DE112011102705A5 - Verfahren zur Kapselung einer elektronischen Anordnung - Google Patents
Verfahren zur Kapselung einer elektronischen Anordnung Download PDFInfo
- Publication number
- DE112011102705A5 DE112011102705A5 DE112011102705T DE112011102705T DE112011102705A5 DE 112011102705 A5 DE112011102705 A5 DE 112011102705A5 DE 112011102705 T DE112011102705 T DE 112011102705T DE 112011102705 T DE112011102705 T DE 112011102705T DE 112011102705 A5 DE112011102705 A5 DE 112011102705A5
- Authority
- DE
- Germany
- Prior art keywords
- encapsulating
- electronic device
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M17/00—Producing multi-layer textile fabrics
- D06M17/04—Producing multi-layer textile fabrics by applying synthetic resins as adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2265—Oxides; Hydroxides of metals of iron
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Textile Engineering (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102010039320.7 | 2010-08-13 | ||
DE102010039320 | 2010-08-13 | ||
PCT/EP2011/062881 WO2012019909A1 (de) | 2010-08-13 | 2011-07-27 | Verfahren zur kapselung einer elektronischen anordnung |
Publications (1)
Publication Number | Publication Date |
---|---|
DE112011102705A5 true DE112011102705A5 (de) | 2013-05-29 |
Family
ID=44773031
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE112011102705T Withdrawn DE112011102705A5 (de) | 2010-08-13 | 2011-07-27 | Verfahren zur Kapselung einer elektronischen Anordnung |
Country Status (5)
Country | Link |
---|---|
KR (1) | KR101871317B1 (de) |
CN (1) | CN103270618B (de) |
DE (1) | DE112011102705A5 (de) |
TW (1) | TW201222684A (de) |
WO (1) | WO2012019909A1 (de) |
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US11131431B2 (en) | 2014-09-28 | 2021-09-28 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED tube lamp |
US8823165B2 (en) | 2011-07-12 | 2014-09-02 | Invensas Corporation | Memory module in a package |
DE102011079685A1 (de) * | 2011-07-22 | 2013-01-24 | Tesa Se | Verfahren zum Herstellen einer Klebverbindung mit einem hitzeaktivierbaren Kleber mittels Induktionserwärmung |
EP2769409A1 (de) | 2011-10-03 | 2014-08-27 | Invensas Corporation | Ansatz zur minimierung von multichip-drahtverbindungen mit orthogonalen fenstern |
US8513813B2 (en) | 2011-10-03 | 2013-08-20 | Invensas Corporation | Stub minimization using duplicate sets of terminals for wirebond assemblies without windows |
US8659140B2 (en) | 2011-10-03 | 2014-02-25 | Invensas Corporation | Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate |
US8659143B2 (en) | 2011-10-03 | 2014-02-25 | Invensas Corporation | Stub minimization for wirebond assemblies without windows |
JP5887415B2 (ja) | 2011-10-03 | 2016-03-16 | インヴェンサス・コーポレイション | 平行な窓を有するマルチダイのワイヤボンドアセンブリのスタブ最小化 |
US8629545B2 (en) | 2011-10-03 | 2014-01-14 | Invensas Corporation | Stub minimization for assemblies without wirebonds to package substrate |
WO2014021698A1 (ko) * | 2012-08-03 | 2014-02-06 | 주식회사 엘지화학 | 접착 필름 및 이를 이용한 유기전자장치의 봉지 방법 |
DE102012214401A1 (de) | 2012-08-13 | 2014-02-13 | Tesa Se | Verfahren zur Herstellung eines Solarmoduls |
US9368477B2 (en) | 2012-08-27 | 2016-06-14 | Invensas Corporation | Co-support circuit panel and microelectronic packages |
TWI541651B (zh) * | 2012-08-27 | 2016-07-11 | 英帆薩斯公司 | 共支撐系統和微電子組件 |
US9070423B2 (en) | 2013-06-11 | 2015-06-30 | Invensas Corporation | Single package dual channel memory with co-support |
US9281296B2 (en) | 2014-07-31 | 2016-03-08 | Invensas Corporation | Die stacking techniques in BGA memory package for small footprint CPU and memory motherboard design |
US9691437B2 (en) | 2014-09-25 | 2017-06-27 | Invensas Corporation | Compact microelectronic assembly having reduced spacing between controller and memory packages |
CN205961494U (zh) | 2014-09-28 | 2017-02-15 | 嘉兴山蒲照明电器有限公司 | Led直管灯 |
US10560989B2 (en) | 2014-09-28 | 2020-02-11 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED tube lamp |
CN205716539U (zh) * | 2014-09-28 | 2016-11-23 | 嘉兴山蒲照明电器有限公司 | Led直管灯 |
US10514134B2 (en) | 2014-12-05 | 2019-12-24 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED tube lamp |
DE102015202415B4 (de) * | 2015-02-11 | 2021-02-11 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Klebstoff, Bauteil, Verfahren zur berührungslosen Temperaturmessung des Klebstoffs, Verfahren zur verbesserten Verbindung zweier Bauteile mit dem Klebstoff und Verwendung des Klebstoffs |
US9897265B2 (en) | 2015-03-10 | 2018-02-20 | Jiaxing Super Lighting Electric Appliance Co., Ltd. | LED tube lamp having LED light strip |
US10161569B2 (en) | 2015-09-02 | 2018-12-25 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED tube lamp |
US9484080B1 (en) | 2015-11-09 | 2016-11-01 | Invensas Corporation | High-bandwidth memory application with controlled impedance loading |
US9679613B1 (en) | 2016-05-06 | 2017-06-13 | Invensas Corporation | TFD I/O partition for high-speed, high-density applications |
CN105957980A (zh) * | 2016-05-30 | 2016-09-21 | 京东方科技集团股份有限公司 | Oled封装设备及oled封装方法 |
DE102016213840A1 (de) * | 2016-07-27 | 2018-02-01 | Tesa Se | Klebeband zur Verkapselung elektronischer Aufbauten |
JP6789048B2 (ja) * | 2016-09-23 | 2020-11-25 | 株式会社Screenホールディングス | 基板処理装置 |
US9960389B1 (en) | 2017-05-05 | 2018-05-01 | 3M Innovative Properties Company | Polymeric films and display devices containing such films |
DE102018108724A1 (de) * | 2018-04-12 | 2019-10-17 | fos4X GmbH | Verfahren zum induktiven Kleben von Sensoren in Windenergieanlagen |
KR20210003272A (ko) * | 2018-05-25 | 2021-01-11 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 상 분리된 물품 |
US11551963B2 (en) * | 2020-02-14 | 2023-01-10 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package and method of manufacturing the same |
KR102263568B1 (ko) * | 2021-02-15 | 2021-06-11 | 한국표준과학연구원 | 양자 저항 표준을 위한 캡슐화된 구조체 |
CN114433971B (zh) * | 2021-12-20 | 2023-07-25 | 中国电子科技集团公司第二十九研究所 | 一种使用磁振颗粒辅助进行堆叠焊接的方法 |
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JP3181737B2 (ja) | 1992-12-28 | 2001-07-03 | 東北パイオニア株式会社 | エレクトロルミネッセンス素子 |
GB9405799D0 (en) | 1994-03-24 | 1994-05-11 | Thomson Consumer Electronics | Shaped parabolic correction waveform for curved face plate display tube |
US6195142B1 (en) | 1995-12-28 | 2001-02-27 | Matsushita Electrical Industrial Company, Ltd. | Organic electroluminescence element, its manufacturing method, and display device using organic electroluminescence element |
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JP5793302B2 (ja) * | 2007-10-05 | 2015-10-14 | コーニング インコーポレイテッド | ガラスパッケージを封止する方法および装置 |
DE102008021676A1 (de) * | 2008-04-28 | 2009-10-29 | Osram Opto Semiconductors Gmbh | Bauteil mit einem ersten und einem zweiten Substrat und Verfahren zu dessen Herstellung |
KR101340820B1 (ko) * | 2008-09-23 | 2013-12-11 | 코오롱인더스트리 주식회사 | 플라스틱 기판 |
DE102008034859A1 (de) * | 2008-07-26 | 2009-08-27 | Daimler Ag | Klebstation sowie Spann-und Induktionsmodul |
DE102008047964A1 (de) * | 2008-09-18 | 2010-03-25 | Tesa Se | Verfahren zur Kapselung einer elektronischen Anordnung |
DE102008060113A1 (de) | 2008-12-03 | 2010-07-29 | Tesa Se | Verfahren zur Kapselung einer elektronischen Anordnung |
DE102009036970A1 (de) | 2009-08-12 | 2011-02-17 | Tesa Se | Verfahren zur Kapselung einer elektronischen Anordnung |
-
2011
- 2011-07-27 CN CN201180049543.7A patent/CN103270618B/zh not_active Expired - Fee Related
- 2011-07-27 WO PCT/EP2011/062881 patent/WO2012019909A1/de active Application Filing
- 2011-07-27 KR KR1020137006303A patent/KR101871317B1/ko active IP Right Grant
- 2011-07-27 DE DE112011102705T patent/DE112011102705A5/de not_active Withdrawn
- 2011-08-11 TW TW100128659A patent/TW201222684A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
CN103270618B (zh) | 2016-08-10 |
KR101871317B1 (ko) | 2018-06-27 |
KR20130097755A (ko) | 2013-09-03 |
WO2012019909A1 (de) | 2012-02-16 |
CN103270618A (zh) | 2013-08-28 |
TW201222684A (en) | 2012-06-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R081 | Change of applicant/patentee |
Owner name: TESA SE, DE Free format text: FORMER OWNER: TESA SE, 20253 HAMBURG, DE |
|
R012 | Request for examination validly filed | ||
R079 | Amendment of ipc main class |
Free format text: PREVIOUS MAIN CLASS: H01L0051560000 Ipc: H01L0051440000 |
|
R120 | Application withdrawn or ip right abandoned |