KR960025455U - 반도체 패키지 - Google Patents

반도체 패키지

Info

Publication number
KR960025455U
KR960025455U KR2019940036184U KR19940036184U KR960025455U KR 960025455 U KR960025455 U KR 960025455U KR 2019940036184 U KR2019940036184 U KR 2019940036184U KR 19940036184 U KR19940036184 U KR 19940036184U KR 960025455 U KR960025455 U KR 960025455U
Authority
KR
South Korea
Prior art keywords
semiconductor package
package
semiconductor
Prior art date
Application number
KR2019940036184U
Other languages
English (en)
Other versions
KR0119757Y1 (ko
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to KR2019940036184U priority Critical patent/KR0119757Y1/ko
Publication of KR960025455U publication Critical patent/KR960025455U/ko
Application granted granted Critical
Publication of KR0119757Y1 publication Critical patent/KR0119757Y1/ko

Links

KR2019940036184U 1994-12-27 1994-12-27 반도체 패키지 KR0119757Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940036184U KR0119757Y1 (ko) 1994-12-27 1994-12-27 반도체 패키지

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940036184U KR0119757Y1 (ko) 1994-12-27 1994-12-27 반도체 패키지

Publications (2)

Publication Number Publication Date
KR960025455U true KR960025455U (ko) 1996-07-22
KR0119757Y1 KR0119757Y1 (ko) 1998-07-01

Family

ID=60853078

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940036184U KR0119757Y1 (ko) 1994-12-27 1994-12-27 반도체 패키지

Country Status (1)

Country Link
KR (1) KR0119757Y1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030045612A (ko) * 2001-12-03 2003-06-11 샤프 가부시키가이샤 반도체 모듈과 그 제조 방법 및 ｉｃ 카드 등을 위한 모듈

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100456816B1 (ko) * 2000-06-13 2004-11-10 앰코 테크놀로지 코리아 주식회사 반도체 패키지
KR102178826B1 (ko) * 2013-04-05 2020-11-13 삼성전자 주식회사 히트 스프레더를 갖는 반도체 패키지 및 그 형성 방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030045612A (ko) * 2001-12-03 2003-06-11 샤프 가부시키가이샤 반도체 모듈과 그 제조 방법 및 ｉｃ 카드 등을 위한 모듈

Also Published As

Publication number Publication date
KR0119757Y1 (ko) 1998-07-01

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