JPS6121293B2 - - Google Patents
Info
- Publication number
- JPS6121293B2 JPS6121293B2 JP40880A JP40880A JPS6121293B2 JP S6121293 B2 JPS6121293 B2 JP S6121293B2 JP 40880 A JP40880 A JP 40880A JP 40880 A JP40880 A JP 40880A JP S6121293 B2 JPS6121293 B2 JP S6121293B2
- Authority
- JP
- Japan
- Prior art keywords
- conductivity
- magnetism
- alloy
- wire
- content
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000005389 magnetism Effects 0.000 claims description 12
- 229910052742 iron Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 7
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 24
- 229910045601 alloy Inorganic materials 0.000 description 13
- 239000000956 alloy Substances 0.000 description 13
- 230000005291 magnetic effect Effects 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005491 wire drawing Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005294 ferromagnetic effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/43—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/43—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/43—Manufacturing methods
- H01L2224/438—Post-treatment of the connector
- H01L2224/43848—Thermal treatments, e.g. annealing, controlled cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45147—Copper (Cu) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/4554—Coating
- H01L2224/45565—Single coating layer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Conductive Materials (AREA)
Description
本発明は磁性を有し、かつ導電性の優れたリー
ド線用銅合金に関するものである。
銅合金線は導電材料としてダイオード、抵抗、
コンデンサー等各種電子部品のリード線に多量に
使用されているが、最近電子部品の製造コストを
低減するため、組立作業の自動化の傾向が著し
く、これら部品とリード線との接続作業において
も電磁石を使用してその自動化が試みられてい
る。このため磁性を有しかつ導電性の優れたリー
ド線が要求され、鉄線上にCuを被覆した銅覆鉄
線などが用いられている。
しかるにこの銅覆鉄線は鉄線上に銅をクラツド
法又はメツキ法で被覆した後伸線加工を加えて製
造されるため、製造コストがかなり高い欠点があ
り、比較的低コストで製造可能な磁性を有し、か
つ導電性の優れたリード線の開発が望まれてい
る。
本発明はこれに鑑み種々研究の結果比較的低コ
ストで製造可能な磁性と優れた導電性とを有する
リード線用銅合金を開発ししもので、Fe1.5〜
15wt％とｐを0.1〜3.5wt％の範囲内で、かつ
Fe／ｐの比で４以上を含み、残部Cuからなるこ
とを特徴とするものである。
即ち本発明はCuにFeとｐを添加した合金で、
通常の伸線加工における熱処理と加工の繰返しに
より、強磁性を有するFeとｐの化合物を析出
し、Fe単独添加の場合に比較し、はるかに優れ
た磁性と導電性を示す。磁性はFe含量に応じて
強くなるも、ｐの添加によりFeとｐの化合物を
析出して更に磁性を高めるばかりか、Feの析出
を促進して導電性を向上せしめたものである。
しかしてFe含有量を1.5〜15wt％と限定した理
由は、1.5wt％未満では磁性が不充分であり、
15wt％を越えると合金の加工性が低下するばか
りか導電性も低下するためである。またｐ含有量
を0.1〜3wt％の範囲で、かつFe／ｐの比で４以
上と限定した理由は0.1wt％未満では磁性及び導
電率の向上が不充分であり、3.5wt％を越えても
Fe／ｐが４未満でも添加したｐの１部がFeとの
化合物を形成せずにCu中に固溶し、導電率を低
下すると共に加工性が悪くなるためである。
以下本発明の実施例について説明する。
高周波溶解炉を用いてCuを溶解し、これにFe
を添加してからｐを添加した後25mm角の金型に鋳
造し第１表に示す合金組成の鋳塊を得た。これを
20mm角に面削した後900℃に加熱して直径８mmま
で熱間溝ロール圧延を行なつた。
次にこの材料を直径４mmと２mmで550℃×１時
間の中間焼鈍を加えて直径１mmまで伸線加工し、
更に550℃×１時間の最終焼鈍を加えた線材につ
いて磁性、導電率、引張強さ及び伸びを測定し
た。また前記伸線加工の際の断線の有無を観察し
た。これらの結果を第２表に示す。
尚磁性としては、電磁石の下方10mmの位置に、
直径１mm、長さ50mmの試料を置き、電磁石の磁界
の強さを次第に増加させて行き、試料が電磁石に
吸引される際の磁界の強さを測定した。
The present invention relates to a copper alloy for lead wires that is magnetic and has excellent conductivity. Copper alloy wire is used as a conductive material for diodes, resistors,
They are used in large quantities in the lead wires of various electronic components such as capacitors, but in order to reduce the manufacturing cost of electronic components, there is a marked trend toward automation of assembly work, and electromagnets are also used in the work of connecting these components and lead wires. Attempts are being made to automate it using For this reason, lead wires that are magnetic and have excellent conductivity are required, and copper-covered iron wires, which are copper coated iron wires, are used. However, this copper-clad iron wire is manufactured by coating the iron wire with copper using a cladding method or plating method and then drawing the wire, which has the drawback that the manufacturing cost is quite high. It is desired to develop a lead wire with excellent conductivity. In view of this, as a result of various researches, the present invention has developed a copper alloy for lead wires that can be manufactured at a relatively low cost and has excellent conductivity and magnetism.
15wt% and p within the range of 0.1 to 3.5wt%, and
It is characterized by containing an Fe/p ratio of 4 or more, with the remainder being Cu. That is, the present invention is an alloy in which Fe and p are added to Cu,
Through repeated heat treatment and processing in normal wire drawing processing, a ferromagnetic compound of Fe and p is precipitated, and it exhibits far superior magnetism and conductivity compared to the case where only Fe is added. Although the magnetism becomes stronger as the Fe content increases, the addition of p not only precipitates a compound of Fe and p to further increase the magnetism, but also promotes the precipitation of Fe and improves the conductivity. However, the reason why the Fe content was limited to 1.5 to 15wt% is that less than 1.5wt% has insufficient magnetism.
This is because if it exceeds 15 wt%, not only the workability of the alloy decreases but also the conductivity. In addition, the reason why the P content was limited to a range of 0.1 to 3 wt% and the Fe/P ratio was 4 or more is that if it is less than 0.1 wt%, the improvement in magnetism and electrical conductivity is insufficient, and if it exceeds 3.5 wt%, too
This is because even if Fe/p is less than 4, a part of the added p will be dissolved in Cu without forming a compound with Fe, lowering the electrical conductivity and worsening workability. Examples of the present invention will be described below. Cu is melted using a high frequency melting furnace, and Fe is added to it.
After adding p and then casting into a 25 mm square mold, an ingot having the alloy composition shown in Table 1 was obtained. this
After face cutting to a 20 mm square, it was heated to 900°C and hot groove rolled to a diameter of 8 mm. Next, this material was subjected to intermediate annealing at 550°C for 1 hour at diameters of 4 mm and 2 mm, and wire-drawn to a diameter of 1 mm.
Further, the wire rod was subjected to final annealing at 550°C for 1 hour, and its magnetism, electrical conductivity, tensile strength, and elongation were measured. Also, the presence or absence of wire breakage during the wire drawing process was observed. These results are shown in Table 2. As for magnetism, at a position 10mm below the electromagnet,
A sample with a diameter of 1 mm and a length of 50 mm was placed, the strength of the magnetic field of the electromagnet was gradually increased, and the strength of the magnetic field when the sample was attracted to the electromagnet was measured.
【表】【table】
【表】【table】
【表】
第２表から判るように、本発明合金No.１〜17は
何れも導電率が55％IACS以上で磁性を有してお
り、本発明合金No.１〜３と比較合金No.19〜21、本
発明合金No.８〜10と比較合金No.22〜24、本発明合
金No.11〜13と比較合金No.25〜27を対比すれば明ら
かなようにｐの添加によつて磁性と導電率が著し
く改善されている。
しかして比較合金No.18のようにFe含有量が
1.5wt％未満のものは磁性が弱く、No.30のように
Fe含有量が15wt％を越えるものは導電率と加工
性が劣り、更にｐを添加したものでもｐ含有量が
0.1wt％未満（No.20，23，26及び28）及びｐ含有
量が3.5wt％を越えるもの（No.29）、更にはFe／
ｐの比が４未満のもの（No.21，24，27，29）は何
れも磁性と導電率が劣り加工性も悪いことが判
る。
本発明合金は磁性1850Oe、導電率73％IACSか
ら磁性900Oe、導電率57％IACGのもので、通常
電気メーカーで部品の自動組立に使用している電
磁石は最も強力なもので、磁界の強さが2000Oe
程度であるから、何れも使用可能であり目的用途
に応じて選択使用すればよい。特にFe含有量が
5wt％以上のものは500Oe程度の磁界の強さで吸
引が可能となり、導電率も55〜66％IACSと優れ
ている。従つて電磁石を小型化して自動組立装置
のコストダウンを図ることができる。
このように本発明合金は電磁石による自動組立
に必要な磁性を有し、かつ導電率が55％IACS以
上と優れたもので、電子部品産業において顕著な
効果を奏するものである。[Table] As can be seen from Table 2, the present invention alloys No. 1 to 17 all have electrical conductivity of 55% IACS or higher and are magnetic, and the present invention alloys No. 1 to 3 and the comparative alloy No. Comparing Invention Alloys Nos. 8 to 10 and Comparative Alloys Nos. 22 to 24, and Invention Alloys Nos. 11 to 13 and Comparative Alloys Nos. 25 to 27, it is clear that the addition of p Magnetism and electrical conductivity are significantly improved. However, as in Comparative Alloy No. 18, the Fe content is
Those with less than 1.5wt% have weak magnetic properties, such as No.30.
Those with Fe content exceeding 15wt% have poor conductivity and processability, and even those with P added have low P content.
Those with a p content of less than 0.1wt% (No. 20, 23, 26 and 28) and those with a p content of more than 3.5wt% (No. 29), as well as Fe/
It can be seen that those with a p ratio of less than 4 (Nos. 21, 24, 27, and 29) have poor magnetism and conductivity, and poor workability. The alloy of the present invention has a magnetic field of 1850 Oe and a conductivity of 73% IACS to a magnetic field of 900 Oe and a conductivity of 57% IACG. is 2000Oe
Therefore, any of them can be used and should be selected and used depending on the intended use. Especially the Fe content
Those with a concentration of 5wt% or more can be attracted with a magnetic field strength of about 500Oe, and have an excellent electrical conductivity of 55 to 66% IACS. Therefore, it is possible to downsize the electromagnet and reduce the cost of the automatic assembly device. As described above, the alloy of the present invention has the magnetism necessary for automatic assembly using an electromagnet, and has an excellent electrical conductivity of 55% IACS or higher, and has a remarkable effect in the electronic component industry.
Claims (1)
で、Fe／ｐの比で４以上を含み、残部Cuからな
る磁性を有するリード線用銅合金。1. A copper alloy for lead wires having magnetism, containing 1.5 to 15 wt% Fe and 0.1 to 3.5 wt% P, with a Fe/p ratio of 4 or more, and the balance being Cu.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP40880A JPS5698440A (en) | 1980-01-07 | 1980-01-07 | Copper alloy for lead wire having magnetism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP40880A JPS5698440A (en) | 1980-01-07 | 1980-01-07 | Copper alloy for lead wire having magnetism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5698440A JPS5698440A (en) | 1981-08-07 |
| JPS6121293B2 true JPS6121293B2 (en) | 1986-05-26 |
Family
ID=11472967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP40880A Granted JPS5698440A (en) | 1980-01-07 | 1980-01-07 | Copper alloy for lead wire having magnetism |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5698440A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0718355A (en) * | 1993-06-30 | 1995-01-20 | Mitsubishi Electric Corp | Copper alloy for electronic appliance and its production |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5270675A (en) * | 1989-11-13 | 1993-12-14 | Mitsubishi Denki Kabushiki Kaisha | Highly conductive magnetic material |
| JP2001295011A (en) * | 2000-04-05 | 2001-10-26 | Hitachi Cable Ltd | Bending resistant copper alloy wire and cable using the same |
| CN104988350B (en) * | 2015-07-30 | 2016-09-28 | 张连仲 | A kind of high ductibility copper-iron alloy and preparation method thereof and copper-iron alloy silk material |
| CN105177344B (en) * | 2015-07-30 | 2017-01-11 | 张连仲 | Cu-Fe alloy wire and preparing method thereof |
-
1980
- 1980-01-07 JP JP40880A patent/JPS5698440A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0718355A (en) * | 1993-06-30 | 1995-01-20 | Mitsubishi Electric Corp | Copper alloy for electronic appliance and its production |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5698440A (en) | 1981-08-07 |
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