JPH0422978B2 - - Google Patents
Info
- Publication number
- JPH0422978B2 JPH0422978B2 JP62013080A JP1308087A JPH0422978B2 JP H0422978 B2 JPH0422978 B2 JP H0422978B2 JP 62013080 A JP62013080 A JP 62013080A JP 1308087 A JP1308087 A JP 1308087A JP H0422978 B2 JPH0422978 B2 JP H0422978B2
- Authority
- JP
- Japan
- Prior art keywords
- content
- lead frame
- properties
- alloy
- materials
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 25
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 11
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 5
- 239000012535 impurity Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 description 9
- 238000004080 punching Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 5
- 238000007747 plating Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1308087A JPS63183143A (ja) | 1987-01-22 | 1987-01-22 | 半導体装置用Ｃｕ合金製リ−ドフレ−ム材 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1308087A JPS63183143A (ja) | 1987-01-22 | 1987-01-22 | 半導体装置用Ｃｕ合金製リ−ドフレ−ム材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63183143A JPS63183143A (ja) | 1988-07-28 |
| JPH0422978B2 true JPH0422978B2 (es) | 1992-04-21 |
Family
ID=11823187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1308087A Granted JPS63183143A (ja) | 1987-01-22 | 1987-01-22 | 半導体装置用Ｃｕ合金製リ−ドフレ−ム材 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63183143A (es) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07116536B2 (ja) * | 1989-02-10 | 1995-12-13 | 三菱伸銅株式会社 | 高強度Ｃｕ合金 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63109133A (ja) * | 1986-10-23 | 1988-05-13 | Furukawa Electric Co Ltd:The | 電子機器用銅合金とその製造法 |
-
1987
- 1987-01-22 JP JP1308087A patent/JPS63183143A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63109133A (ja) * | 1986-10-23 | 1988-05-13 | Furukawa Electric Co Ltd:The | 電子機器用銅合金とその製造法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63183143A (ja) | 1988-07-28 |
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