KR930003589U - 반도체 패키지용 캐리어 - Google Patents

반도체 패키지용 캐리어

Info

Publication number
KR930003589U
KR930003589U KR2019910010831U KR910010831U KR930003589U KR 930003589 U KR930003589 U KR 930003589U KR 2019910010831 U KR2019910010831 U KR 2019910010831U KR 910010831 U KR910010831 U KR 910010831U KR 930003589 U KR930003589 U KR 930003589U
Authority
KR
South Korea
Prior art keywords
carrier
semiconductor package
package
semiconductor
Prior art date
Application number
KR2019910010831U
Other languages
English (en)
Other versions
KR940006179Y1 (ko
Inventor
김대성
Original Assignee
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 금성일렉트론 주식회사 filed Critical 금성일렉트론 주식회사
Priority to KR2019910010831U priority Critical patent/KR940006179Y1/ko
Priority to DE4204819A priority patent/DE4204819C2/de
Priority to JP1992023355U priority patent/JP2522047Y2/ja
Publication of KR930003589U publication Critical patent/KR930003589U/ko
Priority to US08/095,045 priority patent/US5296741A/en
Application granted granted Critical
Publication of KR940006179Y1 publication Critical patent/KR940006179Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D83/00—Containers or packages with special means for dispensing contents
    • B65D83/04—Containers or packages with special means for dispensing contents for dispensing annular, disc-shaped, or spherical or like small articles, e.g. tablets or pills

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
KR2019910010831U 1991-07-13 1991-07-13 반도체 패키지용 캐리어 KR940006179Y1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR2019910010831U KR940006179Y1 (ko) 1991-07-13 1991-07-13 반도체 패키지용 캐리어
DE4204819A DE4204819C2 (de) 1991-07-13 1992-02-18 Träger für Packen von Halbleiter-Bauelementen
JP1992023355U JP2522047Y2 (ja) 1991-07-13 1992-04-13 半導体パッケージ用キャリア
US08/095,045 US5296741A (en) 1991-07-13 1993-07-22 Carrier for semiconductor element packages

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019910010831U KR940006179Y1 (ko) 1991-07-13 1991-07-13 반도체 패키지용 캐리어

Publications (2)

Publication Number Publication Date
KR930003589U true KR930003589U (ko) 1993-02-26
KR940006179Y1 KR940006179Y1 (ko) 1994-09-10

Family

ID=19316431

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019910010831U KR940006179Y1 (ko) 1991-07-13 1991-07-13 반도체 패키지용 캐리어

Country Status (4)

Country Link
US (1) US5296741A (ko)
JP (1) JP2522047Y2 (ko)
KR (1) KR940006179Y1 (ko)
DE (1) DE4204819C2 (ko)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0750762B2 (ja) * 1992-12-18 1995-05-31 山一電機株式会社 Ｉｃキャリア
JPH0750763B2 (ja) * 1992-12-22 1995-05-31 山一電機株式会社 Ｉｃキャリア
JPH0763082B2 (ja) * 1993-02-15 1995-07-05 山一電機株式会社 Ｉｃキャリア
JPH0831544B2 (ja) * 1993-06-29 1996-03-27 山一電機株式会社 Ｉｃキャリア
JPH07240479A (ja) 1993-09-21 1995-09-12 Texas Instr Inc <Ti> 集積回路パッケージ化の方法およびパッケージ
US5798286A (en) * 1995-09-22 1998-08-25 Tessera, Inc. Connecting multiple microelectronic elements with lead deformation
JP2709283B2 (ja) * 1995-04-07 1998-02-04 山一電機株式会社 Ｉｃキャリア
US6433413B1 (en) 2001-08-17 2002-08-13 Micron Technology, Inc. Three-dimensional multichip module
US6747347B2 (en) * 2001-08-30 2004-06-08 Micron Technology, Inc. Multi-chip electronic package and cooling system
US6686654B2 (en) * 2001-08-31 2004-02-03 Micron Technology, Inc. Multiple chip stack structure and cooling system
DE10241450A1 (de) * 2002-09-06 2004-03-18 Robert Bosch Gmbh Verfahren zur Herstellung eines Bauteils mit einem Sensorelement, insbesondere eines Verformungssensors
JP2009096523A (ja) * 2007-10-17 2009-05-07 Panasonic Corp 電子部品の搬送フレームおよび電子部品の製造方法
CN104605599B (zh) * 2015-02-12 2016-04-13 京东方科技集团股份有限公司 一种ic盘盒

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4193656A (en) * 1978-12-20 1980-03-18 Amp Incorporated Extraction device for extracting a DIP from a DIP header
JPS59146955U (ja) * 1983-03-22 1984-10-01 山一電機工業株式会社 被接続器体取り出し装置付接続器
US5131535A (en) * 1986-06-27 1992-07-21 Symtek Systems, Inc. Electrical device transport medium
US4750890A (en) * 1987-06-18 1988-06-14 The J. M. Ney Company Test socket for an integrated circuit package
DE3729593A1 (de) * 1987-09-04 1989-03-16 Henkel Kgaa Vorrichtung zur entnahme von tabletten, insbesondere mehrkomponenten-tabletten, aus einem tablettenband
JP2593218B2 (ja) * 1989-03-23 1997-03-26 山一電機工業株式会社 Ｉｃソケットにおけるｉｃ取り出し機構
JPH02307243A (ja) * 1989-05-22 1990-12-20 Nec Corp 半導体基板取出装置

Also Published As

Publication number Publication date
JPH0519187U (ja) 1993-03-09
JP2522047Y2 (ja) 1997-01-08
DE4204819A1 (de) 1993-01-14
KR940006179Y1 (ko) 1994-09-10
DE4204819C2 (de) 1994-06-09
US5296741A (en) 1994-03-22

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