KR930012117U - 반도체 패키지 - Google Patents

반도체 패키지

Info

Publication number
KR930012117U
KR930012117U KR2019910019458U KR910019458U KR930012117U KR 930012117 U KR930012117 U KR 930012117U KR 2019910019458 U KR2019910019458 U KR 2019910019458U KR 910019458 U KR910019458 U KR 910019458U KR 930012117 U KR930012117 U KR 930012117U
Authority
KR
South Korea
Prior art keywords
semiconductor package
package
semiconductor
Prior art date
Application number
KR2019910019458U
Other languages
English (en)
Other versions
KR940007757Y1 (ko
Inventor
차기본
Original Assignee
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 금성일렉트론 주식회사 filed Critical 금성일렉트론 주식회사
Priority to KR2019910019458U priority Critical patent/KR940007757Y1/ko
Priority to US07/970,771 priority patent/US5363279A/en
Priority to JP078208U priority patent/JPH0546045U/ja
Priority to DE4238646A priority patent/DE4238646B4/de
Publication of KR930012117U publication Critical patent/KR930012117U/ko
Application granted granted Critical
Publication of KR940007757Y1 publication Critical patent/KR940007757Y1/ko
Priority to US08/748,460 priority patent/USRE36097E/en
Priority to JP9254578A priority patent/JPH1093001A/ja
Priority to US09/152,702 priority patent/USRE37413E1/en

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Classifications

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • Y10T29/49172—Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material
KR2019910019458U 1991-11-14 1991-11-14 반도체 패키지 KR940007757Y1 (ko)

Priority Applications (7)

Application Number Priority Date Filing Date Title
KR2019910019458U KR940007757Y1 (ko) 1991-11-14 1991-11-14 반도체 패키지
US07/970,771 US5363279A (en) 1991-11-14 1992-11-03 Semiconductor package for a semiconductor chip having centrally located bottom bond pads
JP078208U JPH0546045U (ja) 1991-11-14 1992-11-13 半導体パツケージ
DE4238646A DE4238646B4 (de) 1991-11-14 1992-11-16 Halbleiter-Bauelement mit spezieller Anschlusskonfiguration
US08/748,460 USRE36097E (en) 1991-11-14 1996-11-08 Semiconductor package for a semiconductor chip having centrally located bottom bond pads
JP9254578A JPH1093001A (ja) 1991-11-14 1997-09-19 半導体パッケージおよびその製造方法
US09/152,702 USRE37413E1 (en) 1991-11-14 1998-09-14 Semiconductor package for a semiconductor chip having centrally located bottom bond pads

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019910019458U KR940007757Y1 (ko) 1991-11-14 1991-11-14 반도체 패키지

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KR930012117U true KR930012117U (ko) 1993-06-25
KR940007757Y1 KR940007757Y1 (ko) 1994-10-24

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US (3) US5363279A (ko)
JP (2) JPH0546045U (ko)
KR (1) KR940007757Y1 (ko)
DE (1) DE4238646B4 (ko)

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Publication number Publication date
USRE36097E (en) 1999-02-16
DE4238646A1 (en) 1993-06-03
US5363279A (en) 1994-11-08
DE4238646B4 (de) 2006-11-16
JPH0546045U (ja) 1993-06-18
JPH1093001A (ja) 1998-04-10
KR940007757Y1 (ko) 1994-10-24
USRE37413E1 (en) 2001-10-16

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