superior strength and high electric conductivity peculiar to a conventional Cu-Fe alloy and having high strength and high electric conductivity as a Cu-Fe alloy having a low Fe content. CONSTITUTION:This Cu alloy for electric appliances consists of 5-12wt.% Fe, 0.01-1.0wt.% P and/or 0.01-1.0wt.% Zn and the balance Cu and preferably contains 0.01-1.0wt.%, in total, of one or more among Si, Mn and Mg and 0.001-1.0wt.%, in total, of one or more among Al, Pb, As, Sb, B, Co, Te, In, Ti, Zr, Hf, Ag and Ge. The Cu alloy is produced by melting and solidifying this components.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a copper alloy for electronic equipment. More specifically, the present invention relates to a connector,
The present invention relates to a copper alloy for electronic equipment, which is excellent in strength and electrical conductivity and is inexpensive as a material for electronic parts such as IC lead frames, and a method for producing the same.

[0002]

2. Description of the Related Art As copper alloys for electronic devices such as connectors and IC lead frames, many copper alloys such as brass and phosphor bronze have hitherto been used. Further, in recent years, with the trend toward miniaturization and surface mounting of electronic components, there has been a demand for a thin plate, improved strength, high electrical conductivity, high thermal conductivity, and an inexpensive material. In such a movement, a copper-iron based alloy has been attracting attention as the above material, for example, Japanese Patent Publication No. 4-24419.
It is proposed in Japanese Patent Publication No. This copper-iron alloy contains 2
Obtained by performing an aging treatment or an aging treatment after cold rolling on an ingot obtained by casting a molten metal of an alloy containing 0 to 90% by weight or less and the balance mainly consisting of iron at a cooling rate of 100 ° C./sec or more. This is an alloy for lead frames.

[0003]

[Problems to be Solved by the Invention] However, the above-mentioned copper-
Since iron-based alloys contain a large amount of iron, it is easy to obtain the strength required for a lead frame, but it is easy to magnetize, so that it can be used in connectors and ICs.
When used as a lead frame, there is a problem that a minute current is generated due to the influence of a magnetic field, which tends to cause a malfunction. An object of the present invention is to provide a copper-iron alloy capable of suppressing the occurrence of magnetization while utilizing the characteristics of the copper-iron alloy having relatively high strength and conductivity, and an optimal manufacturing method thereof.

[0004]

As a result of earnest studies, the present inventors were able to solve the above problems. That is, the present invention provides the following copper alloys for electronic devices. In the following description,% means% by weight unless otherwise specified.

(1) Fe of 5 to 12% and P of 0.01 to 1.
A copper alloy for electronic devices, characterized by containing 0% and / or Zn in an amount of 0.01 to 1.0%, and the balance being Cu and inevitable impurities.

(2) One or more of Si, Mn, and Mg in a total amount of 0.01 to 0.1% by weight or Al, Pb, A
s, Sb, B, Co, Te, In, Ti, Zr, Hf, Ag, Ge
One or two or more of them, 0.001 to 1.0% by weight in total, and 5 to 12% by weight of Fe, the balance being Cu and inevitable impurities, copper alloy for electronic devices .

(3) 0.01 to 1.0% by weight of P and /
Alternatively, the copper alloy for electronic devices according to (2), which contains 0.01 to 1.0% by weight of Zn.

(4) A copper alloy for electronic equipment, characterized in that at least 5% by weight of Fe is added to Cu, melted, and then solidified by rapid solidification at a rate of 100 ° C./sec or more.

(5) A method for producing a copper alloy for electronic equipment, characterized in that at least 5% by weight of Fe is added to Cu, melted, and then solidified by rapid solidification at a rate of 100 ° C./sec or more. .

(6) 5 to 12% by weight of Fe in Cu and 0.1% of P in Cu.
01-1.0% by weight and / or Zn of 0.01-1.0
A method for producing a copper alloy for electronic devices, which comprises solidifying after melting wt%.

(7) The method for producing a copper alloy for electronic devices according to any one of (1) to (3), which comprises melting and then solidifying by rapid solidification at a rate of 100 ° C./sec or more.

(8) In Cu, one or more of Si, Mn and Mg are added in a total amount of 0.01 to 1.0% by weight, and / or Al, Pb, As, Sb, B, Co, Te, In, Ti, Z
One of r, Hf, Ag, and Ge or two or more in total of 0.
A method for producing a copper alloy for electronic devices, which comprises melting 001 to 1.0% by weight and 5 to 12% by weight of Fe and then solidifying.

(9) 0.01 to 1.0% by weight of P and /
Alternatively, 0.01 to 1.0% by weight of Zn is added to the copper alloy for electronic devices according to (8).

(10) The method for producing a copper alloy for electronic equipment according to (5) or (8), characterized in that Zn is added in an amount of 0.01 to 1.0% by weight.

(11) Before finishing rolling the ingot produced by the production method according to any one of (5) to (10), 60
A method for producing a copper alloy for electronic devices, comprising a step of heating in a temperature range of 0 ° C to 800 ° C for 1 minute or more and cold rolling.

(12) Before finishing rolling of the ingot produced by the production method according to any one of (5) to (10), 60
A method for producing a copper alloy for electronic devices, comprising a step of heating in a temperature range of 0 ° C to 800 ° C for 1 minute or more, cold rolling, and then heating in a temperature range of 250 to 500 ° C for 10 minutes or more. .

(13) Before finishing rolling the ingot produced by the production method according to any one of (5) to (10),
The method is characterized by heating at 0 ° C to 1000 ° C for 1 minute or more and quenching in water or oil, and heating at a temperature range of 350 to 500 ° C for 10 minutes or more regardless of the subsequent cold working. , A method for manufacturing a copper alloy for electronic devices.

[0018]

The present invention will be described in more detail below. The reason for adding the alloy components that compose the copper alloy for electronic devices of the present invention and the reason for limiting the composition range will be described. Fe is solid-dissolved in Cu, and a part of the solid solution is precipitated and dispersed by aging treatment, whereby the mechanical strength can be improved without impairing the high electric conductivity of Cu itself. However, if the added amount is less than 5%, the structure will not become finer even if solidified by a rapid solidification method of cooling at a rate of 100 ° C./second or less, and desired mechanical strength cannot be obtained. On the other hand, if it exceeds 12%, the electrical characteristics, particularly the required electric conductivity, cannot be obtained.

In order to form a solid solution of Fe in Cu, a temperature of 700 to 1000 ° C. is required before finish rolling. 1000
If the temperature exceeds ℃, the crystals become large, which is not preferable. In the subsequent aging treatment, heating at 350 to 500 ° C. for 10 minutes or more can be performed. The annealing is 600-80.
1 minute or more at 0 ° C. is preferable. By precipitating and dispersing Fe in the temperature range of the aging treatment, the mechanical strength can be improved as described above.

It should be noted that heating for about 1 hour at 250 to 500 ° C. as strain relief annealing (low temperature annealing) in order to remove the processing strain generated during rolling in the final rolling stage is to improve the spring characteristics and the forming process. It is an effective refining means for improving sex.

P is added as a deoxidizing agent and for forming a compound with Fe to improve mechanical strength and electric conductivity, but if it is less than 0.01%, there is no effect due to the addition, and If it exceeds%, the compound becomes coarse, and the electrical conductivity and solderability deteriorate. Further, the amount of P added was set in consideration of the balance between mechanical strength and electric conductivity due to the addition of Fe.

Further, Si, Mn and Mg are added mainly as a deoxidizing agent to enhance the deoxidizing effect.
If it is less than 1%, the effect due to its addition is not obtained, and if it exceeds 1%, the compound becomes coarse and the electrical and mechanical properties deteriorate.

Also, Al, Pb, As, Sb, B, Co, T
Although e, In, Ti, Zr, Hf, Ag and Ge are mainly added as a deoxidizing agent to enhance the deoxidizing effect, 0.001
If it is less than%, there is no effect due to its addition, and if it exceeds 1%, the compound becomes coarse and the electrical and mechanical properties deteriorate.

Zn is also effective as a deoxidizer, but here it is added for the purpose of suppressing reliability deterioration such as peeling of the solder layer in a high temperature environment after soldering or after solder plating. The upper limit was 0.01% and the upper limit was 1.0% from the viewpoint of stress corrosion.

In the present invention, the compound phase can be uniformly dispersed in the matrix when solidified by a rapid solidification method of cooling at a rate of 100 ° C./sec or more by a twin roll method or the like instead of the conventional continuous casting method. It is effective for improving the characteristics of molding processability. In addition, this twin roll method is also advantageous in terms of energy saving because it can ingot an ingot with a thickness smaller than that of the normal casting method and can considerably omit intermediate processing and heat treatment steps in the normal casting method. .

[0026]

EXAMPLES Table 1 shows that Cu-Fe alloys of each composition are melted in a high-frequency melting furnace to form an ingot, and after the surface of the ingot is chamfered, cold rolling and heat treatment are repeated and the final 37%
Of the plate-shaped product having a thickness of 0.4 mm to 0.25 mm, which was subjected to the cold rolling process, was shown to have hardness, electric conductivity and solder heat resistance. The electrical conductivity here means the electrical conductivity (% IACS) measured by measuring the electrical resistance of the sample.
Displayed in. The hardness was measured according to the Vickers hardness test method of JIS Z2244. Solder heat resistance is
The sample was immersed in a solder bath of 90% Sn-10% Pb, and after solder plating, heating and holding at 150 ° C was performed, and then the solder-plated portion was subjected to close contact bending, and the time until peeling occurred was measured and evaluated.

From these results, Examples 4 to 10 and 13 to 1
As shown in 7, 19, 20, 22-27, 29-32, and 33, Cu has Fe of 5% or more and 12% or less, and P of 0.01.
% And 0.95% or less, the properties and hardness (Hv) 140 required for copper alloys for electronic devices such as lead frames are added.
Above, electrical conductivity 30% IACS or more, solder heat resistance 2
A material satisfying 50 hours or more is obtained.

Further, as shown in Examples 62, 63, 65 and 66, even if Fe and Si or Mn or Mg are added to Cu, an alloy having the required characteristics can be obtained. Furthermore, Examples 67 to 71, 73 to 75, 77 to 79, 81 to 83,
As shown in Nos. 85-87 and 89-91, Fe is added to Cu in an amount of 5% or more, P is 0.01% or more, and the total amount of Si, Mn, and Mg is 1% or less to obtain a copper alloy having predetermined characteristics. To be

Further, as shown in Examples 46 and 47, if 5% of Fe is added to at least Cu, a copper alloy having predetermined characteristics can be manufactured through subsequent processing.

Further, as shown in Examples 39 to 44, 49 to 60, Comparative Examples 38 and 45, etc., it is understood that the addition of Zn improves the solder heat resistance.

Examples 4-10, 15-17, 39-
As shown in FIG. 41, a material having predetermined characteristics can be obtained by processing with any of the methods A to D shown in Table 1.

Further, by comparing Examples 13 and 14, the mechanical properties of the sample processed from the ingot produced by the rapid solidification method by the twin roll casting machine are more finely and uniformly dispersed in the compound phase. You can see that it is good.

[0033]

[Table 1]

[0034]

[Table 2]

[0035]

[Table 3]

[0036]

[Table 4]

[0037]

Since the alloy of the present invention is a Cu-Fe based alloy in which the Fe content is kept low, the alloy has excellent magnetization and high electrical conductivity while maintaining the excellent strength and high conductivity of the conventional Cu-Fe based alloy. Occurrence can be suppressed. In addition, an ingot having good casting quality can be obtained by adding a specific element in the Cu-Fe alloy casting. Furthermore, it becomes possible to have both high strength and high electrical conductivity by performing a specific heat treatment in the process of processing it into a thin plate material.

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[Procedure amendment]

[Submission date] September 1, 1993

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(2) One or two or more of Si, Mn and Mg in total of 0.01 to 0.1% by weight and / or Al,
Pb, As, Sb, B, Co, Te, In, Ti, Zr, Hf,
One or more of Ag and Ge in total 0.001-
A copper alloy for electronic devices, comprising 1.0% by weight and 5 to 12% by weight of Fe, and the balance being Cu and inevitable impurities.

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From these results, Examples 3-9, 12-18,
As shown in 20-25 , 30-33 , 5% Fe in Cu
If the content of P is 0.01% or more and 0.95% or less, the properties required for copper alloys for electronic devices such as lead frames, hardness (Hv) 140 or more, and electrical conductivity 30% I
A material satisfying ACS or more and solder heat resistance of 250 hours or more can be obtained.

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Examples 3 to 9, 14 to 16, 20 to 2
As shown in Nos. 5 , 27 to 33 and 39 to 44 , materials having predetermined characteristics can be obtained by processing by any of the methods A to D shown in Table 1.

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[0033]

[Table 1]

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[0035]

[Table 3]

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[0036]

[Table 4]

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Akira Maeda 8-1-1 Tsukaguchihonmachi, Amagasaki City Mitsubishi Electric Corporation Material Device Research Center (72) Inventor Keizo Kitakaze 8-1-1 Tsukaguchihonmachi, Amagasaki Mitsubishi Electric Device Co., Ltd. Material Device Research Center

Claims (13)

[Claims] 1. Fe of 5 to 12% by weight and P of 0.01 to
1.0% by weight and / or Zn of 0.01 to 1.0% by weight
A copper alloy for electronic devices, characterized in that it contains Cu, and the balance is Cu and unavoidable impurities. 2. One or more of Si, Mn and Mg in a total amount of 0.01 to 0.1% by weight or Al, Pb, As,
One or more of Sb, B, Co, Te, In, Ti, Zr, Hf, Ag, and Ge, 0.001 to 1.0% by weight in total, and 5 to 12% by weight of Fe, A copper alloy for electronic devices, wherein the balance is Cu and inevitable impurities. 3. The copper alloy for electronic devices according to claim 2, which contains 0.01 to 1.0% by weight of P and / or 0.01 to 1.0% by weight of Zn. 4. A copper alloy for electronic equipment, characterized in that at least 5% by weight of Fe is added to Cu, dissolved, and then solidified by rapid solidification at a rate of 100 ° C./sec or more. 5. At least 5 wt% Fe is added to Cu,
A method for producing a copper alloy for electronic devices, characterized by solidifying by melting and then rapidly solidifying at a rate of 100 ° C./second or more. 6. Cu in an amount of 5 to 12% by weight and Fe in an amount of 0.0
A method for producing a copper alloy for electronic devices, which comprises melting 1 to 1.0% by weight and / or 0.01 to 1.0% by weight of Zn and then solidifying. 7. The method for producing a copper alloy for electronic devices according to claim 1, wherein after melting, the alloy is solidified by rapid solidification at a rate of 100 ° C./second or more. 8. One or two of Si, Mn, and Mg is added to Cu.
0.01 to 1.0% by weight in total, and / or A
l, Pb, As, Sb, B, Co, Te, In, Ti, Zr, H
One or two or more of f, Ag and Ge in total 0.001
A method for producing a copper alloy for an electronic device, comprising: melting 1.0 wt% to 1.0 wt% and Fe 5 to 12 wt% and then solidifying. 9. The production of a copper alloy for electronic equipment according to claim 8, wherein 0.01 to 1.0% by weight of P and / or 0.01 to 1.0% by weight of Zn are added. Method. 10. The method for producing a copper alloy for electronic equipment according to claim 5, wherein Zn is added in an amount of 0.01 to 1.0% by weight. 11. Before the finish rolling of the ingot produced by the production method according to any one of claims 5 to 10,
A method for producing a copper alloy for electronic devices, comprising a step of heating in a temperature range of 00 ° C to 800 ° C for 1 minute or more and cold rolling. 12. Before the finish rolling of the ingot produced by the production method according to any one of claims 5 to 10,
A method for producing a copper alloy for electronic devices, comprising a step of heating in a temperature range of 00 ° C to 800 ° C for 1 minute or more, cold rolling, and then heating in a temperature range of 250 to 500 ° C for 10 minutes or more. . 13. Before the finish rolling of the ingot produced by the production method according to any one of claims 5 to 10,
It is characterized by heating at 00 ° C to 1000 ° C for 1 minute or more and quenching in water or oil, and heating at a temperature range of 350 to 500 ° C for 10 minutes or more regardless of the subsequent cold working. , A method for manufacturing a copper alloy for electronic devices.