KR20110016506A - 형광체 조성물과 그 제조 방법, 및 그 형광체 조성물을 이용한 발광 장치 - Google Patents

형광체 조성물과 그 제조 방법, 및 그 형광체 조성물을 이용한 발광 장치 Download PDF

Info

Publication number
KR20110016506A
KR20110016506A KR1020117001875A KR20117001875A KR20110016506A KR 20110016506 A KR20110016506 A KR 20110016506A KR 1020117001875 A KR1020117001875 A KR 1020117001875A KR 20117001875 A KR20117001875 A KR 20117001875A KR 20110016506 A KR20110016506 A KR 20110016506A
Authority
KR
South Korea
Prior art keywords
phosphor
light
light emitting
composition
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020117001875A
Other languages
English (en)
Korean (ko)
Inventor
쇼조 오시오
Original Assignee
파나소닉 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=39697774&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR20110016506(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from JP2004250739A external-priority patent/JP2005336450A/ja
Application filed by 파나소닉 주식회사 filed Critical 파나소닉 주식회사
Publication of KR20110016506A publication Critical patent/KR20110016506A/ko
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]

Landscapes

  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Devices (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020117001875A 2004-04-27 2005-04-26 형광체 조성물과 그 제조 방법, 및 그 형광체 조성물을 이용한 발광 장치 Withdrawn KR20110016506A (ko)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JPJP-P-2004-131770 2004-04-27
JP2004131770 2004-04-27
JPJP-P-2004-182797 2004-06-21
JP2004182797 2004-06-21
JPJP-P-2004-194196 2004-06-30
JP2004194196 2004-06-30
JP2004250739A JP2005336450A (ja) 2004-04-27 2004-08-30 蛍光体組成物とその製造方法、並びにその蛍光体組成物を用いた発光装置
JPJP-P-2004-250739 2004-08-30
JPJP-P-2004-363534 2004-12-15
JP2004363534A JP4128564B2 (ja) 2004-04-27 2004-12-15 発光装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020077015970A Division KR101041311B1 (ko) 2004-04-27 2005-04-26 형광체 조성물과 그 제조 방법, 및 그 형광체 조성물을 이용한 발광장치

Publications (1)

Publication Number Publication Date
KR20110016506A true KR20110016506A (ko) 2011-02-17

Family

ID=39697774

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117001875A Withdrawn KR20110016506A (ko) 2004-04-27 2005-04-26 형광체 조성물과 그 제조 방법, 및 그 형광체 조성물을 이용한 발광 장치

Country Status (4)

Country Link
JP (8) JP4128564B2 (enrdf_load_stackoverflow)
KR (1) KR20110016506A (enrdf_load_stackoverflow)
AT (2) ATE539135T1 (enrdf_load_stackoverflow)
TW (2) TW200611963A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101157313B1 (ko) * 2004-04-27 2012-06-18 파나소닉 주식회사 형광체 조성물과 그 제조방법, 및 그 형광체 조성물을 이용한 발광 장치
US9196800B2 (en) 1996-06-26 2015-11-24 Osram Gmbh Light-radiating semiconductor component with a luminescence conversion element

Families Citing this family (137)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2264798B1 (en) 2003-04-30 2020-10-14 Cree, Inc. High powered light emitter packages with compact optics
US7005679B2 (en) 2003-05-01 2006-02-28 Cree, Inc. Multiple component solid state white light
JP3837588B2 (ja) 2003-11-26 2006-10-25 独立行政法人物質・材料研究機構 蛍光体と蛍光体を用いた発光器具
JP4128564B2 (ja) * 2004-04-27 2008-07-30 松下電器産業株式会社 発光装置
US7534633B2 (en) 2004-07-02 2009-05-19 Cree, Inc. LED with substrate modifications for enhanced light extraction and method of making same
CN104759615A (zh) 2005-04-01 2015-07-08 三菱化学株式会社 无机功能材料原料用合金粉末及荧光体
JP2007049114A (ja) 2005-05-30 2007-02-22 Sharp Corp 発光装置とその製造方法
US7262439B2 (en) 2005-11-22 2007-08-28 Lumination Llc Charge compensated nitride phosphors for use in lighting applications
US7859182B2 (en) 2005-08-31 2010-12-28 Lumination Llc Warm white LED-based lamp incoporating divalent EU-activated silicate yellow emitting phosphor
JP4832995B2 (ja) * 2005-09-01 2011-12-07 シャープ株式会社 発光装置
EP1969633B1 (en) 2005-12-22 2018-08-29 Cree, Inc. Lighting device
NL2000033C1 (nl) * 2006-03-20 2007-09-21 Univ Eindhoven Tech Inrichting voor het omzetten van elektromagnetische stralingsenergie in elektrische energie en werkwijze ter vervaardiging van een dergelijke inrichting.
JP5239182B2 (ja) * 2006-03-27 2013-07-17 三菱化学株式会社 蛍光体及びそれを使用した発光装置
JP2007312374A (ja) * 2006-04-19 2007-11-29 Mitsubishi Chemicals Corp カラー画像表示装置
EP2009486A4 (en) * 2006-04-19 2009-12-09 Mitsubishi Chem Corp Color image display device
EP3422425B1 (en) 2006-04-24 2022-02-23 CreeLED, Inc. Side-view surface mount white led
WO2008001799A1 (fr) 2006-06-27 2008-01-03 Mitsubishi Chemical Corporation Dispositif d'éclairage
JP5141107B2 (ja) * 2006-06-27 2013-02-13 三菱化学株式会社 照明装置
KR101258229B1 (ko) * 2006-06-30 2013-04-25 서울반도체 주식회사 발광 소자
JP5100059B2 (ja) * 2006-08-24 2012-12-19 スタンレー電気株式会社 蛍光体、その製造方法およびそれを用いた発光装置
KR100771772B1 (ko) * 2006-08-25 2007-10-30 삼성전기주식회사 백색 ｌｅｄ 모듈
JP5378644B2 (ja) * 2006-09-29 2013-12-25 Ｄｏｗａホールディングス株式会社 窒化物蛍光体または酸窒化物蛍光体の製造方法
KR101008762B1 (ko) 2006-10-12 2011-01-14 파나소닉 주식회사 발광 장치 및 그 제조 방법
KR100862695B1 (ko) 2006-10-17 2008-10-10 삼성전기주식회사 백색 발광 다이오드
US7804239B2 (en) 2006-10-17 2010-09-28 Samsung Led Co., Ltd. White light emitting diode
JP2008116849A (ja) * 2006-11-07 2008-05-22 Sony Corp 表示装置
JP5367218B2 (ja) 2006-11-24 2013-12-11 シャープ株式会社 蛍光体の製造方法および発光装置の製造方法
JP4520972B2 (ja) * 2006-11-28 2010-08-11 Ｄｏｗａエレクトロニクス株式会社 発光装置及びその製造方法
JP4228012B2 (ja) * 2006-12-20 2009-02-25 Ｎｅｃライティング株式会社 赤色発光窒化物蛍光体およびそれを用いた白色発光素子
JP5137395B2 (ja) * 2006-12-25 2013-02-06 京セラ株式会社 発光装置
JP4824600B2 (ja) * 2007-02-21 2011-11-30 富士フイルム株式会社 面状照明装置、面状照明装置の評価方法及びこれを用いる製造方法
JP2008208238A (ja) * 2007-02-27 2008-09-11 Showa Denko Kk 蛍光体及びその製造方法、並びにそれを備えた照明器具と画像表示装置
JP2008244468A (ja) * 2007-02-28 2008-10-09 Toshiba Lighting & Technology Corp 発光装置
JP2008244469A (ja) * 2007-02-28 2008-10-09 Toshiba Lighting & Technology Corp 発光装置
JP2008218485A (ja) * 2007-02-28 2008-09-18 Toshiba Lighting & Technology Corp 発光装置
JP2008270781A (ja) * 2007-03-23 2008-11-06 Toshiba Lighting & Technology Corp 発光装置
JP2008251664A (ja) * 2007-03-29 2008-10-16 Toshiba Lighting & Technology Corp 照明装置
US8178001B2 (en) * 2007-04-18 2012-05-15 Mitsubishi Chemical Corporation Method for producing inorganic compound, phosphor, phosphor-containing composition, light-emitting device, lighting system, and display device
US9279079B2 (en) 2007-05-30 2016-03-08 Sharp Kabushiki Kaisha Method of manufacturing phosphor, light-emitting device, and image display apparatus
JP2009019163A (ja) * 2007-07-13 2009-01-29 Sharp Corp 発光装置用蛍光体粒子集合体、発光装置、および液晶表示用バックライト装置
EP2172983B1 (en) * 2007-07-19 2014-11-19 Sharp Kabushiki Kaisha Light emitting device
US8384092B2 (en) 2007-08-30 2013-02-26 Nichia Corporation Light emitting device
JP5092667B2 (ja) * 2007-10-05 2012-12-05 三菱化学株式会社 発光装置
US9431589B2 (en) 2007-12-14 2016-08-30 Cree, Inc. Textured encapsulant surface in LED packages
JPWO2009110285A1 (ja) 2008-03-03 2011-07-14 シャープ株式会社 発光装置
KR101180216B1 (ko) 2008-04-17 2012-09-05 도시바 마테리알 가부시키가이샤 백색 발광 장치, 백라이트, 액정 표시 장치 및 조명 장치
JP2009289957A (ja) * 2008-05-29 2009-12-10 Yamaguchi Univ 半導体発光装置、および撮像装置
JP2010080935A (ja) * 2008-08-28 2010-04-08 Panasonic Corp 半導体発光装置及びこれを用いたバックライト光源、バックライト光源システム、表示装置、電子機器
JP5220527B2 (ja) * 2008-09-11 2013-06-26 昭和電工株式会社 発光装置、発光モジュール
JP5220526B2 (ja) * 2008-09-11 2013-06-26 昭和電工株式会社 発光装置、発光モジュール、表示装置
US8378369B2 (en) 2008-09-09 2013-02-19 Showa Denko K.K. Light emitting unit, light emitting module, and display device
TW201011942A (en) * 2008-09-11 2010-03-16 Advanced Optoelectronic Tech Method and system for configuring high CRI LED
JP2010151851A (ja) * 2008-11-28 2010-07-08 Toshiba Corp 表示装置
JP2010177620A (ja) * 2009-02-02 2010-08-12 Showa Denko Kk 発光装置の製造方法
JP5483898B2 (ja) * 2009-02-19 2014-05-07 住友金属鉱山株式会社 酸化物蛍光体の製造方法
WO2011024818A1 (ja) * 2009-08-26 2011-03-03 三菱化学株式会社 白色半導体発光装置
WO2011024296A1 (ja) * 2009-08-28 2011-03-03 株式会社 東芝 蛍光体の製造方法およびそれにより製造された蛍光体
EP2480816A1 (en) 2009-09-25 2012-08-01 Cree, Inc. Lighting device with low glare and high light level uniformity
JP5824676B2 (ja) * 2009-09-29 2015-11-25 パナソニックＩｐマネジメント株式会社 Ｌｅｄ照明光源及び照明装置
JP5712428B2 (ja) * 2009-10-23 2015-05-07 国立大学法人山梨大学 紫外励起光源用赤色蛍光体
EP2540798A4 (en) * 2010-02-26 2014-04-30 Mitsubishi Chem Corp Halophosphate Phosphorus and White Light Output Device
US8643038B2 (en) 2010-03-09 2014-02-04 Cree, Inc. Warm white LEDs having high color rendering index values and related luminophoric mediums
US20110220920A1 (en) * 2010-03-09 2011-09-15 Brian Thomas Collins Methods of forming warm white light emitting devices having high color rendering index values and related light emitting devices
JP5718895B2 (ja) * 2010-03-12 2015-05-13 株式会社東芝 白色照明装置
JP2011225696A (ja) * 2010-04-19 2011-11-10 Sharp Corp 赤色系発光蛍光体、その製造方法および赤色系発光蛍光体を用いた発光装置
US8329482B2 (en) 2010-04-30 2012-12-11 Cree, Inc. White-emitting LED chips and method for making same
JP2012060097A (ja) 2010-06-25 2012-03-22 Mitsubishi Chemicals Corp 白色半導体発光装置
KR101243773B1 (ko) 2010-08-17 2013-03-14 순천대학교 산학협력단 발광장치 및 태양전지용 파장변환조성물, 이 조성물을 포함하는 발광장치와 태양전지 및 이 파장변환조성물의 제조방법
JP5185421B2 (ja) * 2010-09-09 2013-04-17 株式会社東芝 赤色発光蛍光体およびそれを用いた発光装置
JP5864851B2 (ja) 2010-12-09 2016-02-17 シャープ株式会社 発光装置
US9617469B2 (en) 2011-01-06 2017-04-11 Shin-Etsu Chemical Co., Ltd. Phosphor particles, making method, and light-emitting diode
JP2012246462A (ja) * 2011-05-31 2012-12-13 Sharp Corp 発光装置
US8747697B2 (en) * 2011-06-07 2014-06-10 Cree, Inc. Gallium-substituted yttrium aluminum garnet phosphor and light emitting devices including the same
JP2013007610A (ja) * 2011-06-23 2013-01-10 Canon Inc 測色器及び画像形成装置
MX2011007939A (es) * 2011-07-13 2013-01-24 William J Odom Jr Aparato y metodo de iluminacion para casa de aves.
CN103764788B (zh) * 2011-08-04 2016-04-20 皇家飞利浦有限公司 光转换器和包括这样的光转换器的照明单元
DE202011106052U1 (de) * 2011-09-23 2011-11-09 Osram Ag Lichtquelle mit Leuchtstoff und zugehörige Beleuchtungseinheit.
JP5899470B2 (ja) * 2011-12-16 2016-04-06 パナソニックＩｐマネジメント株式会社 照明装置
JP2013163723A (ja) * 2012-02-09 2013-08-22 Denki Kagaku Kogyo Kk 蛍光体及び発光装置
JP2013163725A (ja) * 2012-02-09 2013-08-22 Denki Kagaku Kogyo Kk 蛍光体及び発光装置
JP2013163722A (ja) * 2012-02-09 2013-08-22 Denki Kagaku Kogyo Kk 蛍光体及び発光装置
JP2015083617A (ja) * 2012-02-09 2015-04-30 電気化学工業株式会社 蛍光体及び発光装置
JP2015083618A (ja) * 2012-02-09 2015-04-30 電気化学工業株式会社 蛍光体及び発光装置
KR101409489B1 (ko) 2012-02-27 2014-06-18 경기대학교 산학협력단 실리콘 산질화물 형광체 및 이를 포함하는 광소자
US9030092B2 (en) 2012-02-27 2015-05-12 Kyounggi University Industry & Academia Cooperation Foundation Silicon oxynitride phosphore, production method for same, and optical element comprising same
JP2013207241A (ja) * 2012-03-29 2013-10-07 Mitsubishi Chemicals Corp 半導体発光装置、半導体発光システムおよび照明器具
WO2013158930A1 (en) * 2012-04-18 2013-10-24 Nitto Denko Corporation Phosphor ceramics and methods of making the same
JP6060259B2 (ja) * 2012-07-18 2017-01-11 インテマティックス・コーポレーションＩｎｔｅｍａｔｉｘ Ｃｏｒｐｏｒａｔｉｏｎ 赤色発光窒化物系蛍光体
EP2905818B1 (en) * 2012-10-04 2023-12-20 Seoul Semiconductor Co., Ltd. White-light emitting device, lighting device, and lighting device for dentistry
EP2953174B1 (en) * 2013-01-31 2020-07-01 Kabushiki Kaisha Toshiba Light emitting device and led light bulb
JP6853614B2 (ja) * 2013-03-29 2021-03-31 株式会社朝日ラバー Ｌｅｄ照明装置、その製造方法及びｌｅｄ照明方法
EP2803715B1 (en) * 2013-05-16 2020-02-26 LG Innotek Co., Ltd. Phosphor and light emitting device package including the same
CN104241262B (zh) 2013-06-14 2020-11-06 惠州科锐半导体照明有限公司 发光装置以及显示装置
JP6266923B2 (ja) * 2013-08-26 2018-01-24 シチズン電子株式会社 Ｌｅｄ発光装置
US9142733B2 (en) * 2013-09-03 2015-09-22 Panasonic Intellectual Property Management Co., Ltd. Light source device including a high energy light source and a wavelength conversion member, illuminating device comprising the same, and vehicle
WO2015050317A1 (ko) 2013-10-02 2015-04-09 지엘비텍 주식회사 고연색성 백색 발광 소자
JP2015082596A (ja) 2013-10-23 2015-04-27 株式会社東芝 発光装置
JP2017502528A (ja) * 2013-11-08 2017-01-19 ルミマイクロ コーポレーション リミテッドＬｕｍｉｍｉｃｒｏ Ｃｏｒｐ． Ｌｔｄ． 発光装置
KR101487961B1 (ko) 2013-11-25 2015-01-30 율촌화학 주식회사 백색 발광소자 및 이를 포함하는 발광 장치
JP6195117B2 (ja) 2013-12-03 2017-09-13 パナソニックＩｐマネジメント株式会社 酸塩化物蛍光体、発光装置、照明装置、及び車両
JP6358457B2 (ja) * 2014-01-20 2018-07-18 パナソニックＩｐマネジメント株式会社 発光装置、照明用光源及び照明装置
JP6323177B2 (ja) * 2014-05-30 2018-05-16 日亜化学工業株式会社 半導体発光装置
JP6405738B2 (ja) * 2014-06-19 2018-10-17 三菱ケミカル株式会社 発光装置
JP6407654B2 (ja) * 2014-10-08 2018-10-17 株式会社東芝 Ｌｅｄモジュールおよび照明装置
JP2016111267A (ja) * 2014-12-09 2016-06-20 パナソニックＩｐマネジメント株式会社 照明モジュール、照明装置及び液晶表示装置
JP6755090B2 (ja) * 2014-12-11 2020-09-16 シチズン電子株式会社 発光装置及び発光装置の製造方法
US9716212B2 (en) 2014-12-19 2017-07-25 Nichia Corporation Light emitting device
JP6428245B2 (ja) * 2014-12-19 2018-11-28 日亜化学工業株式会社 発光装置
JP6506037B2 (ja) * 2015-02-02 2019-04-24 富士フイルム株式会社 蛍光体分散組成物及びそれを用いて得られた蛍光成形体、波長変換膜、波長変換部材、バックライトユニット、液晶表示装置
DE102015202159B4 (de) * 2015-02-06 2023-06-15 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Halbleiter-Beleuchtungsvorrichtung
EP3316322B1 (en) * 2015-06-24 2023-12-13 Seoul Semiconductor Co., Ltd. White light source system
JP6707728B2 (ja) * 2015-06-24 2020-06-10 東芝マテリアル株式会社 医療施設照明用白色光源システム
EP3135746B1 (en) 2015-08-28 2019-05-29 Nichia Corporation Method for producing nitride fluorescent material
JP6856890B2 (ja) * 2015-08-28 2021-04-14 株式会社小糸製作所 蛍光体
KR102514150B1 (ko) * 2016-01-05 2023-04-04 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 및 이를 구비한 조명 장치
US10256374B2 (en) 2016-03-04 2019-04-09 Nichia Corporation Light emitting device
JP6460040B2 (ja) * 2016-03-04 2019-01-30 日亜化学工業株式会社 発光装置
EP3241880B1 (en) * 2016-05-03 2018-04-18 Lumileds Holding B.V. Wavelength converting material for a light emitting device
JP6477779B2 (ja) * 2016-05-26 2019-03-06 日亜化学工業株式会社 発光装置
JP2016189488A (ja) * 2016-07-07 2016-11-04 日亜化学工業株式会社 発光装置
JP6848637B2 (ja) * 2016-12-02 2021-03-24 豊田合成株式会社 発光装置
JP7004892B2 (ja) * 2017-04-11 2022-01-21 日亜化学工業株式会社 発光装置
JP6934316B2 (ja) * 2017-04-24 2021-09-15 日本特殊陶業株式会社 波長変換部材
JP6861389B2 (ja) * 2017-07-26 2021-04-21 パナソニックＩｐマネジメント株式会社 屋外用照明装置
JP7009879B2 (ja) * 2017-09-26 2022-01-26 豊田合成株式会社 発光装置
JP2019062173A (ja) * 2017-09-26 2019-04-18 パナソニックＩｐマネジメント株式会社 照明装置、及び、発光装置
US10837607B2 (en) * 2017-09-26 2020-11-17 Lumileds Llc Light emitting device with improved warm-white color point
KR102130817B1 (ko) * 2018-01-25 2020-07-08 지엘비텍 주식회사 고연색성 백색 발광 소자
JP2020053664A (ja) * 2018-09-20 2020-04-02 豊田合成株式会社 発光装置
KR20210105894A (ko) 2018-12-27 2021-08-27 덴카 주식회사 형광체 기판, 발광 기판 및 조명 장치
US12068438B2 (en) 2018-12-27 2024-08-20 Denka Company Limited Phosphor substrate, light emitting substrate, and lighting device
JP7425750B2 (ja) 2018-12-27 2024-01-31 デンカ株式会社 蛍光体基板、発光基板及び照明装置
JP7457657B2 (ja) 2018-12-27 2024-03-28 デンカ株式会社 発光基板及び照明装置
JP7491849B2 (ja) * 2018-12-27 2024-05-28 デンカ株式会社 蛍光体基板、発光基板及び照明装置
JP7142145B2 (ja) * 2019-02-28 2022-09-26 京セラ株式会社 照明装置
CN110364598B (zh) * 2019-06-20 2020-10-09 华灿光电(苏州）有限公司 发光二极管外延片及其制作方法
CN116462497B (zh) * 2023-03-16 2024-09-13 河北光兴半导体技术有限公司 一种Tb3+掺杂的铝酸盐绿色荧光陶瓷及其制备方法和应用

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004505172A (ja) * 2000-07-28 2004-02-19 オスラム　オプト　セミコンダクターズ　ゲゼルシャフト　ミット　ベシュレンクテル　ハフツング 波長変換のためのルミネセンス変換ベースの発光ダイオード及び蛍光体
JP4619509B2 (ja) * 2000-09-28 2011-01-26 株式会社東芝 発光装置
DE10133352A1 (de) * 2001-07-16 2003-02-06 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Beleuchtungseinheit mit mindestens einer LED als Lichtquelle
WO2003021691A1 (en) * 2001-09-03 2003-03-13 Matsushita Electric Industrial Co., Ltd. Semiconductor light emitting device, light emitting apparatus and production method for semiconductor light emitting device
DE10147040A1 (de) * 2001-09-25 2003-04-24 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Beleuchtungseinheit mit mindestens einer LED als Lichtquelle
JP4221950B2 (ja) * 2002-05-23 2009-02-12 日亜化学工業株式会社 蛍光体
JP2003321675A (ja) * 2002-04-26 2003-11-14 Nichia Chem Ind Ltd 窒化物蛍光体及びその製造方法
AU2003215785A1 (en) * 2002-03-25 2003-10-08 Philips Intellectual Property And Standards Gmbh Tri-color white light led lamp
FR2840748B1 (fr) * 2002-06-05 2004-08-27 France Telecom Procede et systeme de verification de signatures electroniques et carte a microcircuit pour la mise en oeuvre du procede
CN100552283C (zh) * 2002-06-06 2009-10-21 埃莱特技术公司 通过使用荧光染料来模拟氖照明的照明装置
JP4207489B2 (ja) * 2002-08-06 2009-01-14 株式会社豊田中央研究所 α−サイアロン蛍光体
EP1413619A1 (en) * 2002-09-24 2004-04-28 Osram Opto Semiconductors GmbH Luminescent material, especially for LED application
JP3837588B2 (ja) * 2003-11-26 2006-10-25 独立行政法人物質・材料研究機構 蛍光体と蛍光体を用いた発光器具
JP4362625B2 (ja) * 2004-02-18 2009-11-11 独立行政法人物質・材料研究機構 蛍光体の製造方法
JP3921545B2 (ja) * 2004-03-12 2007-05-30 独立行政法人物質・材料研究機構 蛍光体とその製造方法
JP4128564B2 (ja) * 2004-04-27 2008-07-30 松下電器産業株式会社 発光装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9196800B2 (en) 1996-06-26 2015-11-24 Osram Gmbh Light-radiating semiconductor component with a luminescence conversion element
KR101157313B1 (ko) * 2004-04-27 2012-06-18 파나소닉 주식회사 형광체 조성물과 그 제조방법, 및 그 형광체 조성물을 이용한 발광 장치

Also Published As

Publication number Publication date
JP2008016861A (ja) 2008-01-24
JP3940162B2 (ja) 2007-07-04
JP4559496B2 (ja) 2010-10-06
JP2008187188A (ja) 2008-08-14
TW200611963A (en) 2006-04-16
JP4094047B2 (ja) 2008-06-04
JP2008177592A (ja) 2008-07-31
JP4128564B2 (ja) 2008-07-30
ATE546506T1 (de) 2012-03-15
ATE539135T1 (de) 2012-01-15
JP2011155297A (ja) 2011-08-11
JP2007027796A (ja) 2007-02-01
TW200944577A (en) 2009-11-01
JP5604482B2 (ja) 2014-10-08
JP4558808B2 (ja) 2010-10-06
TWI394815B (zh) 2013-05-01
JP5171981B2 (ja) 2013-03-27
JP2013021339A (ja) 2013-01-31
JP2006049799A (ja) 2006-02-16
JP2008169395A (ja) 2008-07-24

Similar Documents

Publication Publication Date Title
KR101041311B1 (ko) 형광체 조성물과 그 제조 방법, 및 그 형광체 조성물을 이용한 발광장치
TWI394815B (zh) 螢光體組成物及其製造方法、使用該螢光體組成物之發光裝置
EP1859657B1 (en) Illumination system comprising a radiation source and a fluorescent material
JP2005336450A (ja) 蛍光体組成物とその製造方法、並びにその蛍光体組成物を用いた発光装置

Legal Events

Date Code Title Description
A107 Divisional application of patent
PA0104 Divisional application for international application

Comment text: Divisional Application for International Patent

Patent event code: PA01041R01D

Patent event date: 20110125

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20110223

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20110307

Patent event code: PE09021S01D

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20111104

Patent event code: PE09021S01D

PC1202 Submission of document of withdrawal before decision of registration

Comment text: [Withdrawal of Procedure relating to Patent, etc.] Withdrawal (Abandonment)

Patent event code: PC12021R01D

Patent event date: 20120103

WITB Written withdrawal of application