KR960012443A - 반도체 패키지 - Google Patents

반도체 패키지 Download PDF

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Publication number
KR960012443A
KR960012443A KR1019950032316A KR19950032316A KR960012443A KR 960012443 A KR960012443 A KR 960012443A KR 1019950032316 A KR1019950032316 A KR 1019950032316A KR 19950032316 A KR19950032316 A KR 19950032316A KR 960012443 A KR960012443 A KR 960012443A
Authority
KR
South Korea
Prior art keywords
semiconductor package
package
semiconductor
Prior art date
Application number
KR1019950032316A
Other languages
English (en)
Other versions
KR100248035B1 (ko
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of KR960012443A publication Critical patent/KR960012443A/ko
Application granted granted Critical
Publication of KR100248035B1 publication Critical patent/KR100248035B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
KR1019950032316A 1994-09-29 1995-09-28 반도체 패키지 KR100248035B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP94-235581 1994-09-29
JP23558194 1994-09-29

Publications (2)

Publication Number Publication Date
KR960012443A true KR960012443A (ko) 1996-04-20
KR100248035B1 KR100248035B1 (ko) 2000-03-15

Family

ID=16988121

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950032316A KR100248035B1 (ko) 1994-09-29 1995-09-28 반도체 패키지

Country Status (2)

Country Link
US (1) US5969413A (ko)
KR (1) KR100248035B1 (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5677566A (en) * 1995-05-08 1997-10-14 Micron Technology, Inc. Semiconductor chip package
US6225573B1 (en) * 1996-05-31 2001-05-01 Rohm Co., Ltd. Method for mounting terminal on circuit board and circuit board
JP3638750B2 (ja) * 1997-03-25 2005-04-13 株式会社ルネサステクノロジ 半導体装置
JP3460559B2 (ja) * 1997-12-12 2003-10-27 セイコーエプソン株式会社 半導体装置及びその製造方法、回路基板並びに電子機器
US20040108580A1 (en) * 2002-12-09 2004-06-10 Advanpack Solutions Pte. Ltd. Leadless semiconductor packaging structure with inverted flip chip and methods of manufacture
US7475964B2 (en) * 2004-08-06 2009-01-13 Hewlett-Packard Development Company, L.P. Electrical contact encapsulation
JP5555974B2 (ja) * 2007-11-27 2014-07-23 パナソニック株式会社 圧電デバイスとこれを用いた電子機器、及び自動車
US11901309B2 (en) * 2019-11-12 2024-02-13 Semiconductor Components Industries, Llc Semiconductor device package assemblies with direct leadframe attachment
CN114597188A (zh) * 2020-12-02 2022-06-07 新光电气工业株式会社 引线框架、半导体装置及引线框架的制造方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2582013B2 (ja) * 1991-02-08 1997-02-19 株式会社東芝 樹脂封止型半導体装置及びその製造方法
DE3587481T2 (de) * 1984-02-27 1993-12-16 Toshiba Kawasaki Kk Schaltungssubstrat mit hoher Wärmeleitfähigkeit.
US4878106A (en) * 1986-12-02 1989-10-31 Anton Piller Gmbh & Co. Kg Semiconductor circuit packages for use in high power applications and method of making the same
JPH01313969A (ja) * 1988-06-13 1989-12-19 Hitachi Ltd 半導体装置
JPH02174144A (ja) * 1988-12-26 1990-07-05 Sumitomo Electric Ind Ltd 半導体装置用パッケージ
JPH0373559A (ja) * 1989-08-15 1991-03-28 Mitsubishi Electric Corp 半導体装置及びその製造方法
JP2978511B2 (ja) * 1989-09-20 1999-11-15 株式会社日立製作所 集積回路素子実装構造体
JP2567491B2 (ja) * 1990-04-17 1996-12-25 住友電気工業株式会社 高熱伝導性着色窒化アルミニウム焼結体およびその製造方法
JPH04164361A (ja) * 1990-10-29 1992-06-10 Nec Corp 樹脂封止型半導体装置
JPH04192552A (ja) * 1990-11-27 1992-07-10 Nec Corp 半導体素子用パッケージ
US5293301A (en) * 1990-11-30 1994-03-08 Shinko Electric Industries Co., Ltd. Semiconductor device and lead frame used therein
US5111278A (en) * 1991-03-27 1992-05-05 Eichelberger Charles W Three-dimensional multichip module systems
US5250843A (en) * 1991-03-27 1993-10-05 Integrated System Assemblies Corp. Multichip integrated circuit modules
US5158912A (en) * 1991-04-09 1992-10-27 Digital Equipment Corporation Integral heatsink semiconductor package
US5165986A (en) * 1991-06-05 1992-11-24 Ferro Corporation Copper conductive composition for use on aluminum nitride substrate
JP2609382B2 (ja) * 1991-10-01 1997-05-14 三菱電機株式会社 半導体装置
JPH0828396B2 (ja) * 1992-01-31 1996-03-21 株式会社東芝 半導体装置
JP3322429B2 (ja) * 1992-06-04 2002-09-09 新光電気工業株式会社 半導体装置
JPH06163731A (ja) * 1992-11-17 1994-06-10 Toshiba Corp 半導体パッケージ
JP2994171B2 (ja) * 1993-05-11 1999-12-27 株式会社東芝 半導体装置の製造方法および封止用部材の製造方法
JPH0878574A (ja) * 1994-09-08 1996-03-22 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法

Also Published As

Publication number Publication date
US5969413A (en) 1999-10-19
KR100248035B1 (ko) 2000-03-15

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