KR960006374U - 반도체 패키지 - Google Patents

반도체 패키지

Info

Publication number
KR960006374U
KR960006374U KR2019940016958U KR19940016958U KR960006374U KR 960006374 U KR960006374 U KR 960006374U KR 2019940016958 U KR2019940016958 U KR 2019940016958U KR 19940016958 U KR19940016958 U KR 19940016958U KR 960006374 U KR960006374 U KR 960006374U
Authority
KR
South Korea
Prior art keywords
semiconductor package
package
semiconductor
Prior art date
Application number
KR2019940016958U
Other languages
English (en)
Other versions
KR0113174Y1 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to KR94016958U priority Critical patent/KR0113174Y1/ko
Publication of KR960006374U publication Critical patent/KR960006374U/ko
Application granted granted Critical
Publication of KR0113174Y1 publication Critical patent/KR0113174Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
KR94016958U 1994-07-08 1994-07-08 Semiconductor package KR0113174Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR94016958U KR0113174Y1 (en) 1994-07-08 1994-07-08 Semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR94016958U KR0113174Y1 (en) 1994-07-08 1994-07-08 Semiconductor package

Publications (2)

Publication Number Publication Date
KR960006374U true KR960006374U (ko) 1996-02-17
KR0113174Y1 KR0113174Y1 (en) 1998-04-10

Family

ID=19387960

Family Applications (1)

Application Number Title Priority Date Filing Date
KR94016958U KR0113174Y1 (en) 1994-07-08 1994-07-08 Semiconductor package

Country Status (1)

Country Link
KR (1) KR0113174Y1 (ko)

Also Published As

Publication number Publication date
KR0113174Y1 (en) 1998-04-10

Similar Documents

Publication Publication Date Title
DE69518935D1 (de) Halbleiterpackung
KR960012443A (ko) 반도체 패키지
KR960025455U (ko) 반도체 패키지
KR960015635U (ko) 반도체패키지
KR960012677U (ko) 반도체 패키지
KR960006383U (ko) 반도체 패키지
KR970056088U (ko) 반도체 패키지
KR970059871U (ko) 반도체 패키지
KR980005467U (ko) 반도체 패키지
KR960003142U (ko) 반도체 패키지
KR960025490U (ko) 반도체 패키지
KR960006384U (ko) 반도체 패키지
KR950034382U (ko) 반도체 패키지
KR950028707U (ko) 반도체 패키지
KR950025925U (ko) 반도체 패키지
KR960015629U (ko) 반도체 패키지
KR960015631U (ko) 반도체 패키지
KR960025473U (ko) 반도체 패키지
KR960006382U (ko) 반도체 패키지
KR960025493U (ko) 반도체 패키지
KR960025521U (ko) 반도체 패키지
KR960025523U (ko) 반도체 패키지
KR960025466U (ko) 반도체 패키지
KR960025464U (ko) 반도체 패키지
KR960006374U (ko) 반도체 패키지

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20081027

Year of fee payment: 12

EXPY Expiration of term