KR101422856B1 - 접착성 캡슐화 조성물 필름 및 유기 전계발광 소자 - Google Patents
접착성 캡슐화 조성물 필름 및 유기 전계발광 소자 Download PDFInfo
- Publication number
- KR101422856B1 KR101422856B1 KR1020087018057A KR20087018057A KR101422856B1 KR 101422856 B1 KR101422856 B1 KR 101422856B1 KR 1020087018057 A KR1020087018057 A KR 1020087018057A KR 20087018057 A KR20087018057 A KR 20087018057A KR 101422856 B1 KR101422856 B1 KR 101422856B1
- Authority
- KR
- South Korea
- Prior art keywords
- adhesive
- film
- organic
- resin
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
- C09J123/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
- C09J123/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
- C09J123/22—Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefines
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
- C08L2666/06—Homopolymers or copolymers of unsaturated hydrocarbons; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
- Y10T428/31909—Next to second addition polymer from unsaturated monomers
- Y10T428/31913—Monoolefin polymer
- Y10T428/31917—Next to polyene polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Electroluminescent Light Sources (AREA)
- Sealing Material Composition (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2006-00015334 | 2006-01-24 | ||
| JP2006015334A JP2007197517A (ja) | 2006-01-24 | 2006-01-24 | 接着性封止組成物、封止フィルム及び有機el素子 |
| PCT/US2007/001724 WO2007087281A1 (en) | 2006-01-24 | 2007-01-23 | Adhesive encapsulating composition film and organic electroluminescence device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20080088606A KR20080088606A (ko) | 2008-10-02 |
| KR101422856B1 true KR101422856B1 (ko) | 2014-07-24 |
Family
ID=38309544
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020087018057A Expired - Fee Related KR101422856B1 (ko) | 2006-01-24 | 2007-01-23 | 접착성 캡슐화 조성물 필름 및 유기 전계발광 소자 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20090026934A1 (https=) |
| EP (1) | EP1976952A4 (https=) |
| JP (2) | JP2007197517A (https=) |
| KR (1) | KR101422856B1 (https=) |
| CN (1) | CN101370889B (https=) |
| WO (1) | WO2007087281A1 (https=) |
Families Citing this family (210)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010006039A (ja) * | 2007-09-05 | 2010-01-14 | Fujifilm Corp | ガスバリアフィルムおよびガスバリアフィルムを用いて表示素子を封止する方法。 |
| US20090163255A1 (en) * | 2007-12-21 | 2009-06-25 | Sony Ericsson Mobile Communications Ab | Hidden picture customization for cellular telephones |
| BRPI0821436A2 (pt) | 2007-12-28 | 2015-06-16 | 3M Innovative Properties Co | Filmes refletores de infravermelho para controle solar e outros usos |
| JP2011508062A (ja) * | 2007-12-28 | 2011-03-10 | スリーエム イノベイティブ プロパティズ カンパニー | 可撓性封入フィルムシステム |
| JP2009215489A (ja) * | 2008-03-12 | 2009-09-24 | Nitto Denko Corp | 縁止めテープおよびその利用 |
| JP5111201B2 (ja) | 2008-03-31 | 2013-01-09 | 株式会社ジャパンディスプレイイースト | 有機el表示装置 |
| JP5263849B2 (ja) * | 2008-04-09 | 2013-08-14 | エージェンシー フォー サイエンス,テクノロジー アンド リサーチ | 酸素及び/又は水分に敏感な電子デバイスをカプセル封じするための多層膜 |
| JP5270755B2 (ja) * | 2008-06-02 | 2013-08-21 | スリーエム イノベイティブ プロパティズ カンパニー | 接着剤封入組成物及びそれで作られた電子デバイス |
| WO2009148722A2 (en) * | 2008-06-02 | 2009-12-10 | 3M Innovative Properties Company | Adhesive encapsulating composition and electronic devices made therewith |
| KR20170005154A (ko) | 2008-06-30 | 2017-01-11 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 무기 또는 무기/유기 혼성 장벽 필름 제조 방법 |
| DE102008047964A1 (de) | 2008-09-18 | 2010-03-25 | Tesa Se | Verfahren zur Kapselung einer elektronischen Anordnung |
| JP2010072471A (ja) * | 2008-09-19 | 2010-04-02 | Three M Innovative Properties Co | 透明粘着シート、それを含む画像表示装置及び、その画像表示装置の作製方法 |
| JP2010080289A (ja) * | 2008-09-26 | 2010-04-08 | Dainippon Printing Co Ltd | 有機エレクトロルミネッセンスパネル、及びその製造方法 |
| JP5223564B2 (ja) * | 2008-09-26 | 2013-06-26 | 大日本印刷株式会社 | 両面発光型有機エレクトロルミネッセンスパネル、及びその製造方法 |
| DE102008060113A1 (de) | 2008-12-03 | 2010-07-29 | Tesa Se | Verfahren zur Kapselung einer elektronischen Anordnung |
| DE102008062130A1 (de) | 2008-12-16 | 2010-06-17 | Tesa Se | Verfahren zur Kapselung einer elektronischen Anordnung |
| TW201529709A (zh) * | 2009-01-23 | 2015-08-01 | Ajinomoto Kk | 樹脂組成物 |
| KR101086880B1 (ko) * | 2009-05-28 | 2011-11-24 | 네오뷰코오롱 주식회사 | 게터층을 갖는 유기전계발광표시장치 제조방법 |
| DE102009036968A1 (de) | 2009-08-12 | 2011-02-17 | Tesa Se | Verfahren zur Kapselung einer elektronischen Anordnung |
| DE102009036970A1 (de) | 2009-08-12 | 2011-02-17 | Tesa Se | Verfahren zur Kapselung einer elektronischen Anordnung |
| JP2011046107A (ja) * | 2009-08-27 | 2011-03-10 | Fujifilm Corp | 電子素子の製造方法および複合フィルム |
| JP5485624B2 (ja) * | 2009-09-14 | 2014-05-07 | 富士フイルム株式会社 | バリア性積層体およびこれを用いたガスバリアフィルム |
| JP5545301B2 (ja) * | 2009-10-28 | 2014-07-09 | コニカミノルタ株式会社 | 有機エレクトロルミネッセンスパネルの製造方法、有機エレクトロルミネッセンスパネル |
| WO2011062836A1 (en) | 2009-11-18 | 2011-05-26 | 3M Innovative Properties Company | Multi-layer optical films |
| KR101677077B1 (ko) | 2009-11-18 | 2016-11-17 | 아지노모토 가부시키가이샤 | 수지 조성물 |
| CN102859711A (zh) * | 2009-11-18 | 2013-01-02 | 3M创新有限公司 | 柔性组件及其制备和使用方法 |
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| WO2011062852A1 (en) | 2009-11-19 | 2011-05-26 | 3M Innovative Properties Company | Pressure sensitive adhesive comprising functionalized polyisobutylene hydrogen bonded to acylic polymer |
| JP5530715B2 (ja) * | 2009-12-16 | 2014-06-25 | リンテック株式会社 | 防水用両面粘着テープ |
| TWI410699B (zh) * | 2010-02-11 | 2013-10-01 | Univ Nat Chiao Tung | 含有一揮發性液體之裝置之供液體容置單元及其製法 |
| JP5701127B2 (ja) * | 2010-04-05 | 2015-04-15 | リンテック株式会社 | 粘着性組成物および該組成物から得られる粘着性シート |
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| WO2012024070A2 (en) | 2010-08-18 | 2012-02-23 | Henkel Corporation | Radiation curable temporary laminating adhesive for use in high temperature applications |
| EP2615144B1 (en) * | 2010-09-07 | 2018-10-17 | Lintec Corporation | Adhesive sheet and electronic device |
| JP5593175B2 (ja) * | 2010-09-09 | 2014-09-17 | リンテック株式会社 | 封止用粘着シート、電子デバイス、及び有機デバイス |
| DE102010043871A1 (de) | 2010-11-12 | 2012-05-16 | Tesa Se | Klebmasse und Verfahren zur Kapselung einer elektronischen Anordnung |
| DE102010043866A1 (de) | 2010-11-12 | 2012-05-16 | Tesa Se | Klebmasse und Verfahren zur Kapselung einer elektronischen Anordnung |
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| US8629209B2 (en) | 2010-12-02 | 2014-01-14 | 3M Innovative Properties Company | Moisture curable isobutylene adhesive copolymers |
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| JP5772085B2 (ja) * | 2011-03-09 | 2015-09-02 | セイコーエプソン株式会社 | 発光素子、発光装置、表示装置および電子機器 |
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| TWI552883B (zh) * | 2011-07-25 | 2016-10-11 | Lintec Corp | Gas barrier film laminates and electronic components |
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| KR101911581B1 (ko) | 2011-08-04 | 2018-10-24 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 에지 보호된 배리어 조립체 |
| DE102011080729A1 (de) | 2011-08-10 | 2013-02-14 | Tesa Se | Elektrisch leitfähige Haftklebemasse und Haftklebeband |
| DE102011080724A1 (de) | 2011-08-10 | 2013-02-14 | Tesa Se | Elektrisch leitfähige hitzeaktivierbare Klebemasse |
| KR101706438B1 (ko) * | 2011-08-26 | 2017-02-13 | 미쓰비시 가가꾸 가부시키가이샤 | 접착성 밀봉 필름, 접착성 밀봉 필름의 제조 방법 및 접착성 밀봉 필름용 도포액 |
| DE102011085038A1 (de) | 2011-10-21 | 2013-04-25 | Tesa Se | Verfahren zur Kapselung einer elektronischen Anordnung |
| DE102011085034A1 (de) | 2011-10-21 | 2013-04-25 | Tesa Se | Klebemasse insbesondere zur Kapselung einer elektronischen Anordnung |
| DE102012202377A1 (de) | 2011-10-21 | 2013-04-25 | Tesa Se | Klebemasse insbesondere zur Kapselung einer elektronischen Anordnung |
| KR101428868B1 (ko) * | 2011-11-14 | 2014-08-12 | 주식회사 엘지화학 | 접착 필름 |
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| DE102011089566A1 (de) | 2011-12-22 | 2013-06-27 | Tesa Se | Liner zum Schutz von Klebemassen |
| DE102011089565A1 (de) | 2011-12-22 | 2013-06-27 | Tesa Se | Liner zum Schutz von Klebemassen |
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| WO2013103282A1 (ko) * | 2012-01-06 | 2013-07-11 | 주식회사 엘지화학 | 봉지용 필름 |
| EP2805997B1 (en) | 2012-01-16 | 2023-03-08 | Ajinomoto Co., Inc. | Resin composition for sealing |
| JP5867154B2 (ja) * | 2012-02-23 | 2016-02-24 | 日本ゼオン株式会社 | 照明装置 |
| DE102012203623A1 (de) | 2012-03-07 | 2013-09-12 | Tesa Se | Verbundsystem zur Verkapselung elektronischer Anordnungen |
| JP6046113B2 (ja) * | 2012-03-15 | 2016-12-14 | リンテック株式会社 | 粘着性組成物、及び粘着性シート |
| WO2013147989A1 (en) | 2012-03-29 | 2013-10-03 | 3M Innovative Properties Company | Adhesives comprising poly(isobutylene) copolymers comprising pendent free-radically polymerizable quaternary ammonium substituent |
| EP2847267A1 (en) | 2012-05-11 | 2015-03-18 | 3M Innovative Properties Company | Adhesives comprising reaction product of halogenated poly(isobutylene) copolymers and polyamines |
| DE102012211335A1 (de) | 2012-06-29 | 2014-01-02 | Tesa Se | Klebeband für die Kapselung einer organischen elektronischen Anordnung |
| US20140015764A1 (en) * | 2012-07-13 | 2014-01-16 | Nokia Corporation | Display |
| WO2014021687A1 (ko) * | 2012-08-02 | 2014-02-06 | 주식회사 엘지화학 | 접착 필름 및 이를 이용한 유기전자장치의 봉지 방법 |
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- 2007-01-23 EP EP07716918A patent/EP1976952A4/en not_active Withdrawn
- 2007-01-23 CN CN2007800029900A patent/CN101370889B/zh not_active Expired - Fee Related
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Also Published As
| Publication number | Publication date |
|---|---|
| EP1976952A1 (en) | 2008-10-08 |
| CN101370889A (zh) | 2009-02-18 |
| JP2009524705A (ja) | 2009-07-02 |
| JP5074423B2 (ja) | 2012-11-14 |
| WO2007087281A1 (en) | 2007-08-02 |
| JP2007197517A (ja) | 2007-08-09 |
| CN101370889B (zh) | 2012-02-29 |
| EP1976952A4 (en) | 2010-01-13 |
| KR20080088606A (ko) | 2008-10-02 |
| US20090026934A1 (en) | 2009-01-29 |
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