JP7470047B2 - 組成物 - Google Patents
組成物 Download PDFInfo
- Publication number
- JP7470047B2 JP7470047B2 JP2020556182A JP2020556182A JP7470047B2 JP 7470047 B2 JP7470047 B2 JP 7470047B2 JP 2020556182 A JP2020556182 A JP 2020556182A JP 2020556182 A JP2020556182 A JP 2020556182A JP 7470047 B2 JP7470047 B2 JP 7470047B2
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- Prior art keywords
- meth
- acrylate
- temporary fixing
- mass
- component
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims description 86
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 127
- 238000000034 method Methods 0.000 claims description 75
- 229920001519 homopolymer Polymers 0.000 claims description 50
- 239000000853 adhesive Substances 0.000 claims description 48
- 230000001070 adhesive effect Effects 0.000 claims description 48
- 239000000758 substrate Substances 0.000 claims description 41
- -1 oxime ester compound Chemical class 0.000 claims description 36
- 238000004519 manufacturing process Methods 0.000 claims description 24
- 125000000217 alkyl group Chemical group 0.000 claims description 19
- 150000001875 compounds Chemical class 0.000 claims description 18
- 229920002367 Polyisobutene Polymers 0.000 claims description 15
- 239000003505 polymerization initiator Substances 0.000 claims description 12
- 238000009826 distribution Methods 0.000 claims description 11
- 125000004432 carbon atom Chemical group C* 0.000 claims description 9
- 125000002723 alicyclic group Chemical group 0.000 claims description 6
- SEEVRZDUPHZSOX-WPWMEQJKSA-N [(e)-1-[9-ethyl-6-(2-methylbenzoyl)carbazol-3-yl]ethylideneamino] acetate Chemical compound C=1C=C2N(CC)C3=CC=C(C(\C)=N\OC(C)=O)C=C3C2=CC=1C(=O)C1=CC=CC=C1C SEEVRZDUPHZSOX-WPWMEQJKSA-N 0.000 claims description 5
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 claims description 5
- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical compound C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 description 88
- 239000011342 resin composition Substances 0.000 description 26
- 239000011521 glass Substances 0.000 description 19
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 18
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 18
- 239000010703 silicon Substances 0.000 description 18
- 229910052710 silicon Inorganic materials 0.000 description 18
- 239000010410 layer Substances 0.000 description 16
- 238000004528 spin coating Methods 0.000 description 14
- 238000010438 heat treatment Methods 0.000 description 13
- 239000007788 liquid Substances 0.000 description 13
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 12
- 238000000227 grinding Methods 0.000 description 12
- 230000003287 optical effect Effects 0.000 description 12
- 239000000047 product Substances 0.000 description 11
- 230000015572 biosynthetic process Effects 0.000 description 10
- 230000009477 glass transition Effects 0.000 description 10
- 238000012360 testing method Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- 239000000523 sample Substances 0.000 description 9
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 8
- 238000010943 off-gassing Methods 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 238000001723 curing Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 7
- 238000011156 evaluation Methods 0.000 description 7
- 238000012545 processing Methods 0.000 description 7
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 6
- 230000001678 irradiating effect Effects 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 238000003776 cleavage reaction Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 230000007017 scission Effects 0.000 description 5
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 4
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 4
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical compound CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 4
- 229920005988 Oppanol® N Polymers 0.000 description 4
- 239000004793 Polystyrene Substances 0.000 description 4
- 238000002835 absorbance Methods 0.000 description 4
- 239000003963 antioxidant agent Substances 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
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- 238000005191 phase separation Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- PUBNJSZGANKUGX-UHFFFAOYSA-N 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=C(C)C=C1 PUBNJSZGANKUGX-UHFFFAOYSA-N 0.000 description 3
- QRLSTWVLSWCGBT-UHFFFAOYSA-N 4-((4,6-bis(octylthio)-1,3,5-triazin-2-yl)amino)-2,6-di-tert-butylphenol Chemical group CCCCCCCCSC1=NC(SCCCCCCCC)=NC(NC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=N1 QRLSTWVLSWCGBT-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 3
- 230000003078 antioxidant effect Effects 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 3
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 239000001294 propane Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 3
- HJVCHYDYCYBBQX-HLTLHRPFSA-N (2s,3s,4e,6e,8s,9s)-3-amino-9-methoxy-2,6,8-trimethyl-10-phenyldeca-4,6-dienoic acid Chemical compound OC(=O)[C@@H](C)[C@@H](N)/C=C/C(/C)=C/[C@H](C)[C@@H](OC)CC1=CC=CC=C1 HJVCHYDYCYBBQX-HLTLHRPFSA-N 0.000 description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- HZRPIZSSEMKEEW-UHFFFAOYSA-N C1CO1.O=C1NC(=O)NC(=O)N1 Chemical compound C1CO1.O=C1NC(=O)NC(=O)N1 HZRPIZSSEMKEEW-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 241000705989 Tetrax Species 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 235000019437 butane-1,3-diol Nutrition 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000000921 elemental analysis Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- NWVVVBRKAWDGAB-UHFFFAOYSA-N hydroquinone methyl ether Natural products COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- PBLZLIFKVPJDCO-UHFFFAOYSA-N omega-Aminododecanoic acid Natural products NCCCCCCCCCCCC(O)=O PBLZLIFKVPJDCO-UHFFFAOYSA-N 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 230000036632 reaction speed Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- CNHDIAIOKMXOLK-UHFFFAOYSA-N toluquinol Chemical compound CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 description 2
- YGGARCQQBAOLGB-UHFFFAOYSA-N (3-prop-2-enoyloxy-1-adamantyl) prop-2-enoate Chemical compound C1C(C2)CC3CC1(OC(=O)C=C)CC2(OC(=O)C=C)C3 YGGARCQQBAOLGB-UHFFFAOYSA-N 0.000 description 1
- 229940058015 1,3-butylene glycol Drugs 0.000 description 1
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 1
- LYDOQHFHYWDZBS-UHFFFAOYSA-N 1-phenoxyethane-1,2-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OCC(O)OC1=CC=CC=C1 LYDOQHFHYWDZBS-UHFFFAOYSA-N 0.000 description 1
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 1
- STFXXRRQKFUYEU-UHFFFAOYSA-N 16-methylheptadecyl prop-2-enoate Chemical compound CC(C)CCCCCCCCCCCCCCCOC(=O)C=C STFXXRRQKFUYEU-UHFFFAOYSA-N 0.000 description 1
- ZZYASVWWDLJXIM-UHFFFAOYSA-N 2,5-di-tert-Butyl-1,4-benzoquinone Chemical compound CC(C)(C)C1=CC(=O)C(C(C)(C)C)=CC1=O ZZYASVWWDLJXIM-UHFFFAOYSA-N 0.000 description 1
- JZODKRWQWUWGCD-UHFFFAOYSA-N 2,5-di-tert-butylbenzene-1,4-diol Chemical compound CC(C)(C)C1=CC(O)=C(C(C)(C)C)C=C1O JZODKRWQWUWGCD-UHFFFAOYSA-N 0.000 description 1
- QYXHDJJYVDLECA-UHFFFAOYSA-N 2,5-diphenylcyclohexa-2,5-diene-1,4-dione Chemical compound O=C1C=C(C=2C=CC=CC=2)C(=O)C=C1C1=CC=CC=C1 QYXHDJJYVDLECA-UHFFFAOYSA-N 0.000 description 1
- WMYINDVYGQKYMI-UHFFFAOYSA-N 2-[2,2-bis(hydroxymethyl)butoxymethyl]-2-ethylpropane-1,3-diol Chemical compound CCC(CO)(CO)COCC(CC)(CO)CO WMYINDVYGQKYMI-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- BJXNOEBKXNJEMC-UHFFFAOYSA-N 2-decyltetradecyl prop-2-enoate Chemical compound CCCCCCCCCCCCC(COC(=O)C=C)CCCCCCCCCC BJXNOEBKXNJEMC-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- IKEHOXWJQXIQAG-UHFFFAOYSA-N 2-tert-butyl-4-methylphenol Chemical compound CC1=CC=C(O)C(C(C)(C)C)=C1 IKEHOXWJQXIQAG-UHFFFAOYSA-N 0.000 description 1
- ITSPWKSGGFJBQP-UHFFFAOYSA-N 2-tetradecyloctadecyl prop-2-enoate Chemical compound CCCCCCCCCCCCCCCCC(COC(=O)C=C)CCCCCCCCCCCCCC ITSPWKSGGFJBQP-UHFFFAOYSA-N 0.000 description 1
- BJEMXPVDXFSROA-UHFFFAOYSA-N 3-butylbenzene-1,2-diol Chemical group CCCCC1=CC=CC(O)=C1O BJEMXPVDXFSROA-UHFFFAOYSA-N 0.000 description 1
- MRBKEAMVRSLQPH-UHFFFAOYSA-N 3-tert-butyl-4-hydroxyanisole Chemical group COC1=CC=C(O)C(C(C)(C)C)=C1 MRBKEAMVRSLQPH-UHFFFAOYSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical group CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- 229910005540 GaP Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229920002431 Oppanol® B 15 SFN Polymers 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- BGNXCDMCOKJUMV-UHFFFAOYSA-N Tert-Butylhydroquinone Chemical compound CC(C)(C)C1=CC(O)=CC=C1O BGNXCDMCOKJUMV-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 229910009372 YVO4 Inorganic materials 0.000 description 1
- RABVYVVNRHVXPJ-UHFFFAOYSA-N [3-(hydroxymethyl)-1-adamantyl]methanol Chemical compound C1C(C2)CC3CC1(CO)CC2(CO)C3 RABVYVVNRHVXPJ-UHFFFAOYSA-N 0.000 description 1
- VEBCLRKUSAGCDF-UHFFFAOYSA-N ac1mi23b Chemical compound C1C2C3C(COC(=O)C=C)CCC3C1C(COC(=O)C=C)C2 VEBCLRKUSAGCDF-UHFFFAOYSA-N 0.000 description 1
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- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 125000002511 behenyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 229910001634 calcium fluoride Inorganic materials 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 239000000805 composite resin Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
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- 229920001577 copolymer Polymers 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 125000006165 cyclic alkyl group Chemical group 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- FOTKYAAJKYLFFN-UHFFFAOYSA-N decane-1,10-diol Chemical compound OCCCCCCCCCCO FOTKYAAJKYLFFN-UHFFFAOYSA-N 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 238000004455 differential thermal analysis Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000008240 homogeneous mixture Substances 0.000 description 1
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Images
Classifications
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- C—CHEMISTRY; METALLURGY
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C—CHEMISTRY; METALLURGY
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- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
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- C09J151/003—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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Description
<1>下記(A)~(C)を含有する仮固定組成物。
(A)下記(A-1)と(A-2)を含有する(メタ)アクリレート
(A-1)ホモポリマーのTgが-100℃~60℃である単官能(メタ)アクリレート
(A-2)多官能(メタ)アクリレート
(B)ポリイソブテン単独重合体
(C)光ラジカル重合開始剤
(A)下記(A-1)と(A-2)を含有する(メタ)アクリレート
(A-1)ホモポリマーのTgが-100℃~60℃である単官能(メタ)アクリレート
(A-2)多官能(メタ)アクリレート
(B)ポリイソブテン単独重合体
(C)光ラジカル重合開始剤
(メタ)アクリレートのホモポリマーのガラス転移温度は、J.Brandrup,E.H.Immergut,Polymer Handbook,2nd Ed.,J.Wiley,New York 1975、光硬化技術データブック(テクノネットブックス社)等に記載されている。
設定温度:40℃
カラム構成:東ソー社製「TSK guardcolumn MP(×L)」6.0mmID×4.0cm1本、及び東ソー社製「TSK-GELMULTIPOREHXL-M」7.8mmID×30.0cm(理論段数16,000段)2本、計3本(全体として理論段数32,000段)
サンプル注入量:100μl(試料液濃度1mg/ml)
送液圧力:39kg/cm2
検出器:RI検出器
本発明の薄型ウエハの製造方法は、半導体回路等を有するウエハと支持体との接着剤層として、仮固定接着剤(以下、接着剤ということもある。)を用いることを特徴とする。本発明の薄型ウエハの製造方法は下記(a)~(e)の工程を有する。
工程(a)は、表面に回路形成面を有し、裏面に回路非形成面を有するウエハの前記回路形成面を、接着剤を介して、支持体に接合する際に、前記支持体又は回路付きウエハ上にスピンコート法で接着剤を塗布し、もう一方の支持体又は回路付きウエハと真空下で貼り合わせる工程である。
工程(b)は、接着剤を光硬化させる工程である。前記ウエハ加工体(積層体基板)が形成された後、可視光線若しくは紫外線(波長365nm~405nm)領域においてエネルギー量が1~20000mJ/cm2になるように照射することが好ましい。エネルギー量が1mJ/cm2以上だと十分な接着性が得られ、20000mJ/cm2以下だと生産性が優れ、光ラジカル重合開始剤からの分解生成物が発生しにくく、アウトガスの発生も抑制される。生産性、接着性、低アウトガス性、易剥離性の点で、1000~10000mJ/cm2がより好ましい。
工程(c)は、支持体と接合したウエハの回路非形成面を研削又は研磨する工程、即ち、工程(a)にて貼り合わせて得られたウエハ加工体のウエハ裏面側を研削して、該ウエハの厚みを薄くする工程である。薄型化されたウエハの厚さは、10~300μmが好ましく、30~100μmがより好ましい。ウエハ裏面の研削加工の方式には特に制限はなく、公知の研削方式が採用される。研削は、ウエハと砥石(ダイヤモンド等)に水をかけて、冷却しながら行うことが好ましい。
工程(d)は、回路非形成面を研削したウエハ加工体、即ち、裏面研削によって薄型化されたウエハ加工体の回路非形成面に加工を施す工程である。この工程にはウエハレベルで用いられる様々なプロセスが含まれる。例えば、電極形成、金属配線形成、保護膜形成等が挙げられる。より具体的には、電極等の形成のための金属スパッタリング、金属スパッタリング層をエッチングするためのウェットエッチング、金属配線形成のマスクとするためのレジストの塗布、露光、及び現像によるパターンの形成、レジストの剥離、ドライエッチング、金属めっきの形成、TSV形成のためのシリコンエッチング、シリコン表面の酸化膜形成等、従来公知のプロセスが挙げられる。
工程(e)は剥離工程である。本工程は工程(d)で加工を施したウエハをウエハ加工体から剥離する工程である。例えば、薄型化したウエハに様々な加工を施した後、ダイシングする前にウエハ加工体からウエハを剥離する工程である。この際、あらかじめ薄化、加工した面にダイシングテープを貼り付けておくことが出来る。この剥離工程は、一般に室温から60℃程度までの比較的低温の条件で実施される。この剥離工程としては、公知のメカニカル剥離工程、UV又はIRレーザー剥離工程のいずれも採用することが出来る。メカニカル剥離工程とは、例えば、ブレードをウエハ加工体の界面端部に挿入してウエハ・支持体間に開裂を発生させるためにウエハ加工体のウエハを下側にして水平に固定しておき、ブレード挿入後に上方の支持体に上向きの応力を印加して前記開裂を進展させてウエハ・支持体を剥離させる工程を含む剥離工程である。このような剥離工程は、例えば、特許第6377956号公報や特開2016-106404号公報に記載されている。IRレーザー剥離工程とは、例えば、ウエハ加工体の光学的に透明な支持体側の端部から接線方向に直線状に往復しながら走査するように、IRレーザーを全面に照射してレーザーのエネルギーにより接着剤層を加熱・分解させて剥離する工程である。このような剥離工程は例えば特許第4565804号公報に記載されている。このIRレーザー剥離工程を実施するために、仮固定剤層とガラス支持体の間にIRレーザー光を吸収して熱に変換する光熱変換層(例えば3M社のLTHC)を設けてもよい。3M社のLTHCを用いる場合、例えば、LTHCをガラス支持体上にスピンコートして硬化し、仮固定剤層はウエハ上にスピンコートしてからLTHC層が形成された前記ガラス支持体と貼り合わせてUV硬化することが出来る。3M社のLTHCを用いてIRレーザー剥離工程を実施する方法は、例えば上記と同じ特許第4565804号公報に記載されている。UVレーザー剥離工程とは、ウエハ加工体の光学的に透明な支持体側からIRレーザーと同様の方法で照射して接着剤層を分解させて剥離する工程である。このような剥離工程は、例えば、特表2019-501790号公報や国際公開第2014/058601号に記載されている。
(f)加工を施したウエハのウエハ面にダイシングテープを接着する工程と、
(g)ダイシングテープ面を吸着面に真空吸着する工程と、
(h)吸着面の温度が10~100℃の温度範囲で、前記支持体を、加工を施した前記ウエハから剥離する工程と、を含むことが好ましい。このようにすると、支持体を、加工を施したウエハから容易に剥離することが出来、後のダイシング工程を容易に行うことが出来る。
(i)加工を施したウエハを光学的に透明な支持体側を上にして、水平な場所に、好ましくはダイシングテープを介して設置/固定する工程と、
(j)加工を施した前記ウエハの支持体側からレーザーを走査するように全面に照射する工程、
を含むことが好ましい。このようにすると、支持体を、加工を施したウエハから容易に剥離することが出来、後のダイシング工程を容易に行うことが出来る。
特記しない限り、23℃、湿度50%で実験した。表1~5に示す組成の硬化性樹脂組成物(以下、液状樹脂組成物ということもある)を調製し、評価した。実験例に記載の硬化性樹脂組成物中の各成分としては、以下の化合物を選択した。
(A-1) ホモポリマーのTgが-100℃~60℃である単官能(メタ)アクリレートとして、以下の化合物を選択した。
イソステアリルアクリレート(大阪有機化学工業社製「ISTA」、ホモポリマーのガラス転移温度:-18℃、分子量325)
2-デシル-1-テトラデカニルアクリレート(共栄社化学社製「ライトアクリレートDTD-A(DTD-A)」、ホモポリマーのガラス転移温度:-36℃、分子量409)
2-テトラデシル-1-オクタデカニルアクリレート(共栄社化学社製「ライトアクリレートDOD-A(DOD-A)」、ホモポリマーのガラス転移温度:-8℃、分子量521)
トリシクロデカンジメタノールジアクリレート(新中村化学工業社製「NKエステルA-DCP(A-DCP)」、分子量304)
トリシクロデカンジメタノールジメタクリレート(新中村化学工業社製「NKエステルDCP(DCP)」、分子量332)
1,3-ジアクリロイルオキシアダマンタン(三菱ガス化学社製「ダイヤピュレストADDA(ADDA)」、分子量276)
トリメチロールプロパントリメタクリレート(新中村化学工業社製「NKエステルTMPT(TMPT)」、分子量338)
Oppanol N 150EP(BASF社製、PS(ポリスチレン)換算重量平均分子量(Mw):3,050,000、分子量分布2.9)
Oppanol N 100(BASF社製、PS換算重量平均分子量(Mw):1,550,000、分子量分布2.9)
Oppanol N 80(BASF社製、PS換算重量平均分子量(Mw):1,050,000、分子量分布2.4)
Oppanol N 50SF(BASF社製、PS換算重量平均分子量(Mw):565,000、分子量分布2.4)
Oppanol B 15SFN(BASF社製、PS換算重量平均分子量(Mw):108,000、分子量分布3.2)
Tetrax 6T(JXTGエネルギー社製、PS換算重量平均分子量(Mw):80,000、分子量分布2.2)
Tetrax 3T(JXTGエネルギー社製、PS換算重量平均分子量(Mw):49,000、分子量分布2.2)
2-ベンジル-2-ジメチルアミノ-1-(4-モルホリノフェニル)ブタノン-1(BASF社製「Irgacure 369E」)
2-ジメチルアミノ-2-(4-メチル-ベンジル)-1-(4-モリフォリン-4-イル-フェニル)-ブタン-1-オン(BASF社製「Irgacure 379EG」)
ビス(2,4,6-トリメチルベンゾイル)フェニルフォスフィンオキサイド(BASF社製「Irgacure 819」)
2,4,6-トリメチルベンゾイルジフェニルフォスフィンオキサイド(BASF社製「Irgacure TPO」)
1-[9-エチル-6-(2-メチルベンゾイル)-9H-カルバゾール-3-イル]エタノン 1-(O-アセチルオキシム)(BASF社製「Irgacure OXE02」)
2,2-ジメトキシ-1,2-ジフェニルエタン-1-オン(BASF社製「Irgacure 651」)
アセトフェノン(東京化成工業社製)
4-((4,6-ビス(オクチルチオ)-1,3,5-トリアジン-2-イル)アミノ)-2,6-ジ-t-ブチルフェノール(BASF社製「IRGANOX 565」)
液状樹脂組成物の材料の相溶性(表の「材料の相溶性」、「吸光度」):80℃での加温混合により材料を均一な混合物とした後、23℃まで冷やして均一状態が維持されるかを確認した。日本分光社製の紫外可視分光光度計V-650を用い、光路長方向の幅10mmのセルに入れたサンプルの、波長660nmでの吸光度(OD660)を測定した。吸光度が0.1未満の場合は相溶で可、0.1以上の場合、及び目視で相分離等の不均一化が確認された場合は非相溶で不可とした。吸光度は、相溶性の点で、0.1未満が好ましい。
本発明の組成物は、種々の電子部品、光学部品や光学デバイスの製造において、紫外線又は可視光線を照射するだけで容易に強い接着性を発現するために、作業性、生産性に優れる。本発明の組成物の硬化体は、更に250℃という高温でもアウトガスの量が極めて少ない。本発明の組成物は、加工後に剥離するのが容易である。そのため、本発明の組成物を用いて接着した種々の電子部品、光学部品、光学デバイスは、200℃を超えるような高温での蒸着処理や、高温での焼付塗装が施される場合でも、適用可能である。
Claims (19)
- 下記(A)~(C)を含有し、
(A)下記(A-1)と(A-2)を含有する(メタ)アクリレート
(A-1)ホモポリマーのTgが-100℃~60℃であり、アルキル基を有する単官能(メタ)アクリレート
(A-2)多官能(メタ)アクリレート
(B)ポリイソブテン単独重合体
(C)光ラジカル重合開始剤
(A)~(B)成分の合計100質量部中、(A-1)成分54~90質量部、(A-2)成分1~40質量部、(B)成分1~20質量部を含有する
ことを特徴とする、仮固定組成物。 - (A-1)成分が、炭素数12以上のアルキル基を有する単官能(メタ)アクリレートである請求項1に記載の仮固定組成物。
- (A-2)多官能(メタ)アクリレートの分子量が900以下である請求項1又は2に記載の仮固定組成物。
- (A-2)成分が、脂環式骨格を有する多官能(メタ)アクリレートである請求項1~3のいずれか1項に記載の仮固定組成物。
- (A-2)成分が、トリシクロデカンジメタノールジ(メタ)アクリレート、及び1,3-ジ(メタ)アクリロイルオキシアダマンタンから選択される1種以上である、請求項1~4のいずれか1項に記載の仮固定組成物。
- (B)成分が、重量平均分子量が1,000以上5,000,000以下であり、且つ、分子量分布が1.1以上5.0以下であるポリイソブテン単独重合体である、請求項1~5のいずれか1項に記載の仮固定組成物。
- (C)成分が、アシルフォスフィンオキサイド系化合物、及びオキシムエステル系化合物から選択される1種以上である光ラジカル重合開始剤である、請求項1~6のいずれか1項に記載の仮固定組成物。
- (C)成分が、ビス(2,4,6-トリメチルベンゾイル)フェニルフォスフィンオキサイド、及び1-[9-エチル-6-(2-メチルベンゾイル)-9H-カルバゾール-3-イル]エタノン 1-(O-アセチルオキシム)から選択される1種以上である請求項1~7のいずれか1項に記載の仮固定組成物。
- (A)~(B)成分の合計100質量部に対して(C)成分0.01~5質量部を含有する請求項1~8のいずれか1項に記載の仮固定組成物。
- (A)~(B)成分の合計100質量部中、(A-1)成分54~90質量部、(A-2)成分6.8~40質量部、(B)成分1~20質量部を含有する請求項1~9のいずれか1項に記載の仮固定組成物。
- 請求項1~10のいずれか1項に記載の仮固定組成物からなる仮固定接着剤。
- 請求項1~10のいずれか1項に記載の仮固定組成物を硬化して得られる硬化体。
- 請求項12に記載の硬化体からなる粘着シート。
- 加熱質量減少率が1質量%となる温度が250℃以上である請求項12に記載の硬化体。
- 請求項1~10のいずれか1項に記載の仮固定組成物からなる電子デバイス製造用仮固定接着剤。
- 請求項15に記載の電子デバイス製造用仮固定接着剤を使用して基材を接着した接着体。
- 請求項15に記載の電子デバイス製造用仮固定接着剤を用いた薄型ウエハの製造方法。
- メカニカル剥離用の請求項15に記載の電子デバイス製造用仮固定接着剤。
- UVレーザー剥離用の請求項15に記載の電子デバイス製造用仮固定接着剤。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2018213530 | 2018-11-14 | ||
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WO2023135855A1 (ja) * | 2022-01-12 | 2023-07-20 | 積水フーラー株式会社 | 薄層ガラス仮固定用組成物 |
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EP3882323A4 (en) | 2022-01-05 |
CN113056533B (zh) | 2022-10-11 |
JPWO2020101000A1 (ja) | 2021-09-27 |
KR102577202B1 (ko) | 2023-09-11 |
WO2020101000A1 (ja) | 2020-05-22 |
TW202035603A (zh) | 2020-10-01 |
TWI826589B (zh) | 2023-12-21 |
KR20210091172A (ko) | 2021-07-21 |
CN113056533A (zh) | 2021-06-29 |
EP3882323A1 (en) | 2021-09-22 |
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