DE69325181T2 - Halbleitervorrichtung - Google Patents

Halbleitervorrichtung

Info

Publication number
DE69325181T2
DE69325181T2 DE69325181T DE69325181T DE69325181T2 DE 69325181 T2 DE69325181 T2 DE 69325181T2 DE 69325181 T DE69325181 T DE 69325181T DE 69325181 T DE69325181 T DE 69325181T DE 69325181 T2 DE69325181 T2 DE 69325181T2
Authority
DE
Germany
Prior art keywords
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69325181T
Other languages
English (en)
Other versions
DE69325181D1 (de
Inventor
Sten Trolle
Christer Svensson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Elsa Elektroniska Systems and Applications AB
Original Assignee
Elsa Elektroniska Systems and Applications AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Elsa Elektroniska Systems and Applications AB filed Critical Elsa Elektroniska Systems and Applications AB
Application granted granted Critical
Publication of DE69325181D1 publication Critical patent/DE69325181D1/de
Publication of DE69325181T2 publication Critical patent/DE69325181T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4824—Pads with extended contours, e.g. grid structure, branch structure, finger structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Semiconductor Integrated Circuits (AREA)
DE69325181T 1992-10-09 1993-10-11 Halbleitervorrichtung Expired - Fee Related DE69325181T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9202984A SE500523C2 (sv) 1992-10-09 1992-10-09 Halvledarkomponent med minst en första och en andra komponentelektrod innefattande ett flertal på en halvledarbricka integrerade halvledarelement, som vart och ett innefattar minst en första och en andra elementelektrod på samma sida av halvledarbrickan, varid de första elementelektroderna är förbundna med den första komponentelektroden och de andra elementelektroderna är förbundna med den andra komponentelektroden.
PCT/SE1993/000819 WO1994009511A1 (en) 1992-10-09 1993-10-11 Semiconductor component

Publications (2)

Publication Number Publication Date
DE69325181D1 DE69325181D1 (de) 1999-07-08
DE69325181T2 true DE69325181T2 (de) 1999-12-02

Family

ID=20387449

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69325181T Expired - Fee Related DE69325181T2 (de) 1992-10-09 1993-10-11 Halbleitervorrichtung

Country Status (6)

Country Link
US (1) US5625207A (de)
EP (1) EP0682808B1 (de)
AU (1) AU5289293A (de)
DE (1) DE69325181T2 (de)
SE (1) SE500523C2 (de)
WO (1) WO1994009511A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5721144A (en) * 1995-04-27 1998-02-24 International Business Machines Corporation Method of making trimmable modular MOSFETs for high aspect ratio applications
US5814847A (en) * 1996-02-02 1998-09-29 National Semiconductor Corp. General purpose assembly programmable multi-chip package substrate
US6630715B2 (en) * 2001-10-01 2003-10-07 International Business Machines Corporation Asymmetrical MOSFET layout for high currents and high speed operation
TW573450B (en) * 2003-04-02 2004-01-21 Comchip Technology Co Ltd Process for fabricating a discrete circuit component on a substrate having fabrication stage clogged through-holes
JP4372046B2 (ja) * 2005-05-18 2009-11-25 株式会社東芝 半導体装置
DE102005047104B3 (de) * 2005-09-30 2007-05-31 Infineon Technologies Ag Halbleiterbauelement mit miteinander verschalteten Zellstreifen
SE2050244A1 (en) 2020-03-04 2021-09-05 Powonics Ab High-current semiconductor components and systems

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4835778A (de) * 1971-09-09 1973-05-26
US4636825A (en) * 1985-10-04 1987-01-13 Fairchild Semiconductor Corporation Distributed field effect transistor structure
US4847674A (en) * 1987-03-10 1989-07-11 Advanced Micro Devices, Inc. High speed interconnect system with refractory non-dogbone contacts and an active electromigration suppression mechanism
JPS63283040A (ja) * 1987-05-15 1988-11-18 Toshiba Corp 半導体装置
JP3022565B2 (ja) * 1988-09-13 2000-03-21 株式会社日立製作所 半導体装置
DE69031357T2 (de) * 1989-04-21 1998-04-02 Nec Corp Halbleiteranordnung mit Mehrschichtleiter
JP2965626B2 (ja) * 1990-06-25 1999-10-18 株式会社東芝 半導体集積回路
JP3074713B2 (ja) * 1990-09-18 2000-08-07 日本電気株式会社 半導体装置の製造方法
JPH05136125A (ja) * 1991-11-14 1993-06-01 Hitachi Ltd クロツク配線及びクロツク配線を有する半導体集積回路装置

Also Published As

Publication number Publication date
SE9202984D0 (sv) 1992-10-09
EP0682808B1 (de) 1999-06-02
SE500523C2 (sv) 1994-07-11
US5625207A (en) 1997-04-29
SE9202984L (sv) 1994-04-10
AU5289293A (en) 1994-05-09
WO1994009511A1 (en) 1994-04-28
EP0682808A1 (de) 1995-11-22
DE69325181D1 (de) 1999-07-08

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee