KR960015635U - 반도체패키지 - Google Patents

반도체패키지

Info

Publication number
KR960015635U
KR960015635U KR2019940028227U KR19940028227U KR960015635U KR 960015635 U KR960015635 U KR 960015635U KR 2019940028227 U KR2019940028227 U KR 2019940028227U KR 19940028227 U KR19940028227 U KR 19940028227U KR 960015635 U KR960015635 U KR 960015635U
Authority
KR
South Korea
Prior art keywords
semiconductor package
package
semiconductor
Prior art date
Application number
KR2019940028227U
Other languages
English (en)
Other versions
KR200171663Y1 (ko
Inventor
변광유
Original Assignee
현대전자산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업주식회사 filed Critical 현대전자산업주식회사
Priority to KR2019940028227U priority Critical patent/KR200171663Y1/ko
Publication of KR960015635U publication Critical patent/KR960015635U/ko
Application granted granted Critical
Publication of KR200171663Y1 publication Critical patent/KR200171663Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
KR2019940028227U 1994-10-27 1994-10-27 반도체패키지 KR200171663Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940028227U KR200171663Y1 (ko) 1994-10-27 1994-10-27 반도체패키지

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940028227U KR200171663Y1 (ko) 1994-10-27 1994-10-27 반도체패키지

Publications (2)

Publication Number Publication Date
KR960015635U true KR960015635U (ko) 1996-05-17
KR200171663Y1 KR200171663Y1 (ko) 2000-03-02

Family

ID=19396571

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940028227U KR200171663Y1 (ko) 1994-10-27 1994-10-27 반도체패키지

Country Status (1)

Country Link
KR (1) KR200171663Y1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101591643B1 (ko) 2012-02-22 2016-02-05 미쓰비시덴키 가부시키가이샤 반도체장치 및 반도체장치의 제조방법

Also Published As

Publication number Publication date
KR200171663Y1 (ko) 2000-03-02

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