JP2009019163A - 発光装置用蛍光体粒子集合体、発光装置、および液晶表示用バックライト装置 - Google Patents
発光装置用蛍光体粒子集合体、発光装置、および液晶表示用バックライト装置 Download PDFInfo
- Publication number
- JP2009019163A JP2009019163A JP2007184440A JP2007184440A JP2009019163A JP 2009019163 A JP2009019163 A JP 2009019163A JP 2007184440 A JP2007184440 A JP 2007184440A JP 2007184440 A JP2007184440 A JP 2007184440A JP 2009019163 A JP2009019163 A JP 2009019163A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting device
- phosphor particles
- light
- median diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/16—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on silicates other than clay
- C04B35/22—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on silicates other than clay rich in calcium oxide, e.g. wollastonite
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
- C04B35/581—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on aluminium nitride
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
- C04B35/584—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicon nitride
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
- C04B35/597—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicon oxynitride, e.g. SIALONS
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/0883—Arsenides; Nitrides; Phosphides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77348—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
- C09K11/77742—Silicates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3201—Alkali metal oxides or oxide-forming salts thereof
- C04B2235/3203—Lithium oxide or oxide-forming salts thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3205—Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
- C04B2235/3206—Magnesium oxides or oxide-forming salts thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3205—Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
- C04B2235/3208—Calcium oxide or oxide-forming salts thereof, e.g. lime
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3224—Rare earth oxide or oxide forming salts thereof, e.g. scandium oxide
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3224—Rare earth oxide or oxide forming salts thereof, e.g. scandium oxide
- C04B2235/3225—Yttrium oxide or oxide-forming salts thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3224—Rare earth oxide or oxide forming salts thereof, e.g. scandium oxide
- C04B2235/3229—Cerium oxides or oxide-forming salts thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/38—Non-oxide ceramic constituents or additives
- C04B2235/3852—Nitrides, e.g. oxynitrides, carbonitrides, oxycarbonitrides, lithium nitride, magnesium nitride
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/54—Particle size related information
- C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
- C04B2235/5436—Particle size related information expressed by the size of the particles or aggregates thereof micrometer sized, i.e. from 1 to 100 micron
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/74—Physical characteristics
- C04B2235/76—Crystal structural characteristics, e.g. symmetry
- C04B2235/767—Hexagonal symmetry, e.g. beta-Si3N4, beta-Sialon, alpha-SiC or hexa-ferrites
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
Abstract
【解決手段】発光装置用蛍光体粒子集合体は、互いに異なる発光ピーク波長を有する複数種類の蛍光体粒子を含み、相対的に短い発光ピーク波長を有する種類の蛍光体粒子に比べて、相対的に長い発光ピーク波長を有する種類の蛍光体粒子は相対的に大きなメディアン径を有していることを特徴としている。
【選択図】図1
Description
本発明の実施例1として、図1の模式的断面図に示されているような発光装置が作製された。この発光装置10は、樹脂カップ30内において、1次光を発する半導体発光素子11と、1次光の少なくとも一部を吸収してその1次光の波長以上の波長を有する2次光を発する波長変換部13とを含んでいる。半導体発光素子11はカソード端子14上に載置され、金ワイヤ12によってカソード端子14およびアノード端子15ヘ電気的に接続されている。波長変換部13は、透光性樹脂20内で分布させられた2種類の蛍光体粒子21と22を含んでいる。
本発明による実施例2においても、実施例1に類似して発光装置が作製された。本実施例2においては、半導体発光素子11として、460nmのピーク波長を有する窒化ガリウム(GaN)系半導体発光素子を用いた。
実施例1と2および比較例1と2の場合に類似して、実施例3〜8および比較例3〜8による発光装置がさらに作製され、それぞれの発光装置の特性評価結果が表3に示されている。これらの実施例3〜8においては、波長変換部13に含まれる蛍光体粒子の種類とメディアン径が種々に変更されている。そして、各比較例においては、対比すべき実施例に比べてメディアン径のみが変更されている。
Claims (8)
- 互いに異なる発光ピーク波長を有する複数種類の蛍光体粒子を含み、相対的に短い発光ピーク波長を有する種類の蛍光体粒子に比べて、相対的に長い発光ピーク波長を有する種類の蛍光体粒子は相対的に大きなメディアン径を有していることを特徴とする発光装置用蛍光体粒子集合体。
- (MI1-aEua)MIISiN3で表されかつメディアン径R1を有する2価のユーロピウム付活窒化物赤色系蛍光体粒子に加えて、
EubSicAldOeNfで表されるβ型サイアロンであってメディアン径G1を有する2価のユーロピウム付活酸窒化物緑色系蛍光体粒子、
MIIIgEuhSiiAljOkNlで表されるα型サイアロンであってメディアン径Y1を有する2価のユーロピウム付活酸窒化物黄色系蛍光体粒子、および
MIV3(MV1-mCem)2(SiO4)3で表されかつメディアン径G2を有する3価のセリウム付活珪酸塩緑色系蛍光体粒子の1種類以上を含み、
ここで、MIはMg、Ca、SrおよびBaの少なくとも1種の元素を表し、MIIはAl、Ga、In、Sc、Y、La、GdおよびLuの少なくとも1種の元素を表し、MIIIはLi、Na、K、Rb、Cs、Mg、Ca、SrおよびBaの少なくとも1種の元素を表し、MIVはMg、Ca、SrおよびBaの少なくとも1種の元素を表し、そしてMVはAl、Ga、In、Sc、Y、La、GdおよびLuの少なくとも1種の元素を表し、
0.001≦a≦0.10;0.005≦b≦0.4;c+d=12;e+f=16;0<g≦3.0;0.005≦h≦0.4;i+j=12;k+l=16;および0.005≦m≦0.5の条件を満たし、
さらに、1.3≦R1/G1≦4.0;1.3≦R1/Y1≦4.0;および1.3≦R1/G2≦4.0の条件を満たすことを特徴とする発光装置用蛍光体粒子集合体。 - MIIはAl、GaおよびInの少なくとも1種の元素であることを特徴とする請求項2に記載の発光装置用蛍光体粒子集合体。
- MVはGa、In、ScおよびYの少なくとも1種の元素であることを特徴とする請求項2または3に記載の発光装置用蛍光体粒子集合体。
- 7μm≦R1≦19μmであることを特徴とする請求項2から4のいずれかに記載の発光装置用蛍光体粒子集合体。
- 430nmから480nmの範囲内にピーク波長を有する1次光を射出し得る窒化ガリウム系半導体発光素子と、その1次光を吸収して前記1次光に比べて長いピーク波長を有する2次光を発する波長変換部とを含み、
前記波長変換部は請求項1から5のいずれかの蛍光体粒子集合体を含む単一の樹脂層からなっていて前記半導体発光素子を覆っていることを特徴とする発光装置。 - 前記樹脂層内においては、前記半導体発光素子に遠い位置に比べて近い位置において相対的に長い蛍光ピーク波長と相対的に大きなメディアン径とを有する種類の前記蛍光体粒子の分布密度が高められていることを特徴とする請求項6に記載の発光装置。
- 請求項6または7の発光装置を含むことを特徴とする液晶表示用バックライト装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007184440A JP2009019163A (ja) | 2007-07-13 | 2007-07-13 | 発光装置用蛍光体粒子集合体、発光装置、および液晶表示用バックライト装置 |
CN2008101769788A CN101412910B (zh) | 2007-07-13 | 2008-07-10 | 发光装置用荧光体粒子集合体、发光装置、及液晶显示用背光装置 |
US12/171,946 US7808012B2 (en) | 2007-07-13 | 2008-07-11 | Group of phosphor particles for light-emitting device, light-emitting device and backlight for liquid crystal display |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007184440A JP2009019163A (ja) | 2007-07-13 | 2007-07-13 | 発光装置用蛍光体粒子集合体、発光装置、および液晶表示用バックライト装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009019163A true JP2009019163A (ja) | 2009-01-29 |
JP2009019163A5 JP2009019163A5 (ja) | 2010-08-19 |
Family
ID=40252342
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007184440A Pending JP2009019163A (ja) | 2007-07-13 | 2007-07-13 | 発光装置用蛍光体粒子集合体、発光装置、および液晶表示用バックライト装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7808012B2 (ja) |
JP (1) | JP2009019163A (ja) |
CN (1) | CN101412910B (ja) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012144087A1 (ja) * | 2011-04-22 | 2012-10-26 | 株式会社東芝 | 白色光源およびそれを用いた白色光源システム |
JP2013046046A (ja) * | 2011-08-26 | 2013-03-04 | Mitsubishi Chemicals Corp | 発光装置 |
CN102986044A (zh) * | 2010-10-15 | 2013-03-20 | 三菱化学株式会社 | 白色发光装置及照明器具 |
JP2013163731A (ja) * | 2012-02-09 | 2013-08-22 | Denki Kagaku Kogyo Kk | 蛍光体及び発光装置 |
JP2013163730A (ja) * | 2012-02-09 | 2013-08-22 | Denki Kagaku Kogyo Kk | 蛍光体及び発光装置 |
JP2013163728A (ja) * | 2012-02-09 | 2013-08-22 | Denki Kagaku Kogyo Kk | 蛍光体及び発光装置 |
JP2013163732A (ja) * | 2012-02-09 | 2013-08-22 | Denki Kagaku Kogyo Kk | 蛍光体及び発光装置 |
JP2013163729A (ja) * | 2012-02-09 | 2013-08-22 | Denki Kagaku Kogyo Kk | 蛍光体及び発光装置 |
WO2014103671A1 (ja) * | 2012-12-28 | 2014-07-03 | シャープ株式会社 | 発光装置 |
US9190582B2 (en) | 2013-04-03 | 2015-11-17 | Kabushiki Kaisha Toshiba | Light emitting device |
KR101786097B1 (ko) * | 2011-07-14 | 2017-10-17 | 엘지이노텍 주식회사 | 광학 부재, 이를 포함하는 표시장치 및 이의 제조방법 |
JP2018137321A (ja) * | 2017-02-21 | 2018-08-30 | シャープ株式会社 | 発光装置および画像表示装置 |
JP2020004986A (ja) * | 2014-03-14 | 2020-01-09 | 日亜化学工業株式会社 | 発光装置の製造方法 |
Families Citing this family (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007049114A (ja) | 2005-05-30 | 2007-02-22 | Sharp Corp | 発光装置とその製造方法 |
US20070052342A1 (en) * | 2005-09-01 | 2007-03-08 | Sharp Kabushiki Kaisha | Light-emitting device |
JP5367218B2 (ja) | 2006-11-24 | 2013-12-11 | シャープ株式会社 | 蛍光体の製造方法および発光装置の製造方法 |
JP5284006B2 (ja) * | 2008-08-25 | 2013-09-11 | シチズン電子株式会社 | 発光装置 |
BR112012004505A2 (pt) * | 2009-08-31 | 2016-03-29 | Sharp Kk | dispositivo de cristal líquido |
WO2011083671A1 (ja) | 2010-01-08 | 2011-07-14 | シャープ株式会社 | 蛍光体、発光装置およびそれを用いた液晶表示装置 |
WO2011105571A1 (ja) * | 2010-02-26 | 2011-09-01 | 三菱化学株式会社 | ハロリン酸塩蛍光体、及び白色発光装置 |
JP2011225696A (ja) * | 2010-04-19 | 2011-11-10 | Sharp Corp | 赤色系発光蛍光体、その製造方法および赤色系発光蛍光体を用いた発光装置 |
US20120313507A1 (en) * | 2010-07-20 | 2012-12-13 | Kagaku Kogyo Kabushiki Kaisha | beta-SIALON, METHOD FOR MANUFACTURING THE SAME, AND LIGHT-EMITTING DEVICE |
CN102376860A (zh) | 2010-08-05 | 2012-03-14 | 夏普株式会社 | 发光装置及其制造方法 |
US8742654B2 (en) * | 2011-02-25 | 2014-06-03 | Cree, Inc. | Solid state light emitting devices including nonhomogeneous luminophoric particle size layers |
CN102683542B (zh) * | 2011-03-15 | 2014-12-10 | 展晶科技(深圳)有限公司 | Led封装结构 |
US8957438B2 (en) | 2011-04-07 | 2015-02-17 | Cree, Inc. | Methods of fabricating light emitting devices including multiple sequenced luminophoric layers |
US8513900B2 (en) * | 2011-05-12 | 2013-08-20 | Ledengin, Inc. | Apparatus for tuning of emitter with multiple LEDs to a single color bin |
CN102810618B (zh) * | 2011-06-02 | 2015-04-29 | 展晶科技(深圳)有限公司 | 半导体封装结构 |
DE102011078402A1 (de) * | 2011-06-30 | 2013-01-03 | Osram Ag | Konversionselement und Leuchtdiode mit einem solchen Konversionselement |
TWI505515B (zh) * | 2011-08-19 | 2015-10-21 | Epistar Corp | 發光裝置及其製造方法 |
CN102956800B (zh) * | 2011-08-31 | 2016-08-03 | 晶元光电股份有限公司 | 波长转换结构及其制造方法以及发光装置 |
US9082993B2 (en) * | 2011-09-06 | 2015-07-14 | Ezeddin Mohajerani | Organic light emitting diodes having increased illumination |
JP2013106550A (ja) * | 2011-11-18 | 2013-06-06 | Sharp Corp | 植物育成用照明装置 |
JP2015083618A (ja) * | 2012-02-09 | 2015-04-30 | 電気化学工業株式会社 | 蛍光体及び発光装置 |
JP5697765B2 (ja) * | 2012-02-09 | 2015-04-08 | 電気化学工業株式会社 | 蛍光体及び発光装置 |
JP2015510954A (ja) * | 2012-03-06 | 2015-04-13 | 日東電工株式会社 | 発光デバイス用のセラミック体 |
JP2013191385A (ja) * | 2012-03-13 | 2013-09-26 | Toshiba Lighting & Technology Corp | 照明装置 |
JP2014165225A (ja) * | 2013-02-21 | 2014-09-08 | Toshiba Lighting & Technology Corp | 発光モジュールおよび照明装置 |
CN104465936B (zh) * | 2013-09-13 | 2017-05-24 | 展晶科技(深圳)有限公司 | 发光二极管 |
JP5620562B1 (ja) * | 2013-10-23 | 2014-11-05 | 株式会社光波 | 単結晶蛍光体及び発光装置 |
TWI528601B (zh) * | 2014-04-30 | 2016-04-01 | 新世紀光電股份有限公司 | 封裝方法及封裝結構 |
KR20150145798A (ko) * | 2014-06-19 | 2015-12-31 | 삼성디스플레이 주식회사 | 백라이트 어셈블리 및 그를 포함하는 표시장치 |
KR101467808B1 (ko) * | 2014-07-14 | 2014-12-03 | 엘지전자 주식회사 | 황색 발광 형광체 및 이를 이용한 발광 소자 패키지 |
US9530943B2 (en) | 2015-02-27 | 2016-12-27 | Ledengin, Inc. | LED emitter packages with high CRI |
JP6354626B2 (ja) * | 2015-03-09 | 2018-07-11 | 豊田合成株式会社 | 発光装置の製造方法 |
US10752836B2 (en) | 2015-05-07 | 2020-08-25 | Osram Oled Gmbh | Phosphor |
US20180301869A1 (en) * | 2015-11-04 | 2018-10-18 | Sharp Kabushiki Kaisha | Light-emitting body, light-emitting device, illuminator, and method for producing light-emitting body |
JP7029963B2 (ja) * | 2016-02-02 | 2022-03-04 | シチズン電子株式会社 | 発光装置およびその製造方法 |
TWI657602B (zh) * | 2016-04-25 | 2019-04-21 | 日商日本特殊陶業股份有限公司 | 波長轉換構件及其製造方法、以及發光裝置 |
US10886437B2 (en) * | 2016-11-03 | 2021-01-05 | Lumileds Llc | Devices and structures bonded by inorganic coating |
US10219345B2 (en) | 2016-11-10 | 2019-02-26 | Ledengin, Inc. | Tunable LED emitter with continuous spectrum |
CN108807699B (zh) * | 2017-04-26 | 2021-02-02 | 张家港康得新光电材料有限公司 | 透明显示膜 |
WO2019188630A1 (ja) * | 2018-03-29 | 2019-10-03 | デンカ株式会社 | α型サイアロン蛍光体及び発光装置 |
KR102599819B1 (ko) | 2022-01-20 | 2023-11-08 | 미쯔비시 케미컬 주식회사 | 형광체, 발광 장치, 조명 장치, 화상 표시 장치 및 차량용 표시등 |
EP4293732A1 (en) | 2022-01-20 | 2023-12-20 | Mitsubishi Chemical Corporation | Phosphor, light-emitting device, lighting device, image display device, and indicator lamp for vehicles |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005244075A (ja) * | 2004-02-27 | 2005-09-08 | Matsushita Electric Works Ltd | 発光装置 |
JP2005277127A (ja) * | 2004-03-25 | 2005-10-06 | Stanley Electric Co Ltd | 発光デバイス |
JP2006049799A (ja) * | 2004-04-27 | 2006-02-16 | Matsushita Electric Ind Co Ltd | 発光装置 |
JP2006089547A (ja) * | 2004-09-22 | 2006-04-06 | National Institute For Materials Science | 蛍光体とその製造方法および発光器具 |
JP2006261512A (ja) * | 2005-03-18 | 2006-09-28 | Fujikura Ltd | 発光デバイス及び照明装置 |
JP2007007045A (ja) * | 2005-06-29 | 2007-01-18 | Toshiba Corp | 超音波診断装置 |
JP2007049114A (ja) * | 2005-05-30 | 2007-02-22 | Sharp Corp | 発光装置とその製造方法 |
JP2007180483A (ja) * | 2005-11-30 | 2007-07-12 | Sharp Corp | 発光装置 |
JP2007191680A (ja) * | 2005-09-01 | 2007-08-02 | Sharp Corp | 発光装置 |
JP2008127547A (ja) * | 2006-11-24 | 2008-06-05 | Sharp Corp | 蛍光体およびその製造方法、ならびに発光装置 |
JP2008300544A (ja) * | 2007-05-30 | 2008-12-11 | Sharp Corp | 発光装置およびその製造方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1993152B1 (de) * | 1996-06-26 | 2014-05-21 | OSRAM Opto Semiconductors GmbH | Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
US6686691B1 (en) * | 1999-09-27 | 2004-02-03 | Lumileds Lighting, U.S., Llc | Tri-color, white light LED lamps |
JP2003121838A (ja) | 2001-08-06 | 2003-04-23 | Toray Ind Inc | 液晶表示装置 |
JP2003321675A (ja) | 2002-04-26 | 2003-11-14 | Nichia Chem Ind Ltd | 窒化物蛍光体及びその製造方法 |
JP2004210921A (ja) | 2002-12-27 | 2004-07-29 | Nichia Chem Ind Ltd | オキシ窒化物蛍光体及びその製造方法並びにそれを用いた発光装置 |
JP4124684B2 (ja) | 2003-03-25 | 2008-07-23 | セイコーインスツル株式会社 | 半透過型液晶表示装置 |
JP2005091480A (ja) * | 2003-09-12 | 2005-04-07 | Nitto Denko Corp | 異方性フィルムの製造方法 |
US8417215B2 (en) * | 2004-07-28 | 2013-04-09 | Koninklijke Philips Electronics N.V. | Method for positioning of wireless medical devices with short-range radio frequency technology |
CN100517781C (zh) * | 2005-05-30 | 2009-07-22 | 夏普株式会社 | 发光器件及其制造方法 |
US7923928B2 (en) * | 2006-06-27 | 2011-04-12 | Mitsubishi Chemical Corporation | Illuminating device |
-
2007
- 2007-07-13 JP JP2007184440A patent/JP2009019163A/ja active Pending
-
2008
- 2008-07-10 CN CN2008101769788A patent/CN101412910B/zh active Active
- 2008-07-11 US US12/171,946 patent/US7808012B2/en active Active
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005244075A (ja) * | 2004-02-27 | 2005-09-08 | Matsushita Electric Works Ltd | 発光装置 |
JP2005277127A (ja) * | 2004-03-25 | 2005-10-06 | Stanley Electric Co Ltd | 発光デバイス |
JP2006049799A (ja) * | 2004-04-27 | 2006-02-16 | Matsushita Electric Ind Co Ltd | 発光装置 |
JP2006089547A (ja) * | 2004-09-22 | 2006-04-06 | National Institute For Materials Science | 蛍光体とその製造方法および発光器具 |
JP2006261512A (ja) * | 2005-03-18 | 2006-09-28 | Fujikura Ltd | 発光デバイス及び照明装置 |
JP2007049114A (ja) * | 2005-05-30 | 2007-02-22 | Sharp Corp | 発光装置とその製造方法 |
JP2007007045A (ja) * | 2005-06-29 | 2007-01-18 | Toshiba Corp | 超音波診断装置 |
JP2007191680A (ja) * | 2005-09-01 | 2007-08-02 | Sharp Corp | 発光装置 |
JP2007180483A (ja) * | 2005-11-30 | 2007-07-12 | Sharp Corp | 発光装置 |
JP2008127547A (ja) * | 2006-11-24 | 2008-06-05 | Sharp Corp | 蛍光体およびその製造方法、ならびに発光装置 |
JP2008300544A (ja) * | 2007-05-30 | 2008-12-11 | Sharp Corp | 発光装置およびその製造方法 |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102986044A (zh) * | 2010-10-15 | 2013-03-20 | 三菱化学株式会社 | 白色发光装置及照明器具 |
CN102986044B (zh) * | 2010-10-15 | 2015-05-06 | 三菱化学株式会社 | 白色发光装置及照明器具 |
WO2012144087A1 (ja) * | 2011-04-22 | 2012-10-26 | 株式会社東芝 | 白色光源およびそれを用いた白色光源システム |
US9109762B2 (en) | 2011-04-22 | 2015-08-18 | Kabushiki Kaisha Toshiba | White light source and white light source system including the same |
KR101786097B1 (ko) * | 2011-07-14 | 2017-10-17 | 엘지이노텍 주식회사 | 광학 부재, 이를 포함하는 표시장치 및 이의 제조방법 |
JP2013046046A (ja) * | 2011-08-26 | 2013-03-04 | Mitsubishi Chemicals Corp | 発光装置 |
JP2013163731A (ja) * | 2012-02-09 | 2013-08-22 | Denki Kagaku Kogyo Kk | 蛍光体及び発光装置 |
JP2013163730A (ja) * | 2012-02-09 | 2013-08-22 | Denki Kagaku Kogyo Kk | 蛍光体及び発光装置 |
JP2013163728A (ja) * | 2012-02-09 | 2013-08-22 | Denki Kagaku Kogyo Kk | 蛍光体及び発光装置 |
JP2013163732A (ja) * | 2012-02-09 | 2013-08-22 | Denki Kagaku Kogyo Kk | 蛍光体及び発光装置 |
JP2013163729A (ja) * | 2012-02-09 | 2013-08-22 | Denki Kagaku Kogyo Kk | 蛍光体及び発光装置 |
WO2014103671A1 (ja) * | 2012-12-28 | 2014-07-03 | シャープ株式会社 | 発光装置 |
US9504207B2 (en) | 2012-12-28 | 2016-11-29 | Sharp Kabushiki Kaisha | Light emitting device |
JPWO2014103671A1 (ja) * | 2012-12-28 | 2017-01-12 | シャープ株式会社 | 発光装置 |
US9190582B2 (en) | 2013-04-03 | 2015-11-17 | Kabushiki Kaisha Toshiba | Light emitting device |
JP2020004986A (ja) * | 2014-03-14 | 2020-01-09 | 日亜化学工業株式会社 | 発光装置の製造方法 |
JP2018137321A (ja) * | 2017-02-21 | 2018-08-30 | シャープ株式会社 | 発光装置および画像表示装置 |
US10263162B2 (en) | 2017-02-21 | 2019-04-16 | Sharp Kabushiki Kaisha | Light emitting device and image displaying system |
Also Published As
Publication number | Publication date |
---|---|
CN101412910B (zh) | 2013-01-09 |
CN101412910A (zh) | 2009-04-22 |
US7808012B2 (en) | 2010-10-05 |
US20090014741A1 (en) | 2009-01-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2009019163A (ja) | 発光装置用蛍光体粒子集合体、発光装置、および液晶表示用バックライト装置 | |
US10008644B2 (en) | Light emitting device and fabricating method thereof | |
TWI420710B (zh) | White light and its use of white light-emitting diode lighting device | |
JP4769132B2 (ja) | 発光装置 | |
JP5367218B2 (ja) | 蛍光体の製造方法および発光装置の製造方法 | |
TWI615995B (zh) | 發光裝置 | |
US20070090381A1 (en) | Semiconductor light emitting device | |
JP5747023B2 (ja) | 白色発光ランプおよびそれを用いた白色led照明装置 | |
JP5121736B2 (ja) | 白色発光ランプとそれを用いた照明装置 | |
TWI394818B (zh) | 包含缺色補償發光材料的發光系統 | |
JP4832995B2 (ja) | 発光装置 | |
US20070052342A1 (en) | Light-emitting device | |
JP2008081631A (ja) | 発光装置 | |
JP2007059898A (ja) | 半導体発光装置 | |
JP2011151419A (ja) | 発光装置とその製造方法 | |
JP2005285800A (ja) | 発光装置 | |
JP2021502446A (ja) | 蛍光体組み合わせ体、変換素子、オプトエレクトロニクス装置 | |
JP4890152B2 (ja) | 発光装置 | |
WO2016199406A1 (ja) | 蛍光体およびその製造方法、ならびにledランプ | |
JP2011091414A (ja) | 発光装置 | |
JP2015224344A (ja) | 黄色発光蛍光体及びそれを用いた発光素子パッケージ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100702 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20100702 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20121206 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20121218 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20130416 |