KR930024367U - 반도체 패키지 - Google Patents

반도체 패키지

Info

Publication number
KR930024367U
KR930024367U KR2019920006142U KR920006142U KR930024367U KR 930024367 U KR930024367 U KR 930024367U KR 2019920006142 U KR2019920006142 U KR 2019920006142U KR 920006142 U KR920006142 U KR 920006142U KR 930024367 U KR930024367 U KR 930024367U
Authority
KR
South Korea
Prior art keywords
semiconductor package
package
semiconductor
Prior art date
Application number
KR2019920006142U
Other languages
English (en)
Other versions
KR940008290Y1 (ko
Inventor
차기본
Original Assignee
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 금성일렉트론 주식회사 filed Critical 금성일렉트론 주식회사
Priority to KR92006142U priority Critical patent/KR940008290Y1/ko
Publication of KR930024367U publication Critical patent/KR930024367U/ko
Application granted granted Critical
Publication of KR940008290Y1 publication Critical patent/KR940008290Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
KR92006142U 1992-04-14 1992-04-14 반도체 패키지 KR940008290Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR92006142U KR940008290Y1 (ko) 1992-04-14 1992-04-14 반도체 패키지

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR92006142U KR940008290Y1 (ko) 1992-04-14 1992-04-14 반도체 패키지

Publications (2)

Publication Number Publication Date
KR930024367U true KR930024367U (ko) 1993-11-27
KR940008290Y1 KR940008290Y1 (ko) 1994-12-08

Family

ID=19331713

Family Applications (1)

Application Number Title Priority Date Filing Date
KR92006142U KR940008290Y1 (ko) 1992-04-14 1992-04-14 반도체 패키지

Country Status (1)

Country Link
KR (1) KR940008290Y1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100319310B1 (ko) * 1998-06-15 2002-04-22 이병재 차량용핸즈프리장치

Also Published As

Publication number Publication date
KR940008290Y1 (ko) 1994-12-08

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