KR200161394Y1 - Semiconductor package - Google Patents

Semiconductor package Download PDF

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Publication number
KR200161394Y1
KR200161394Y1 KR2019960000008U KR19960000008U KR200161394Y1 KR 200161394 Y1 KR200161394 Y1 KR 200161394Y1 KR 2019960000008 U KR2019960000008 U KR 2019960000008U KR 19960000008 U KR19960000008 U KR 19960000008U KR 200161394 Y1 KR200161394 Y1 KR 200161394Y1
Authority
KR
South Korea
Prior art keywords
semiconductor package
package
semiconductor
Prior art date
Application number
KR2019960000008U
Other languages
Korean (ko)
Inventor
Sam-Koon Jeong
Original Assignee
Hyundai Micro Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hyundai Micro Electronics Co filed Critical Hyundai Micro Electronics Co
Priority to KR2019960000008U priority Critical patent/KR200161394Y1/en
Application granted granted Critical
Publication of KR200161394Y1 publication Critical patent/KR200161394Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
KR2019960000008U 1996-01-03 1996-01-03 Semiconductor package KR200161394Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019960000008U KR200161394Y1 (en) 1996-01-03 1996-01-03 Semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019960000008U KR200161394Y1 (en) 1996-01-03 1996-01-03 Semiconductor package

Publications (1)

Publication Number Publication Date
KR200161394Y1 true KR200161394Y1 (en) 1999-11-15

Family

ID=19448968

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019960000008U KR200161394Y1 (en) 1996-01-03 1996-01-03 Semiconductor package

Country Status (1)

Country Link
KR (1) KR200161394Y1 (en)

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