GB2355584B - Semiconductor decice - Google Patents

Semiconductor decice

Info

Publication number
GB2355584B
GB2355584B GB0101027A GB0101027A GB2355584B GB 2355584 B GB2355584 B GB 2355584B GB 0101027 A GB0101027 A GB 0101027A GB 0101027 A GB0101027 A GB 0101027A GB 2355584 B GB2355584 B GB 2355584B
Authority
GB
United Kingdom
Prior art keywords
decice
semiconductor
semiconductor decice
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0101027A
Other versions
GB0101027D0 (en
GB2355584A (en
Inventor
Tatsuhiko Fujihira
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority claimed from GB9701204A external-priority patent/GB2309336B/en
Publication of GB0101027D0 publication Critical patent/GB0101027D0/en
Publication of GB2355584A publication Critical patent/GB2355584A/en
Application granted granted Critical
Publication of GB2355584B publication Critical patent/GB2355584B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/7801DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/7816Lateral DMOS transistors, i.e. LDMOS transistors
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    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0603Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
    • H01L29/0607Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
    • H01L29/0611Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
    • H01L29/0615Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
    • H01L29/0619Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE] with a supplementary region doped oppositely to or in rectifying contact with the semiconductor containing or contacting region, e.g. guard rings with PN or Schottky junction
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    • H01L29/063Reduced surface field [RESURF] pn-junction structures
    • H01L29/0634Multiple reduced surface field (multi-RESURF) structures, e.g. double RESURF, charge compensation, cool, superjunction (SJ), 3D-RESURF, composite buffer (CB) structures
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    • H01L29/739Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
    • H01L29/7393Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
    • H01L29/7395Vertical transistors, e.g. vertical IGBT
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    • H01L29/7397Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions and a gate structure lying on a slanted or vertical surface or formed in a groove, e.g. trench gate IGBT
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    • H01L29/7809Vertical DMOS transistors, i.e. VDMOS transistors having both source and drain contacts on the same surface, i.e. Up-Drain VDMOS transistors
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    • H01L29/7824Lateral DMOS transistors, i.e. LDMOS transistors with a substrate comprising an insulating layer, e.g. SOI-LDMOS transistors
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    • H01L29/7825Lateral DMOS transistors, i.e. LDMOS transistors with trench gate electrode
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    • H01L29/7833Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's
    • H01L29/7835Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's with asymmetrical source and drain regions, e.g. lateral high-voltage MISFETs with drain offset region, extended drain MISFETs
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    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
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    • H01L29/78624Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure with LDD structure or an extension or an offset region or characterised by the doping profile the source and the drain regions being asymmetrical
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Thin Film Transistor (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
GB0101027A 1996-01-22 1997-01-21 Semiconductor decice Expired - Fee Related GB2355584B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP793596 1996-01-22
GB9701204A GB2309336B (en) 1996-01-22 1997-01-21 Semiconductor device

Publications (3)

Publication Number Publication Date
GB0101027D0 GB0101027D0 (en) 2001-02-28
GB2355584A GB2355584A (en) 2001-04-25
GB2355584B true GB2355584B (en) 2001-05-30

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Application Number Title Priority Date Filing Date
GB0101052A Withdrawn GB2355588A (en) 1996-01-22 1997-01-21 A vertical field effect transistor having a drift region
GB0101050A Expired - Fee Related GB2355587B (en) 1996-01-22 1997-01-21 Semiconductor device
GB0101031A Expired - Fee Related GB2355586B (en) 1996-01-22 1997-01-21 Semiconductor device
GB0101027A Expired - Fee Related GB2355584B (en) 1996-01-22 1997-01-21 Semiconductor decice
GB0101030A Expired - Fee Related GB2355585B (en) 1996-01-22 1997-01-21 Semiconductor device
GB0101055A Expired - Fee Related GB2355589B (en) 1996-01-22 1997-01-21 Semiconductor device

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Application Number Title Priority Date Filing Date
GB0101052A Withdrawn GB2355588A (en) 1996-01-22 1997-01-21 A vertical field effect transistor having a drift region
GB0101050A Expired - Fee Related GB2355587B (en) 1996-01-22 1997-01-21 Semiconductor device
GB0101031A Expired - Fee Related GB2355586B (en) 1996-01-22 1997-01-21 Semiconductor device

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GB0101030A Expired - Fee Related GB2355585B (en) 1996-01-22 1997-01-21 Semiconductor device
GB0101055A Expired - Fee Related GB2355589B (en) 1996-01-22 1997-01-21 Semiconductor device

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Publication number Priority date Publication date Assignee Title
JP3925253B2 (en) * 2002-03-15 2007-06-06 住友電気工業株式会社 Horizontal junction field effect transistor and method of manufacturing the same
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GB0101050D0 (en) 2001-02-28
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GB2355586B (en) 2001-05-30
GB0101030D0 (en) 2001-02-28

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