TW423715U - Semiconductor package structure - Google Patents

Semiconductor package structure

Info

Publication number
TW423715U
TW423715U TW87211122U TW87211122U TW423715U TW 423715 U TW423715 U TW 423715U TW 87211122 U TW87211122 U TW 87211122U TW 87211122 U TW87211122 U TW 87211122U TW 423715 U TW423715 U TW 423715U
Authority
TW
Taiwan
Prior art keywords
semiconductor package
package structure
semiconductor
package
Prior art date
Application number
TW87211122U
Other languages
Chinese (zh)
Inventor
Rung-Tai Chen
Bing-Huang Jiang
Yi-Gung Jou
Jian-Ji Jau
Original Assignee
Ind Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Priority to TW87211122U priority Critical patent/TW423715U/en
Publication of TW423715U publication Critical patent/TW423715U/en

Links

TW87211122U 1998-07-10 1998-07-10 Semiconductor package structure TW423715U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW87211122U TW423715U (en) 1998-07-10 1998-07-10 Semiconductor package structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW87211122U TW423715U (en) 1998-07-10 1998-07-10 Semiconductor package structure

Publications (1)

Publication Number Publication Date
TW423715U true TW423715U (en) 2001-02-21

Family

ID=21634822

Family Applications (1)

Application Number Title Priority Date Filing Date
TW87211122U TW423715U (en) 1998-07-10 1998-07-10 Semiconductor package structure

Country Status (1)

Country Link
TW (1) TW423715U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI787149B (en) * 2015-06-24 2022-12-21 日月光半導體製造股份有限公司 Semiconductor package and method for manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI787149B (en) * 2015-06-24 2022-12-21 日月光半導體製造股份有限公司 Semiconductor package and method for manufacturing the same

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MK4K Expiration of patent term of a granted utility model