KR940011118U - 리드온칩 패키지 - Google Patents

리드온칩 패키지

Info

Publication number
KR940011118U
KR940011118U KR2019920020810U KR920020810U KR940011118U KR 940011118 U KR940011118 U KR 940011118U KR 2019920020810 U KR2019920020810 U KR 2019920020810U KR 920020810 U KR920020810 U KR 920020810U KR 940011118 U KR940011118 U KR 940011118U
Authority
KR
South Korea
Prior art keywords
lead
chip package
package
chip
Prior art date
Application number
KR2019920020810U
Other languages
English (en)
Other versions
KR950010013Y1 (ko
Inventor
홍성학
Original Assignee
현대전자산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업주식회사 filed Critical 현대전자산업주식회사
Priority to KR92020810U priority Critical patent/KR950010013Y1/ko
Publication of KR940011118U publication Critical patent/KR940011118U/ko
Application granted granted Critical
Publication of KR950010013Y1 publication Critical patent/KR950010013Y1/ko

Links

KR92020810U 1992-10-28 1992-10-28 리드온칩 패키지 KR950010013Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR92020810U KR950010013Y1 (ko) 1992-10-28 1992-10-28 리드온칩 패키지

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR92020810U KR950010013Y1 (ko) 1992-10-28 1992-10-28 리드온칩 패키지

Publications (2)

Publication Number Publication Date
KR940011118U true KR940011118U (ko) 1994-05-27
KR950010013Y1 KR950010013Y1 (ko) 1995-11-25

Family

ID=19342638

Family Applications (1)

Application Number Title Priority Date Filing Date
KR92020810U KR950010013Y1 (ko) 1992-10-28 1992-10-28 리드온칩 패키지

Country Status (1)

Country Link
KR (1) KR950010013Y1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100342039B1 (ko) * 1994-12-29 2002-10-25 삼성에스디아이 주식회사 전기적접촉구조의형성방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100342039B1 (ko) * 1994-12-29 2002-10-25 삼성에스디아이 주식회사 전기적접촉구조의형성방법

Also Published As

Publication number Publication date
KR950010013Y1 (ko) 1995-11-25

Similar Documents

Publication Publication Date Title
NO931286D0 (no) Foeringsroer-pakker
KR930012117U (ko) 반도체 패키지
DE69326579D1 (de) Verpackungsstruktur
DE69518935D1 (de) Halbleiterpackung
DE69322140D1 (de) Halbleiterpackung
KR960012443A (ko) 반도체 패키지
KR940011118U (ko) 리드온칩 패키지
KR940013657U (ko) 리드온칩 패키지
KR940006479U (ko) 멀티 칩 패키지
KR930024367U (ko) 반도체 패키지
KR940013675U (ko) 반도체 패키지
DE59308065D1 (de) Verpackung
KR970046892U (ko) 리드온칩 패키지
KR950021505U (ko) 멀티칩 패키지
KR940017910U (ko) 반도체 패키지
KR940013678U (ko) 반도체 패키지
KR940013676U (ko) 반도체 패키지
KR930024375U (ko) 반도체 패키지
KR940013668U (ko) 리드 온 칩 패키지
ATA193592A (de) Verpackung
KR960012677U (ko) 반도체 패키지
KR960006383U (ko) 반도체 패키지
KR940013677U (ko) 아웃리드 표면 노출형 반도체 패키지
BR7102903U (pt) Disposicao introduzida embalagem
KR930016250U (ko) 반도체 패키지

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20061026

Year of fee payment: 12

EXPY Expiration of term