DE69226742D1 - Halbleitervorrichtung - Google Patents
HalbleitervorrichtungInfo
- Publication number
- DE69226742D1 DE69226742D1 DE69226742T DE69226742T DE69226742D1 DE 69226742 D1 DE69226742 D1 DE 69226742D1 DE 69226742 T DE69226742 T DE 69226742T DE 69226742 T DE69226742 T DE 69226742T DE 69226742 D1 DE69226742 D1 DE 69226742D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
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- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
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Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Semiconductor Integrated Circuits (AREA)
- Dram (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3241045A JP2932785B2 (ja) | 1991-09-20 | 1991-09-20 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
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DE69226742D1 true DE69226742D1 (de) | 1998-10-01 |
DE69226742T2 DE69226742T2 (de) | 1999-01-14 |
Family
ID=17068492
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69226742T Expired - Fee Related DE69226742T2 (de) | 1991-09-20 | 1992-09-21 | Halbleitervorrichtung |
Country Status (5)
Country | Link |
---|---|
US (1) | US5648680A (de) |
EP (1) | EP0533589B1 (de) |
JP (1) | JP2932785B2 (de) |
KR (1) | KR960003767B1 (de) |
DE (1) | DE69226742T2 (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2677737B2 (ja) * | 1992-06-24 | 1997-11-17 | 株式会社東芝 | 半導体装置 |
US5384487A (en) * | 1993-05-05 | 1995-01-24 | Lsi Logic Corporation | Off-axis power branches for interior bond pad arrangements |
JPH0799213A (ja) * | 1993-06-09 | 1995-04-11 | At & T Corp | 集積回路チップ |
GB2312988A (en) * | 1996-05-10 | 1997-11-12 | Memory Corp Plc | Connecting a semiconductor die to a carrier |
KR0179924B1 (ko) * | 1996-06-14 | 1999-03-20 | 문정환 | 버텀리드 반도체 패키지 |
KR100248792B1 (ko) * | 1996-12-18 | 2000-03-15 | 김영환 | 단일층 세라믹 기판을 이용한 칩사이즈 패키지 반도체 |
JP3036498B2 (ja) * | 1997-12-08 | 2000-04-24 | 日本電気株式会社 | 半導体パッケージ |
US6268643B1 (en) * | 1997-12-22 | 2001-07-31 | Texas Instruments Incorporated | Lead frame device for delivering electrical power to a semiconductor die |
US6049136A (en) * | 1998-06-03 | 2000-04-11 | Hewlett-Packard Company | Integrated circuit having unique lead configuration |
DE10126310B4 (de) | 2001-05-30 | 2006-05-18 | Infineon Technologies Ag | Leiterplattenvorrichtung, deren Verwendung und Halbleiterspeichervorrichtung |
TW530525B (en) * | 2001-07-27 | 2003-05-01 | Via Tech Inc | Method of disposing buffer and its chip |
US7489026B2 (en) | 2006-10-31 | 2009-02-10 | Freescale Semiconductor, Inc. | Methods and apparatus for a Quad Flat No-Lead (QFN) package |
CN112655087B (zh) * | 2018-09-06 | 2024-08-13 | 三菱电机株式会社 | 功率半导体装置及其制造方法以及电力变换装置 |
US11502014B2 (en) * | 2018-09-19 | 2022-11-15 | Rohm Co., Ltd. | Semiconductor device |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1238119A (en) * | 1985-04-18 | 1988-06-14 | Douglas W. Phelps, Jr. | Packaged semiconductor chip |
EP0204177A1 (de) * | 1985-05-31 | 1986-12-10 | Siemens Aktiengesellschaft | Anschlussanordnung für einen integrierten Halbleiterschaltkreis |
KR880014671A (ko) * | 1987-05-27 | 1988-12-24 | 미다 가쓰시게 | 수지로 충진된 반도체 장치 |
US4796078A (en) * | 1987-06-15 | 1989-01-03 | International Business Machines Corporation | Peripheral/area wire bonding technique |
KR0158868B1 (ko) * | 1988-09-20 | 1998-12-01 | 미다 가쓰시게 | 반도체장치 |
US5151559A (en) * | 1991-05-02 | 1992-09-29 | International Business Machines Corporation | Planarized thin film surface covered wire bonded semiconductor package |
-
1991
- 1991-09-20 JP JP3241045A patent/JP2932785B2/ja not_active Expired - Fee Related
-
1992
- 1992-09-21 EP EP92402587A patent/EP0533589B1/de not_active Expired - Lifetime
- 1992-09-21 DE DE69226742T patent/DE69226742T2/de not_active Expired - Fee Related
- 1992-09-21 KR KR1019920017207A patent/KR960003767B1/ko not_active IP Right Cessation
-
1995
- 1995-09-29 US US08/536,674 patent/US5648680A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE69226742T2 (de) | 1999-01-14 |
KR930006889A (ko) | 1993-04-22 |
EP0533589A1 (de) | 1993-03-24 |
US5648680A (en) | 1997-07-15 |
KR960003767B1 (ko) | 1996-03-22 |
EP0533589B1 (de) | 1998-08-26 |
JP2932785B2 (ja) | 1999-08-09 |
JPH0582703A (ja) | 1993-04-02 |
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