KR960006382U - 반도체 패키지 - Google Patents

반도체 패키지

Info

Publication number
KR960006382U
KR960006382U KR2019940016357U KR19940016357U KR960006382U KR 960006382 U KR960006382 U KR 960006382U KR 2019940016357 U KR2019940016357 U KR 2019940016357U KR 19940016357 U KR19940016357 U KR 19940016357U KR 960006382 U KR960006382 U KR 960006382U
Authority
KR
South Korea
Prior art keywords
semiconductor package
package
semiconductor
Prior art date
Application number
KR2019940016357U
Other languages
English (en)
Other versions
KR0113176Y1 (ko
Inventor
이내정
Original Assignee
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 금성일렉트론 주식회사 filed Critical 금성일렉트론 주식회사
Priority to KR2019940016357U priority Critical patent/KR0113176Y1/ko
Publication of KR960006382U publication Critical patent/KR960006382U/ko
Application granted granted Critical
Publication of KR0113176Y1 publication Critical patent/KR0113176Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49565—Side rails of the lead frame, e.g. with perforations, sprocket holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Wire Bonding (AREA)
KR2019940016357U 1994-07-02 1994-07-02 반도체 패키지 KR0113176Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940016357U KR0113176Y1 (ko) 1994-07-02 1994-07-02 반도체 패키지

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940016357U KR0113176Y1 (ko) 1994-07-02 1994-07-02 반도체 패키지

Publications (2)

Publication Number Publication Date
KR960006382U true KR960006382U (ko) 1996-02-17
KR0113176Y1 KR0113176Y1 (ko) 1998-04-10

Family

ID=19387534

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940016357U KR0113176Y1 (ko) 1994-07-02 1994-07-02 반도체 패키지

Country Status (1)

Country Link
KR (1) KR0113176Y1 (ko)

Also Published As

Publication number Publication date
KR0113176Y1 (ko) 1998-04-10

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Legal Events

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E701 Decision to grant or registration of patent right
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Payment date: 20081027

Year of fee payment: 12

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