JP6853614B2 - Led照明装置、その製造方法及びled照明方法 - Google Patents
Led照明装置、その製造方法及びled照明方法 Download PDFInfo
- Publication number
- JP6853614B2 JP6853614B2 JP2014066919A JP2014066919A JP6853614B2 JP 6853614 B2 JP6853614 B2 JP 6853614B2 JP 2014066919 A JP2014066919 A JP 2014066919A JP 2014066919 A JP2014066919 A JP 2014066919A JP 6853614 B2 JP6853614 B2 JP 6853614B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- emission
- phosphor
- blue
- lighting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims description 16
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 209
- 238000000295 emission spectrum Methods 0.000 claims description 104
- 238000001228 spectrum Methods 0.000 claims description 54
- 230000003595 spectral effect Effects 0.000 claims description 46
- 229920005989 resin Polymers 0.000 claims description 33
- 239000011347 resin Substances 0.000 claims description 33
- 239000011342 resin composition Substances 0.000 claims description 23
- 239000000203 mixture Substances 0.000 claims description 17
- 229920001296 polysiloxane Polymers 0.000 claims description 12
- 238000007789 sealing Methods 0.000 claims description 11
- 238000013329 compounding Methods 0.000 claims description 9
- 239000000126 substance Substances 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 239000008393 encapsulating agent Substances 0.000 claims description 4
- 239000000565 sealant Substances 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 2
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 18
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 18
- 210000001525 retina Anatomy 0.000 description 16
- 239000004973 liquid crystal related substance Substances 0.000 description 14
- 230000002411 adverse Effects 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 10
- 230000002596 correlated effect Effects 0.000 description 10
- 230000000694 effects Effects 0.000 description 10
- 229920002379 silicone rubber Polymers 0.000 description 10
- 239000004945 silicone rubber Substances 0.000 description 8
- -1 CaAlSiN 3 : Eu Chemical compound 0.000 description 5
- 108010043121 Green Fluorescent Proteins Proteins 0.000 description 5
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 5
- 239000003086 colorant Substances 0.000 description 5
- 230000005284 excitation Effects 0.000 description 5
- 238000009877 rendering Methods 0.000 description 5
- 229920001971 elastomer Polymers 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000005286 illumination Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229920002050 silicone resin Polymers 0.000 description 4
- 230000000295 complement effect Effects 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 150000004645 aluminates Chemical class 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920005672 polyolefin resin Polymers 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 208000017442 Retinal disease Diseases 0.000 description 1
- 206010038923 Retinopathy Diseases 0.000 description 1
- 229910003564 SiAlON Inorganic materials 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- IRERQBUNZFJFGC-UHFFFAOYSA-L azure blue Chemical compound [Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[S-]S[S-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-] IRERQBUNZFJFGC-UHFFFAOYSA-L 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 210000004087 cornea Anatomy 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 210000000695 crystalline len Anatomy 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000013022 formulation composition Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000013500 performance material Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920003225 polyurethane elastomer Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 235000013799 ultramarine blue Nutrition 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
- F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
- F21V9/32—Elements containing photoluminescent material distinct from or spaced from the light source characterised by the arrangement of the photoluminescent material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
- F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
- F21V9/38—Combination of two or more photoluminescent elements of different materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/104—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening using feather joints, e.g. tongues and grooves, with or without friction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
- F21V3/08—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material comprising photoluminescent substances
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Manufacturing & Machinery (AREA)
Description
色度座標(0.14,0.03)に位置する、主波長ピークが460nmである青色光を発する青色LED素子を含む青色LED照明装置を準備した。一方、表1に示すように、ミラブルタイプのシリコーンゴム100質量部に、緑色蛍光体90質量部及び赤色蛍光体10質量部を均一に分散させ、厚み0.5mmの蛍光体含有シートを作製した。なお、緑色蛍光体としては、シートにしたときに座標(0.20,0.43)に位置する、主波長510nmの緑色光を発するシリケート系緑色蛍光体を用い、赤色蛍光体としては、シートにしたときに座標(0.62,0.38)に位置する、主波長650nmの赤色光を発する窒化物系赤色蛍光体を用いた。
色度座標(0.14,0.03)に位置する、主波長ピークが460nmである青色光を発する青色LED含む青色LED照明装置を準備した。一方、表1に示すように、ミラブルタイプのシリコーンゴム100質量部に、緑色蛍光体45質量部及び赤色蛍光体11質量部を均一に分散させ、厚み0.5mmの蛍光体含有シートを作製した。なお、緑色蛍光体としては、シートにしたときに座標(0.26,0.50)に位置する、主波長525nmの緑色光を発するアルミネート系緑色蛍光体を用い、赤色蛍光体としては、シートにしたときに座標(0.62,0.38)に位置する、主波長650nmの赤色光を発する窒化物系赤色蛍光体を用いた。
色度座標(0.14,0.03)に位置する、主波長ピークが460nmである青色光を発する青色LED含む青色LED照明装置を準備した。一方、表1に示すように、ミラブルタイプのシリコーンゴム100質量部に、緑色蛍光体98質量部及び赤色蛍光体1質量部を均一に分散させ、厚み0.5mmの蛍光体含有シートを作製した。なお、緑色蛍光体としては、シートにしたときに主波長510nmの座標(0.20,0.43)に位置する緑色光を発するシリケート系緑色蛍光体を用い、赤色蛍光体としては、シートにしたときに主波長600nmの座標(0.52,0.46)に位置する赤色光を発するシリケート系赤色蛍光体を用いた。
色度座標(0.14,0.03)に位置する、主波長ピークが460nmである青色光を発する青色LED含む青色LED照明装置を準備した。一方、表1に示すように、ミラブルタイプのシリコーンゴム100質量部に、黄色蛍光体43質量部を均一に分散させ、厚み0.5mmの蛍光体含有シートを作製した。なお、黄色蛍光体としては、シートにしたときに主波長579nmの座標(0.47,0.51)に位置する黄色光を発するYAG系黄色蛍光体を用いた。
色度座標(0.14,0.03)に位置する、主波長ピークが460nmである青色光を発する青色LED含む青色LED照明装置を準備した。一方、表1に示すように、ミラブルタイプのシリコーンゴム100質量部に、黄色蛍光体53質量部を均一に分散させ、厚み0.5mmの蛍光体含有シートを作製した。なお、黄色蛍光体としては、シートにしたときに主波長583nmの座標(0.48,0.50)に位置する黄色光を発するYAG系黄色蛍光体を用いた。
色度座標(0.14,0.03)に位置する、主波長ピークが460nmである青色光を発する青色LED含む青色LED照明装置を準備した。一方、表1に示すように、ミラブルタイプのシリコーンゴム100質量部に、黄色蛍光体53質量部を均一に分散させ、厚み0.5mmの蛍光体含有シートを作製した。なお、黄色蛍光体としては、シートにしたときに主波長540nmの座標(0.32,0.48)に位置する黄色光を発するYAG系黄色蛍光体を用いた。
2,3,22 樹脂封止体(封止樹脂)
5 発光体収容部材
5a,5b リード
6 金線
10,20,21,30,40 LED照明装置
12,18,42 蛍光体含有シート
15,43 回路基板
41 LEDパッケージ
43a 電気回路
44 ハウジング部材
45 プラグ
46 溝
FG 緑色蛍光体
FR 赤色蛍光体
Claims (16)
- LED照明装置であって、
440nm〜480nmの波長領域に発光ピークを有する光を発する青色LED素子と、前記青色LED素子の前記発光ピークを含む光に励起されて495nm〜510nmの波長領域に発光ピークを有する光を発する緑色蛍光体と、前記青色LED素子の前記発光ピークを含む光に励起されて595〜680nmの波長領域に発光ピークを有する光を発する赤色蛍光体とを含み、
前記青色LED素子の発光による青色発光スペクトルと、前記緑色蛍光体の発光による緑色発光スペクトルと、前記赤色蛍光体の発光による赤色発光スペクトルとの混合による混色を発光し、
前記混色の発光色がANSI(American National Standards Institute、C78.377)領域にあり、
前記青色発光スペクトルの相対スペクトル面積を(AB),発光ピーク強度を(IB)とし、前記緑色発光スペクトルの相対スペクトル面積を(AG),発光ピーク強度を(IG)とし、前記赤色発光スペクトルの相対スペクトル面積を(AR),発光ピーク強度を(IR)とした場合、
IB<IG,IB<IR,AB≦AG,AB≦AR,及びAB/(AR+AG)≦0.03を満たすLED照明装置。 - 前記混色された光のスペクトルの全相対面積に対して、波長480nm以下の領域の相対スペクトル面積が20%以下である請求項1に記載のLED照明装置。
- 前記混色された光のスペクトルの全相対面積に対して、波長480nm以下の領域の相対スペクトル面積が15%以下である請求項1に記載のLED照明装置。
- 前記青色LED素子の発光に励起されて550nm〜590nmの波長領域に発光ピークを有する光を発する黄色蛍光体をさらに含む請求項1〜3の何れか1項に記載のLED照明装置。
- 前記青色LED素子を封止する樹脂封止体を含み、
前記樹脂封止体に前記赤色蛍光体及び前記緑色蛍光体が配合されている請求項1〜4の何れか1項に記載のLED照明装置。 - 前記樹脂封止体はシリコーンを含む請求項5に記載のLED照明装置。
- 前記青色LED素子からの光を波長変換する樹脂シートを含み、
前記樹脂シートに前記赤色蛍光体及び前記緑色蛍光体が配合されている請求項1〜4の何れか1項に記載のLED照明装置。 - 前記青色LED素子を封止する樹脂封止体を含み、
前記樹脂シートは前記樹脂封止体中に封止されている請求項7に記載のLED照明装置。 - 前記青色LED素子を封止する樹脂封止体を含み、
前記樹脂シートは前記樹脂封止体を覆うように配置されている請求項7に記載のLED照明装置。 - 回路基板及び前記回路基板表面に配設された前記青色LED素子を含む複数のLEDパッケージを備える光源ユニットと、前記光源ユニットを収容するハウジング部材と、前記複数のLEDパッケージを覆うように配置され、前記青色LED素子の発光を波長変換して該波長変換された光を外部に出射するための、少なくとも1枚の前記樹脂シートを備える請求項7に記載のLED照明装置。
- 前記樹脂シートはシリコーンを含む請求項7〜10の何れか1項に記載のLED照明装置。
- 440nm〜480nmの波長領域に発光ピークを有する光を発する青色LED素子と、前記青色LED素子の前記発光ピークを含む光に励起されて495nm〜510nmの波長領域に発光ピークを有する光を発する緑色蛍光体と、前記青色LED素子の前記発光ピークを含む光に励起されて595nm〜680nmの波長領域に発光ピークを有する光を発する赤色蛍光体とを準備する工程と、
前記青色LED素子の発光による青色発光スペクトルと、前記緑色蛍光体の発光による緑色発光スペクトルと、前記赤色蛍光体の発光による赤色発光スペクトルとの混合により所定の混色を発光させるように、前記緑色蛍光体及び前記赤色蛍光体の配合組成を決定する工程と、
前記配合組成に応じた前記緑色蛍光体及び前記赤色蛍光体を透明樹脂に分散させて蛍光体樹脂組成物を調製する工程と、
前記蛍光体樹脂組成物を前記青色LED素子の発光領域に配置する工程とを備え、
前記混色の発光色がANSI(American National Standards Institute、C78.377)領域にあり、
前記配合組成が、
前記青色発光スペクトルの相対スペクトル面積を(AB),発光ピーク強度を(IB)とし、前記緑色発光スペクトルの相対スペクトル面積を(AG),発光ピーク強度を(IG)とし、前記赤色発光スペクトルの相対スペクトル面積を(AR),発光ピーク強度を(IR)とした場合、IB<IG,IB<IR,AB≦AG,AB≦AR,及びAB/(AR+AG)≦0.03を満たすように決定されるLED照明装置の製造方法。 - 前記蛍光体樹脂組成物を前記青色LED素子の発光領域に配置する工程が、前記青色LED素子を前記蛍光体樹脂組成物で封止する工程である請求項12に記載のLED照明装置の製造方法。
- 前記蛍光体樹脂組成物を前記青色LED素子の発光領域に配置する工程が、
前記蛍光体樹脂組成物をシート状に成形する工程と、前記青色LED素子の発光領域に前記シート状に成形された蛍光体樹脂組成物で前記青色LED素子の発光領域に配置する工程である請求項12に記載のLED照明装置の製造方法。 - 440nm〜480nmの波長領域に発光ピークを有する光を発する青色LED素子を発光させる工程と、
前記青色LED素子の前記発光ピークを含む光により、495nm〜510nmの波長領域に発光ピークを有する光を発する緑色蛍光体と、595〜680nmの波長領域に発光ピークを有する光を発する赤色蛍光体とを励起させて発光させる工程と、
前記青色LED素子の発光による青色発光スペクトルと、前記緑色蛍光体の発光による緑色発光スペクトルと、前記赤色蛍光体の発光による赤色発光スペクトルとの混合による混色させる工程とを備え、
前記混色の発光色がANSI(American National Standards Institute、C78.377)領域にあり、
前記青色発光スペクトルの相対スペクトル面積を(AB),発光ピーク強度を(IB)とし、前記緑色発光スペクトルの相対スペクトル面積を(AG),発光ピーク強度を(IG)とし、前記赤色発光スペクトルの相対スペクトル面積を(AR),発光ピーク強度を(IR)とした場合、
IB<IG,IB<IR,AB≦AG,AB≦AR,及びAB/(AR+AG)≦0.03を満たすLED照明方法。 - 前記混色された光のスペクトルの全相対面積に対して、波長480nm以下の領域の相対スペクトル面積が20%以下である請求項15に記載のLED照明方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014066919A JP6853614B2 (ja) | 2013-03-29 | 2014-03-27 | Led照明装置、その製造方法及びled照明方法 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013075380 | 2013-03-29 | ||
JP2013075380 | 2013-03-29 | ||
JP2014066919A JP6853614B2 (ja) | 2013-03-29 | 2014-03-27 | Led照明装置、その製造方法及びled照明方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014209617A JP2014209617A (ja) | 2014-11-06 |
JP6853614B2 true JP6853614B2 (ja) | 2021-03-31 |
Family
ID=51620686
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014066919A Active JP6853614B2 (ja) | 2013-03-29 | 2014-03-27 | Led照明装置、その製造方法及びled照明方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US9500326B2 (ja) |
JP (1) | JP6853614B2 (ja) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI596805B (zh) * | 2013-07-24 | 2017-08-21 | 晶元光電股份有限公司 | 發光元件及其製作方法 |
US20150252986A1 (en) * | 2014-03-10 | 2015-09-10 | Chih-Ming Yu | Lamp structure |
JP6720470B2 (ja) * | 2014-11-28 | 2020-07-08 | 三菱ケミカル株式会社 | 蛍光体含有シリコーンシートの製造方法 |
WO2016093119A1 (ja) * | 2014-12-09 | 2016-06-16 | 信越化学工業株式会社 | 車載ヘッドライト用led光源 |
KR101692290B1 (ko) * | 2015-03-31 | 2017-01-04 | (주) 디엠라이트 | 색온도 조절이 가능한 엘이디 조명장치 |
US20160356435A1 (en) * | 2015-06-04 | 2016-12-08 | GE Lighting Solutions, LLC | Led lighting units, materials, and optical components for white light illumination |
JP6842234B2 (ja) | 2015-10-13 | 2021-03-17 | ローム株式会社 | 光半導体装置の製造方法および光半導体装置 |
US9985182B2 (en) * | 2015-12-25 | 2018-05-29 | Citizen Electronics Co., Ltd. | Light-emitting apparatus and color-matching apparatus |
CN109312911B (zh) * | 2016-01-28 | 2021-01-01 | 生态照明公司 | 用于产生具有高显色性的褪黑素响应可调白光的方法 |
JP2017191879A (ja) * | 2016-04-14 | 2017-10-19 | 株式会社小糸製作所 | 発光モジュール |
KR101995000B1 (ko) * | 2016-05-16 | 2019-07-01 | 엘지이노텍 주식회사 | 발광소자 패키지 및 조명장치 |
KR102298935B1 (ko) * | 2017-03-28 | 2021-09-08 | 가부시키가이샤 아사히 러버 | Led 장치의 제조 방법 |
JP2019062173A (ja) * | 2017-09-26 | 2019-04-18 | パナソニックIpマネジメント株式会社 | 照明装置、及び、発光装置 |
JP6940764B2 (ja) | 2017-09-28 | 2021-09-29 | 日亜化学工業株式会社 | 発光装置 |
JP7361291B2 (ja) | 2018-01-15 | 2023-10-16 | 株式会社朝日ラバー | Led装置及び発光表示構造 |
WO2020144882A1 (ja) * | 2019-01-11 | 2020-07-16 | 株式会社朝日ラバー | 光源、led装置及び発光表示構造 |
WO2019180959A1 (ja) * | 2018-03-23 | 2019-09-26 | サンケン電気株式会社 | 発光装置及び照明器具 |
WO2020210740A1 (en) * | 2019-04-11 | 2020-10-15 | PixelDisplay Inc. | Method and apparatus of a multi-modal illumination and display for improved color rendering, power efficiency, health and eye-safety |
JP6846072B1 (ja) * | 2019-09-17 | 2021-03-24 | Zigenライティングソリューション株式会社 | 発光装置、及び照明装置 |
KR20210048621A (ko) | 2019-10-23 | 2021-05-04 | 삼성전자주식회사 | 발광장치 및 식물생장용 조명장치 |
CN111442198B (zh) * | 2020-03-30 | 2021-02-05 | 旭宇光电(深圳)股份有限公司 | 全光谱发光系统 |
KR102401589B1 (ko) * | 2020-06-03 | 2022-05-25 | 지엘비텍 주식회사 | 인체에 유익한 스펙트럼을 가지는 고연색성 백색 광원 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002190622A (ja) * | 2000-12-22 | 2002-07-05 | Sanken Electric Co Ltd | 発光ダイオード用透光性蛍光カバー |
JP4128564B2 (ja) * | 2004-04-27 | 2008-07-30 | 松下電器産業株式会社 | 発光装置 |
JP4989936B2 (ja) * | 2006-07-27 | 2012-08-01 | 株式会社朝日ラバー | 照明装置 |
KR100771772B1 (ko) | 2006-08-25 | 2007-10-30 | 삼성전기주식회사 | 백색 led 모듈 |
KR100930171B1 (ko) * | 2006-12-05 | 2009-12-07 | 삼성전기주식회사 | 백색 발광장치 및 이를 이용한 백색 광원 모듈 |
JP2008270781A (ja) * | 2007-03-23 | 2008-11-06 | Toshiba Lighting & Technology Corp | 発光装置 |
JP2008311532A (ja) * | 2007-06-15 | 2008-12-25 | Rohm Co Ltd | 白色発光装置及び白色発光装置の形成方法 |
US8384092B2 (en) * | 2007-08-30 | 2013-02-26 | Nichia Corporation | Light emitting device |
JP2009188246A (ja) * | 2008-02-07 | 2009-08-20 | Stanley Electric Co Ltd | Led照明灯具用コントローラ |
JP2010153065A (ja) | 2008-12-24 | 2010-07-08 | Sony Corp | 照明装置および方法、表示装置および方法、並びにプログラム |
JP5342368B2 (ja) | 2009-08-06 | 2013-11-13 | 株式会社朝日ラバー | 発光ダイオード |
WO2011024818A1 (ja) * | 2009-08-26 | 2011-03-03 | 三菱化学株式会社 | 白色半導体発光装置 |
KR101683270B1 (ko) * | 2010-03-31 | 2016-12-21 | 삼성전자 주식회사 | 백색 발광 다이오드를 포함하는 액정 디스플레이 장치 |
JP2012060097A (ja) * | 2010-06-25 | 2012-03-22 | Mitsubishi Chemicals Corp | 白色半導体発光装置 |
JP2012164742A (ja) * | 2011-02-04 | 2012-08-30 | Showa Denko Kk | 照明装置および照明装置の製造方法 |
JP2013028667A (ja) * | 2011-07-27 | 2013-02-07 | Panasonic Corp | イットリウムアルミニウムガーネットタイプの蛍光体とこれを用いた発光装置 |
-
2014
- 2014-03-27 JP JP2014066919A patent/JP6853614B2/ja active Active
- 2014-03-29 US US14/229,888 patent/US9500326B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2014209617A (ja) | 2014-11-06 |
US20140293608A1 (en) | 2014-10-02 |
US9500326B2 (en) | 2016-11-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6853614B2 (ja) | Led照明装置、その製造方法及びled照明方法 | |
JP4989936B2 (ja) | 照明装置 | |
JP6501803B2 (ja) | 光源装置および発光装置 | |
CN107068838B (zh) | 用于展示展示物的装置和用于展示展示物的系统 | |
EP2747157A2 (en) | Light-emitting module and lighting source including the same | |
JP2017118130A (ja) | 光源装置および発光装置 | |
JP6275829B2 (ja) | 発光装置 | |
JP2008187195A (ja) | 白色発光装置及びこれを用いた白色光源モジュール | |
WO2014203841A1 (ja) | 発光装置 | |
KR20170134241A (ko) | 발광 장치 | |
JP5580100B2 (ja) | 半導体発光装置の製造方法または半導体発光ダイオードの製造方法 | |
JP6773018B2 (ja) | 発光装置 | |
JP6503929B2 (ja) | 半導体発光装置 | |
JPWO2016159141A1 (ja) | 発光装置 | |
JP2021061448A (ja) | 発光装置 | |
CN110970542B (zh) | 发光装置和具备其的灯具 | |
JP2018182028A (ja) | 発光装置 | |
JP2016136587A (ja) | 発光装置 | |
EP2736086B1 (en) | Light emitting device package | |
JP3987516B2 (ja) | 蛍光体及び発光ダイオード | |
KR102159984B1 (ko) | 고연색성 비전 세이프가드용 엘이디 광원 | |
CN103242843B (zh) | 荧光体及发光装置 | |
CN103242832B (zh) | 荧光体及发光装置 | |
JP2010212621A (ja) | 発光装置 | |
TWI303493B (en) | White-light display device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170302 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20171225 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180109 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20180307 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180502 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180703 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20180903 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20190312 |
|
C60 | Trial request (containing other claim documents, opposition documents) |
Free format text: JAPANESE INTERMEDIATE CODE: C60 Effective date: 20190611 |
|
C22 | Notice of designation (change) of administrative judge |
Free format text: JAPANESE INTERMEDIATE CODE: C22 Effective date: 20191217 |
|
C22 | Notice of designation (change) of administrative judge |
Free format text: JAPANESE INTERMEDIATE CODE: C22 Effective date: 20200414 |
|
C13 | Notice of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: C13 Effective date: 20200512 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200710 |
|
C13 | Notice of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: C13 Effective date: 20201006 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20201204 |
|
C302 | Record of communication |
Free format text: JAPANESE INTERMEDIATE CODE: C302 Effective date: 20210105 |
|
C23 | Notice of termination of proceedings |
Free format text: JAPANESE INTERMEDIATE CODE: C23 Effective date: 20210112 |
|
C03 | Trial/appeal decision taken |
Free format text: JAPANESE INTERMEDIATE CODE: C03 Effective date: 20210216 |
|
C30A | Notification sent |
Free format text: JAPANESE INTERMEDIATE CODE: C3012 Effective date: 20210216 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20210312 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6853614 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |