KR960006383U - 반도체 패키지 - Google Patents

반도체 패키지

Info

Publication number
KR960006383U
KR960006383U KR2019940016554U KR19940016554U KR960006383U KR 960006383 U KR960006383 U KR 960006383U KR 2019940016554 U KR2019940016554 U KR 2019940016554U KR 19940016554 U KR19940016554 U KR 19940016554U KR 960006383 U KR960006383 U KR 960006383U
Authority
KR
South Korea
Prior art keywords
semiconductor package
package
semiconductor
Prior art date
Application number
KR2019940016554U
Other languages
English (en)
Other versions
KR0113178Y1 (ko
Inventor
김동유
Original Assignee
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 금성일렉트론 주식회사 filed Critical 금성일렉트론 주식회사
Priority to KR2019940016554U priority Critical patent/KR0113178Y1/ko
Publication of KR960006383U publication Critical patent/KR960006383U/ko
Application granted granted Critical
Publication of KR0113178Y1 publication Critical patent/KR0113178Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR2019940016554U 1994-07-05 1994-07-05 반도체 패키지 KR0113178Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940016554U KR0113178Y1 (ko) 1994-07-05 1994-07-05 반도체 패키지

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940016554U KR0113178Y1 (ko) 1994-07-05 1994-07-05 반도체 패키지

Publications (2)

Publication Number Publication Date
KR960006383U true KR960006383U (ko) 1996-02-17
KR0113178Y1 KR0113178Y1 (ko) 1998-04-10

Family

ID=19387676

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940016554U KR0113178Y1 (ko) 1994-07-05 1994-07-05 반도체 패키지

Country Status (1)

Country Link
KR (1) KR0113178Y1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030013288A (ko) * 2001-07-31 2003-02-14 에누이씨 가꼬오부쯔 디바이스 가부시끼가이샤 수지봉지형 반도체장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030013288A (ko) * 2001-07-31 2003-02-14 에누이씨 가꼬오부쯔 디바이스 가부시끼가이샤 수지봉지형 반도체장치

Also Published As

Publication number Publication date
KR0113178Y1 (ko) 1998-04-10

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