KR100234708B1 - Blp type semiconductor package and mounting structure thereof - Google Patents

Blp type semiconductor package and mounting structure thereof Download PDF

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Publication number
KR100234708B1
KR100234708B1 KR1019960067253A KR19960067253A KR100234708B1 KR 100234708 B1 KR100234708 B1 KR 100234708B1 KR 1019960067253 A KR1019960067253 A KR 1019960067253A KR 19960067253 A KR19960067253 A KR 19960067253A KR 100234708 B1 KR100234708 B1 KR 100234708B1
Authority
KR
South Korea
Prior art keywords
type semiconductor
mounting structure
semiconductor package
blp type
blp
Prior art date
Application number
KR1019960067253A
Other languages
Korean (ko)
Other versions
KR19980048632A (en
Inventor
Young-Sun Kim
Original Assignee
Hyundai Micro Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hyundai Micro Electronics Co filed Critical Hyundai Micro Electronics Co
Priority to KR1019960067253A priority Critical patent/KR100234708B1/en
Publication of KR19980048632A publication Critical patent/KR19980048632A/en
Application granted granted Critical
Publication of KR100234708B1 publication Critical patent/KR100234708B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73215—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
KR1019960067253A 1996-12-18 1996-12-18 Blp type semiconductor package and mounting structure thereof KR100234708B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960067253A KR100234708B1 (en) 1996-12-18 1996-12-18 Blp type semiconductor package and mounting structure thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960067253A KR100234708B1 (en) 1996-12-18 1996-12-18 Blp type semiconductor package and mounting structure thereof

Publications (2)

Publication Number Publication Date
KR19980048632A KR19980048632A (en) 1998-09-15
KR100234708B1 true KR100234708B1 (en) 1999-12-15

Family

ID=19488730

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960067253A KR100234708B1 (en) 1996-12-18 1996-12-18 Blp type semiconductor package and mounting structure thereof

Country Status (1)

Country Link
KR (1) KR100234708B1 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5363279A (en) * 1991-11-14 1994-11-08 Goldstar Electron Co., Ltd. Semiconductor package for a semiconductor chip having centrally located bottom bond pads
JPH0778910A (en) * 1993-09-07 1995-03-20 Nec Ic Microcomput Syst Ltd Semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5363279A (en) * 1991-11-14 1994-11-08 Goldstar Electron Co., Ltd. Semiconductor package for a semiconductor chip having centrally located bottom bond pads
JPH0778910A (en) * 1993-09-07 1995-03-20 Nec Ic Microcomput Syst Ltd Semiconductor device

Also Published As

Publication number Publication date
KR19980048632A (en) 1998-09-15

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