DE69226742T2 - Halbleitervorrichtung - Google Patents

Halbleitervorrichtung

Info

Publication number
DE69226742T2
DE69226742T2 DE1992626742 DE69226742T DE69226742T2 DE 69226742 T2 DE69226742 T2 DE 69226742T2 DE 1992626742 DE1992626742 DE 1992626742 DE 69226742 T DE69226742 T DE 69226742T DE 69226742 T2 DE69226742 T2 DE 69226742T2
Authority
DE
Grant status
Grant
Patent type
Prior art keywords
semiconductor device
semiconductor
device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE1992626742
Other languages
English (en)
Other versions
DE69226742D1 (de )
Inventor
Junji Ogawa
Masato Takita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Grant date

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02Bonding areas ; Manufacturing methods related thereto
    • H01L24/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49503Lead-frames or other flat leads characterised by the die pad
    • H01L23/4951Chip-on-leads or leads-on-chip techniques, i.e. inner lead fingers being used as die pad
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    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
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    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
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    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
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    • H01L2224/0554External layer
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    • H01L2224/05599Material
    • H01L2224/056Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/05617Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/05624Aluminium [Al] as principal constituent
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    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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    • H01L2224/485Material
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    • H01L2224/48599Principal constituent of the connecting portion of the wire connector being Gold (Au)
    • H01L2224/486Principal constituent of the connecting portion of the wire connector being Gold (Au) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/48617Principal constituent of the connecting portion of the wire connector being Gold (Au) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950 °C
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    • H01L2224/732Location after the connecting process
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    • H01L2924/3011Impedance
DE1992626742 1991-09-20 1992-09-21 Halbleitervorrichtung Expired - Lifetime DE69226742T2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24104591A JP2932785B2 (ja) 1991-09-20 1991-09-20 半導体装置

Publications (1)

Publication Number Publication Date
DE69226742T2 true DE69226742T2 (de) 1999-01-14

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ID=17068492

Family Applications (2)

Application Number Title Priority Date Filing Date
DE1992626742 Expired - Lifetime DE69226742T2 (de) 1991-09-20 1992-09-21 Halbleitervorrichtung
DE1992626742 Expired - Fee Related DE69226742D1 (de) 1991-09-20 1992-09-21 Halbleitervorrichtung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE1992626742 Expired - Fee Related DE69226742D1 (de) 1991-09-20 1992-09-21 Halbleitervorrichtung

Country Status (5)

Country Link
US (1) US5648680A (de)
EP (1) EP0533589B1 (de)
JP (1) JP2932785B2 (de)
KR (1) KR960003767B1 (de)
DE (2) DE69226742T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10126310A1 (de) * 2001-05-30 2002-12-19 Infineon Technologies Ag Leiterplatatenvorrichtung, deren Verwendung und Halbleiterspeichervorrichtung

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2677737B2 (ja) * 1992-06-24 1997-11-17 東芝マイクロエレクトロニクス株式会社 半導体装置
US5384487A (en) * 1993-05-05 1995-01-24 Lsi Logic Corporation Off-axis power branches for interior bond pad arrangements
JPH0799213A (ja) * 1993-06-09 1995-04-11 At & T Corp 集積回路チップ
GB9708705D0 (en) * 1996-05-10 1997-06-18 Memory Corp Plc Manufacturing method
KR0179924B1 (ko) * 1996-06-14 1999-03-20 문정환 버텀리드 반도체 패키지
KR100248792B1 (ko) * 1996-12-18 2000-03-15 김영환 단일층 세라믹 기판을 이용한 칩사이즈 패키지 반도체
JP3036498B2 (ja) * 1997-12-08 2000-04-24 日本電気株式会社 半導体パッケージ
US6268643B1 (en) * 1997-12-22 2001-07-31 Texas Instruments Incorporated Lead frame device for delivering electrical power to a semiconductor die
US6049136A (en) * 1998-06-03 2000-04-11 Hewlett-Packard Company Integrated circuit having unique lead configuration
US6826637B2 (en) * 2001-07-27 2004-11-30 Via Technologies, Inc. Implementing for buffering devices in circuit layout to ensure same arriving time for clock signal from source root to output bonding pads
US7489026B2 (en) 2006-10-31 2009-02-10 Freescale Semiconductor, Inc. Methods and apparatus for a Quad Flat No-Lead (QFN) package

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1238119A (en) * 1985-04-18 1988-06-14 Douglas W. Phelps, Jr. Packaged semiconductor chip
EP0204177A1 (de) * 1985-05-31 1986-12-10 Siemens Aktiengesellschaft Anschlussanordnung für einen integrierten Halbleiterschaltkreis
US4951122A (en) * 1987-05-27 1990-08-21 Hitachi, Ltd. Resin-encapsulated semiconductor device
US4796078A (en) * 1987-06-15 1989-01-03 International Business Machines Corporation Peripheral/area wire bonding technique
US5068712A (en) * 1988-09-20 1991-11-26 Hitachi, Ltd. Semiconductor device
US5151559A (en) * 1991-05-02 1992-09-29 International Business Machines Corporation Planarized thin film surface covered wire bonded semiconductor package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10126310A1 (de) * 2001-05-30 2002-12-19 Infineon Technologies Ag Leiterplatatenvorrichtung, deren Verwendung und Halbleiterspeichervorrichtung
DE10126310B4 (de) * 2001-05-30 2006-05-18 Infineon Technologies Ag Leiterplattenvorrichtung, deren Verwendung und Halbleiterspeichervorrichtung

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Publication number Publication date Type
DE69226742D1 (de) 1998-10-01 grant
EP0533589A1 (de) 1993-03-24 application
JPH0582703A (ja) 1993-04-02 application
JP2932785B2 (ja) 1999-08-09 grant
KR960003767B1 (ko) 1996-03-22 grant
EP0533589B1 (de) 1998-08-26 grant
US5648680A (en) 1997-07-15 grant

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