JPS5116701A - Sagyodaino shokosochi - Google Patents
Sagyodaino shokosochiInfo
- Publication number
- JPS5116701A JPS5116701A JP8825074A JP8825074A JPS5116701A JP S5116701 A JPS5116701 A JP S5116701A JP 8825074 A JP8825074 A JP 8825074A JP 8825074 A JP8825074 A JP 8825074A JP S5116701 A JPS5116701 A JP S5116701A
- Authority
- JP
- Japan
- Prior art keywords
- shokosochi
- sagyodaino
- sagyodaino shokosochi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8825074A JPS5116701A (en) | 1974-07-31 | 1974-07-31 | Sagyodaino shokosochi |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8825074A JPS5116701A (en) | 1974-07-31 | 1974-07-31 | Sagyodaino shokosochi |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5116701A true JPS5116701A (en) | 1976-02-10 |
Family
ID=13937600
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8825074A Pending JPS5116701A (en) | 1974-07-31 | 1974-07-31 | Sagyodaino shokosochi |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5116701A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5394350U (en) * | 1976-12-29 | 1978-08-01 | ||
US5122860A (en) * | 1987-08-26 | 1992-06-16 | Matsushita Electric Industrial Co., Ltd. | Integrated circuit device and manufacturing method thereof |
USRE36097E (en) * | 1991-11-14 | 1999-02-16 | Lg Semicon, Ltd. | Semiconductor package for a semiconductor chip having centrally located bottom bond pads |
-
1974
- 1974-07-31 JP JP8825074A patent/JPS5116701A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5394350U (en) * | 1976-12-29 | 1978-08-01 | ||
JPS5710372Y2 (en) * | 1976-12-29 | 1982-02-27 | ||
US5122860A (en) * | 1987-08-26 | 1992-06-16 | Matsushita Electric Industrial Co., Ltd. | Integrated circuit device and manufacturing method thereof |
USRE36097E (en) * | 1991-11-14 | 1999-02-16 | Lg Semicon, Ltd. | Semiconductor package for a semiconductor chip having centrally located bottom bond pads |
USRE37413E1 (en) * | 1991-11-14 | 2001-10-16 | Hyundai Electronics Industries Co., Ltd. | Semiconductor package for a semiconductor chip having centrally located bottom bond pads |
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