KR940006479U - 멀티 칩 패키지 - Google Patents
멀티 칩 패키지Info
- Publication number
- KR940006479U KR940006479U KR2019920015848U KR920015848U KR940006479U KR 940006479 U KR940006479 U KR 940006479U KR 2019920015848 U KR2019920015848 U KR 2019920015848U KR 920015848 U KR920015848 U KR 920015848U KR 940006479 U KR940006479 U KR 940006479U
- Authority
- KR
- South Korea
- Prior art keywords
- chip package
- package
- chip
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/074—Stacked arrangements of non-apertured devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR92015848U KR950006962Y1 (ko) | 1992-08-22 | 1992-08-22 | 멀티 칩 패키지 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR92015848U KR950006962Y1 (ko) | 1992-08-22 | 1992-08-22 | 멀티 칩 패키지 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR940006479U true KR940006479U (ko) | 1994-03-25 |
| KR950006962Y1 KR950006962Y1 (ko) | 1995-08-23 |
Family
ID=19338873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR92015848U KR950006962Y1 (ko) | 1992-08-22 | 1992-08-22 | 멀티 칩 패키지 |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR950006962Y1 (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102185611B1 (ko) * | 2019-06-07 | 2020-12-02 | 박찬권 | 가축 사체 냉온 보관장치 |
-
1992
- 1992-08-22 KR KR92015848U patent/KR950006962Y1/ko not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102185611B1 (ko) * | 2019-06-07 | 2020-12-02 | 박찬권 | 가축 사체 냉온 보관장치 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR950006962Y1 (ko) | 1995-08-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR930012117U (ko) | 반도체 패키지 | |
| NO931286D0 (no) | Foeringsroer-pakker | |
| DE69303633D1 (de) | Mehrchipmodul | |
| DE69232912D1 (de) | Halbleitergehäuse | |
| DE69326579D1 (de) | Verpackungsstruktur | |
| DE69518935T2 (de) | Halbleiterpackung | |
| DE69322140T2 (de) | Halbleiterpackung | |
| DE59305563D1 (de) | Mehrchipmodul | |
| DE69432168T2 (de) | Halbleitergehäuse | |
| KR940006479U (ko) | 멀티 칩 패키지 | |
| KR940011118U (ko) | 리드온칩 패키지 | |
| KR930024367U (ko) | 반도체 패키지 | |
| KR940013675U (ko) | 반도체 패키지 | |
| DE59308065D1 (de) | Verpackung | |
| KR950021505U (ko) | 멀티칩 패키지 | |
| KR940013657U (ko) | 리드온칩 패키지 | |
| KR930024375U (ko) | 반도체 패키지 | |
| KR940017910U (ko) | 반도체 패키지 | |
| KR940013678U (ko) | 반도체 패키지 | |
| KR940013676U (ko) | 반도체 패키지 | |
| KR940013668U (ko) | 리드 온 칩 패키지 | |
| KR940017874U (ko) | 세라믹 패키지 | |
| KR950028705U (ko) | 멀티 칩 패키지 | |
| KR940013677U (ko) | 아웃리드 표면 노출형 반도체 패키지 | |
| ATA193592A (de) | Verpackung |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E701 | Decision to grant or registration of patent right | ||
| REGI | Registration of establishment | ||
| FPAY | Annual fee payment |
Payment date: 20040719 Year of fee payment: 10 |
|
| LAPS | Lapse due to unpaid annual fee |