KR0113174Y1 - Semiconductor package - Google Patents

Semiconductor package Download PDF

Info

Publication number
KR0113174Y1
KR0113174Y1 KR94016958U KR19940016958U KR0113174Y1 KR 0113174 Y1 KR0113174 Y1 KR 0113174Y1 KR 94016958 U KR94016958 U KR 94016958U KR 19940016958 U KR19940016958 U KR 19940016958U KR 0113174 Y1 KR0113174 Y1 KR 0113174Y1
Authority
KR
South Korea
Prior art keywords
semiconductor package
package
semiconductor
Prior art date
Application number
KR94016958U
Other languages
Korean (ko)
Other versions
KR960006374U (en
Inventor
Sung-Chun Cho
Original Assignee
Lg Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lg Electronics Inc filed Critical Lg Electronics Inc
Priority to KR94016958U priority Critical patent/KR0113174Y1/en
Publication of KR960006374U publication Critical patent/KR960006374U/en
Application granted granted Critical
Publication of KR0113174Y1 publication Critical patent/KR0113174Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
KR94016958U 1994-07-08 1994-07-08 Semiconductor package KR0113174Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR94016958U KR0113174Y1 (en) 1994-07-08 1994-07-08 Semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR94016958U KR0113174Y1 (en) 1994-07-08 1994-07-08 Semiconductor package

Publications (2)

Publication Number Publication Date
KR960006374U KR960006374U (en) 1996-02-17
KR0113174Y1 true KR0113174Y1 (en) 1998-04-10

Family

ID=19387960

Family Applications (1)

Application Number Title Priority Date Filing Date
KR94016958U KR0113174Y1 (en) 1994-07-08 1994-07-08 Semiconductor package

Country Status (1)

Country Link
KR (1) KR0113174Y1 (en)

Also Published As

Publication number Publication date
KR960006374U (en) 1996-02-17

Similar Documents

Publication Publication Date Title
GB2310953B (en) Semiconductor package
GB9411626D0 (en) Package
GB2295488B (en) Semiconductor device
GB2292010B (en) Semiconductor device
EP0704897A3 (en) Semiconductor device
EP0720295A3 (en) Semiconductor device
GB9423423D0 (en) Semiconductor device
GB2292637B (en) Semiconductor device
GB2295272B (en) Semiconductor device
GB9525503D0 (en) Package
EP0697731A3 (en) Flat package for semiconductor IC
GB2290660B (en) Resin-sealed semiconductor device
GB9409579D0 (en) Packages
GB2296373B (en) Semiconductor device
GB9500174D0 (en) Surface-mount semiconductor package
GB2295051B (en) Semiconductor device
GB9402639D0 (en) Semiconductor device
EP0716445A3 (en) Semiconductor device
EP0691681A3 (en) Semiconductor packaging
GB2286719B (en) Semiconductor device
KR0113174Y1 (en) Semiconductor package
GB9413568D0 (en) Semiconductor devices
KR200161394Y1 (en) Semiconductor package
GB9414584D0 (en) Package
GB9409511D0 (en) Package

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20081027

Year of fee payment: 12

EXPY Expiration of term