TW201222684A - Method for encapsulating an electronic arrangement - Google Patents

Abstract

The present invention relates to a method for encapsulating an electronic arrangement against permeates, in particular against permeation of water vapor and oxygen.

Description

201222684 VI. Description of the Invention: [Technical Field of the Invention] The present invention is a method of packaging electronic components. [Prior Art] (Optoelectronic) electronic components are becoming more and more widely used in commercial products. At the same time, more and more (photovoltaic) electronic components are about to be introduced into the market. Such elements have inorganic or organic electronic structures such as organic semiconductors, metal organic semiconductors, polymer semiconductors, or mixtures of such semiconductors. These components can be made into rigid or flexible components according to the needs of the application, and in particular, the demand for soft components is increasing. There are many ways to make such components, one of which is printing, such as letterpress, gravure, screen printing 'lithographic printing, or monthly non-impact printing, such as thermal transfer printing, spraying. Ink printing, or digital printing. Another common method, vacuum method, such as chemical vapor deposition (CVD), physical vapor deposition (PVD), plasma assisted chemical or physical deposition (pECVD), Qian Qian method (plasma) etching method, "vapor deposition method, in which the required patterning 氺: usually done with a mask. "^ 1 Some examples of commercial or market potential (photovoltaic) electronics Electrophoretic or electrochromatographic structures or displays, for use in: organic light-emitting diodes (OLEDs) or polymerizations of non-photodiodes (PLEDs), electroluminescent lamps, luminescent electrochemical photoacoustics (LEEC) ), organic solar cells, Niuyang energy batteries, Yiji Sun II too "battery or polymer Taishi Xi, 锗, copper, marriage and Shixi-based thin film solar cells", (organic yj text 201222684 should be electricity Body, organic circuit components, organic optical amplifiers, organic laser-polar organic or inorganic sensors, organic or inorganic rfid transponders. In the field of inorganic and/or organic (photovoltaic) electronics, how to make (photoelectric) electronic components A long enough service life and sufficient function is a big technical challenge. For the field of organic (photovoltaic) electronics, it is especially important to protect the components in the component from the influence of the permeate. It is a low molecular organic or inorganic compound, especially water vapor and oxygen. Inorganic and / or organic (photovoltaic) electronics (especially organic (photovoltaic) electronics) can prevent oxygen and / or water vapor and other permeate Infiltration of soft adhesive β丨 has a non-* large demand. In addition to preventing penetration, this (photovoltaic) electronic component has many other requirements for soft adhesives. Therefore, the soft adhesive can be used not only between the two substrates. Form a good adhesion, but also have other excellent characteristics, such as high shear strength and peel strength, good chemistry Tolerance and aging resistance, high transparency, ease of use, and good flexibility and toughness. Therefore, one solution commonly used in the prior art is to place electronic components on two substrates that are impermeable to water vapor and oxygen. Between and then the edge is encapsulated. The non-soft structure is a glass or metal substrate as the substrate. Both the glass and the metal substrate have good anti-seepage effect, but the disadvantage is insufficient resistance to mechanical load. One disadvantage is that the thickness of the entire component becomes quite large. If it is a metal substrate, it does not have transparency. The soft twin component uses a flat substrate, for example, a multilayer transparent or opaque film. The flat substrate can be Made of different polymer groups, it can also be composed of inorganic or organic thin films. Using this 4-201222684 flat substrate can produce a very flexible and very thin structure. Different substrates can be selected for different applications, such as thin webs, braided planar structures, pile flat compositions, paper, or a combination of these materials. In order to achieve a good packaging effect as much as possible, it should be like a special barrier adhesive material. #的(光电) Electronic components are used for encapsulating adhesive materials, and have low oxygen permeability and water vapor permeability, as well as good adhesion and fluidity on the components. Too small adhesion to the component will reduce the barrier at the interface. Thus, regardless of the nature of the adhesive material, both milk and water vapor may penetrate. Only when the contact surface between the adhesive material and the substrate is impermeable, the characteristics of the adhesive material play a specific role in the barrier effect of the adhesive material. It is usually shown by the oxygen permeability 0TR (〇xygen Transmission Rate) and the water vapor infiltration WVTR (Water VapQr core). 〇TRA WVTR indicates the lower the oxygen flow and the water vapor and WVTR of the film through the film at the temperature of the (4) temperature and the conditions (including other measurement conditions if necessary, such as relative full f). The more representative of the material, the more suitable it is. The expression of permeability is not only #wvtr“number of 〇tr ::疋 also includes a description of the length of the permeation path, such as material thickness or normalization to a specific path length. The permeability P is a measure of the good barrier effect of an object being gas and/or (iv) a low value of Uρ. The permeability p is a specific material and: a specific value of the permeate under fixed conditions (specific permeation path length, partial pressure and temperature). The permeability p is the product of the diffusion term and the solubility term 201222684 S: P = D*S.

The ridge solution S is a description of the affinity of the barrier adhesive material to the permeate. Taking the permeate as water vapor as an example, a non-hygroscopic material can achieve: a low S value. The diffusion term D is a description of the mobility of the permeate in the barrier material. The size is directly determined by the molecular mobility of the permeate or from the properties of the space of φ. Highly cross-linked or highly crystalline materials are generally capable of achieving a low D I of phase, but the transparency of the material is generally low, while high cross-linking degrades the flexibility of the material. The permeability ρ generally changes to the A glass transition point as the mobility of the molecule increases. For example, when the temperature "or spans the barrier effect, it is necessary to take these two parameters (D and start, especially considering the effect of these two parameters on the penetration of water vapor and oxygen. In addition to the two chemical properties, it must also Considering the influence of physical properties on the penetration rate, especially the average penetration path length and interface characteristics (: the flow characteristics of the material, adhesion). The ideal barrier adhesive material: value and s, 2 is very low, and can Good adhesion to the substrate. Light is usually not able to achieve good barrier properties by the low dissolution term S. A typical example is the rare oxygen elastomer. (4) Material (4) Non-hygroscopic (low solubility), but Due to the relationship of the free rotation (10) bond (large diffusion term), the barrier effect of this material on water vapor and oxygen is different. Therefore, a prerequisite for achieving good barrier is dissolution; term S and diffusion term D A good balance should be achieved. The current use of epoxide-based liquid adhesives and adhesives (w〇98/21287 a1; US4〇51195a; us45526〇 due to the high degree of cross-linking, Liquid adhesives and 谬201222684 Diffusion term D are very low' and are mainly applied to the edge of hard components, but can also be applied to the edges of semi-soft components. Such liquid adhesives and adhesives can be heated or Irradiation by ultraviolet light. Due to the shrinkage caused by hardening, it is almost impossible to achieve full-area adhesion because hardening causes stress on the adhesive and the substrate material, which may cause peeling of the adhesive. The use of this liquid adhesive has There are many disadvantages. For example, its low molecular weight (V ◦ C 'volatile organic compounds) may damage the electronic structure of the component, making it difficult for the components in the product to communicate with other components. It is necessary to apply the adhesive to the electronic component very laboriously. On each of the components, another disadvantage is the need to use an unreliable spreading device and fixing device to ensure the precise positioning of the liquid adhesive. Moreover, the coating method is not conducive to the rapid continuous operation, and the subsequent needs The lamination step may be due to the low viscosity and the inability to achieve a specific layer thickness and The adhesion width of the narrow area. The cross-linked adhesive has only a small flexibility after hardening. The use of 4 ^ ', ,, and the system is limited to the low temperature range, or two-component 糸The use of j. rQ it > - the use of the limit of use, that is, must be completed before gelation | ^ ^. In the case of temperature target and long reaction time sensitive (light The electronic structure of Ray · ^) also limits the availability of such a system: (photoelectric) φ 2 ^ η The lowest usable temperature of the substructure is usually 90 ° C, because " once super / its β person a temperature The '(photoelectric) electronic structure may be damaged. In particular, the usable temperature range of the Jd4 organic electronic component packaged with a transparent polymer film (or polymer film, composite) is particularly high. This is also the case for the lamination step performed under high pressure. For 201222684 far better durability, it is best to remove the temperature-bearing step and laminate with a lower pressure. One advantageous way is to encapsulate such (photovoltaic) electronic components using pressure sensitive or hot melt adhesive materials. The use of pressure sensitive adhesive materials is a prior art (e.g., US 2006/0100299 A1, w〇 2007/08728 1 A1, US 2005/0227082 Al, DE 10 2008 047 964 A, DE 10 2008 060 1 1 3 A). It is preferable to use a pressure-sensitive adhesive material which is activated by adhesion (for example, actinic radiant heat energy) after adhesion, 2006/〇1〇〇299 Al, WO 2007/08728 1 A1), because of the energy induced by the introduction The coupling reaction can improve the barrier effect of the adhesive material. Another adhesive material for packaging electronic components used in the prior art is a hot-melt adhesive material. Such adhesive materials are mainly ethylene copolymers such as ethylene-ethyl acetate (EEA), ethylene-acrylic acid copolymer (EAA), ethylene-butyl acrylate (EBA), and ethylene methyl acrylate (EMa). The package of solar wafers based on 矽 wafers is typically a crosslinked ethylene-vinyl acetate (EV A) copolymer. In the encapsulation process, the crosslinking reaction is carried out under high pressure and at a temperature higher than 120 °C. For many (photovoltaic) electronic components based on organic semiconductor or thin film processes, the mechanical stress caused by high temperatures or pressures in this process is disadvantageous. Jp 2002 260 847 A also uses this process for the packaging of organic light-emitting diodes. US 5,488,266 A > WO 2008/036707 A2 'WO 2003/002684 A, JP 2008 004 561 A, JP 2005 298 703 A, US 2004/0216778 Al et al. all disclose other block copolymers or functionalized polymers A base-based hot melt adhesive material. In addition, the cross-linking reaction initiated by actinic radiation or heat can improve the properties of these heat-filled materials (eg, W〇2008/036707A, W02003/002684A, jp 2005 298 703 A, US 2004/0216778 A1) . The disadvantages of the pressure-sensitive or hot-melt adhesive materials used in the first technology are: no blocking effect is less than the epoxide adhesive (especially the barrier effect on oxygen) and at high temperatures, the cohesive material is cohesive Sex will be greatly reduced. This raises the risk of air bubbles in the wet and warm environment. The term "cohesiveness" generally refers to the physical effect of a substance or mixture of substances due to interactions between molecules and/or within molecules. Cohesiveness determines the viscosity and fluidity of the adhesive material, which can be measured from viscosity and shear time. In order to improve the cohesiveness of the adhesive material, the adhesive material is usually subjected to one cross-linking. For this purpose, the active ingredient (crosslinkable component) or other chemical cross-linking agent is added to the adhesive material and/or The adhesive material is irradiated with ionizing radiation during the treatment. The term "adhesive" generally refers to the physical effect of two molecules that are in contact with each other due to the interaction between molecules in the contact surface. Adhesion determines the adhesion of the adhesive to the surface of the substrate. The adhesion of the adhesive can be known from the adhesion (the "adhesion") and the measurement of the adhesive strength. In order to exert a certain degree of influence on the adhesion of the adhesive material, a softener and/or an adhesive-enhancing resin (also called a tackifier) is usually added to the adhesive material. The viscous characteristics of the adhesive material are mainly determined by the relationship between cohesiveness and adhesion. For example, for some should

It is important to use that the adhesive material used must be highly cohesive. 'There is a strong internal cohesion. D If the adhesive material is to be thermally crosslinked, heat must be transported through the electron junction 201222684. Bonding. Heating is usually required at this time, but this may cause damage to the electronic structure. Another challenge is how to limit the heat transfer to the area to be bonded. For example, if a thermal punch is used to cause thermal energy to penetrate the polymer film into the 'the temperature of the thermal punch must be much higher than the temperature to be reached at the bond' to minimize the heating time. This can damage the polymer film and its barrier layer as if the lateral heat flow could cause electrons to damage. The problem of how to limit the thermal input to the local range is also present in another method, which involves inputting thermal energy (for example, by infrared radiation or hot gas convection) before bonding at the bond. Light-sensitive cross-linked pressure-sensitive or heat-sensitive adhesive materials have the same disadvantages because radiation may cause damage to electronic structures and a part of the electronic structure is radiation-transparent. Since many of the components in the electronic structure (especially organic electronic materials) and many of the polymers used are sensitive to UV radiation, they cannot be used for long periods of time if no external protective measures are taken (eg with a cover film). Outdoor use. The UV-cured adhesive system can be UV-cured and then covered, but this will not only increase the complexity of the process, but also increase the thickness of the entire structure. The problem of how to limit the heat input to the local range also occurs with radiation cross-linking. Although the use of a mask helps solve this problem, it is a cumbersome task for continuous production. US 67063 1 6 B2 discloses a method of melting a low melting point gold supersonic = encapsulating an organic light emitting diode. This method is: placing metal and wire between the substrate and the cover layer, and pressing at a very high pressure (2_ to (4) read by Boeing. Due to the metal characteristics of the package material, it must be high at the bond. The temperature cannot be applied to the polymer substrate due to the high temperature and the high pressure of 10 - 201222684. The us 67063 16 B2 itself also clearly indicates that this method is only applicable to glass, metal and ceramics. The encapsulating material is electrically conductive and therefore requires an electrically insulating layer in the electronic structure. US 6195 142 B1 discloses a similar encapsulation method using solder of a low melting point glass, metal or liquid crystal polymer. The method has similar disadvantages as the previous method. Taking the glass substrate and the glass protective cover as an example, the ultrasonic time is between 2 sec and 3 sec. This patent proposes to use a soft substrate made of PET, and the protective cover is made of steel. Or made of glass 'Jt clearly pointed out that epoxy resin, poly other macromolecular adhesive is less suitable. (10) "曰 and the above two methods need to use the temperature The danger of damage to the electronic structure due to thermal conduction, and the risk of further thermal conductivity of the substrate and/or the protective cover' is further increased. US 6803245 B2 is an adhesive bonding electronic component as an adhesive bond. The alternative is not to activate the adhesive with an ultrasonic wave. DE 103 09 607 A1 discloses a method of encapsulating a functional component of an electronic component by using ultrasonic welding to close the sealing cover disposed above the functional component to the substrate According to an advantageous embodiment of the method, a sound-welding sealing material can be placed between the substrate and the sealing cover before the ultrasonic welding, but it is better to use the substrate and The sealing covers are made of solderable thermoplastics so that the substrates and the sealing caps themselves can be welded together via super-waves. As with all welding methods, the disadvantage of ultrasonic welding is that the two joints must be at their interface. Converted into a dazzling 201222684 state 'to make the material door At 曰] month b enough for solder joint If the 的+:1 > 叮 rape restores. The typical molecules expand each other, then this incompatibility is required. The joints are also & / state, so that their two interfaces can be molecularly interdiffused from the interface from this point. Another disadvantage is that the joint: ^::: welding method is no different. It may be damaged. The polymer film of the barrier layer on the surface of the product, and even the whole section is covered with DE10 during packaging, resulting in insufficient sealing of the joint. 9 6 0 7 A 1 is recommended from glass solder and stenciled by a suitable sealing material, and clear ...: bad material and adhesive to choose a good sealing material. Make::=Self-fat (: kind of sticky::: The dosage of the paste-like adhesive must not exceed the flow of adhesive during the welding process. Because super-wave welding must use very high (four) force, so that the sound It is difficult to prevent the liquid adhesive from being squeezed out from the weld. ° In addition, the sealing material can be selected from the soft organic polymer thermoplastic. This choice and the second flux are not the same. Because the choice of sealing material must be compatible with the choice of the patch, to ensure that the molecular (four) joints of this joint range will be greatly limited. Also published in the fight. Because of the aforementioned This method may result in damage to the packaging material. [Invention] The object of the present invention is to provide a method for encapsulating electrons to block penetration, especially for blocking water vapor and oxygen. The method needs to be -12-201222684 early and he is fast enough to execute, and at the same time, it is good enough to achieve a good packaging effect. In addition, it is necessary to use the appropriate + i field adhesive material (especially soft sticky) The material 枓) extends the service life of the (photovoltaic) electronic component. The main application of the invention is as follows: α t A. The patent of the patent can achieve the purpose of the patent. Advantageous embodiments of the invention. Methods of Barrier Infiltration The present invention provides a packaged electronic component comprising the steps of: 'preparing a planar composition having at least a material; a heat-activated pressure-sensitive or hot-melt adhesive- Carrying/containing the electronic component on the substrate such that the planar structure surrounds at least the area to be packaged of the electronic component; the electronic component and at least the adhesive material surrounding the electronic component are provided with a cover layer in which the adhesive material contacts the cover layer; Thermally activating the area of at least one sub-region of the adhesive material by a composite comprising at least a substrate and a cover layer. wherein the thermal energy required for thermal activation is self-generated in a flat composition comprising at least the adhesive material, or It is produced at the interface between the adhesive material and the substrate and/or the cover layer. _ Another package of electronic components to block The method of infiltration is to add an electronic component to the adhesive material that is coated with at least the electronic component.

It # a *τ g ', the medium adhesive material is in contact with at least the substrate. Encapsulation refers not only to the lowering of the electrical components by the planar composition mentioned above, but also to the sealing of the (optoelectronic) electronic components by the planar composition. The domain is sealed, that is, the planar structure only frames part -13 - electrons and structures. Permeability refers to the dysfunction of chemical substances (such as atoms, components or components), especially electrons or optoelectronics. These chemicals can penetrate into the shell or the outer cover, especially through the outer adhesion, 4 joints. The so-called part or part here. Surrounded by 'and in addition to the mechanical casing or cover. Translucent especially refers to low molecular weight organic or hydrogen free (H2), oxygen (〇2) and water (h2〇) is a gaseous or vapor. That is, the measure of heat generation inside the material does not affect the phenomenon that the electronic component itself is damaged, and unlike the DE 103 09 pre-light technology, the adhesive material of the present invention is heated to generate and/or The encapsulation quality of the method is far superior to the advantage that the thermal energy is basically generated by itself in the adhesive surface composition. Therefore, in order to smoothly transfer the thermal energy, the method requires a temperature gradient and an over-rule does not have this problem. Therefore, this intervening, and greatly reduce the lateral heat flow (main 201222684 sealed 'such as single-sided coverage or so-called infiltration, molecules, ... in the present invention) can penetrate into zero a member or component, and which may result in an opening or seam of the outer casing or outer casing of the component or component, the outer casing or the outer casing refers to the infiltration of the so-called permeation compound in the present invention having a protective function in addition to the integral function of the component, In particular, the form of the infiltrated material may be based on a method described in the following paragraph [0008] which is not described in detail in the adhesion to the electronic component. It is possible to bond all or intensively. In addition, the conventional heating method of the present invention is a combination surface of the method of the present invention. Since the heat energy is heated to the activation temperature in a flat state, the temperature is increased by conduction, radiation or convection, but The method of the invention of the present invention can shorten the heating -14-2222684 to the direction of the electronic component). Another advantage is that the electronic structure 'substrate and the cover layer must adopt special measures for generating thermal energy, that is, no need to form a point to input current, but only need to add a composition containing the adhesive material and fit in the adhesion. Enough energy is generated outside the material to generate thermal energy. The prior art has a number of different suitable mechanisms for self-generating thermal energy within the flat product, such as by exothermic chemical reactions or phase changes (e.g., crystallization) heating, by resistive heating, by absorption radiant heating, by magnetic induction heating, by high frequency electric fields. The interaction is done ^ such as microwave radiation) heating. Among them, chemical reactions and physical phase transitions generally do not produce sufficient ratio (volume) heat for the use of living materials. The resistor heats a specific electrical material as a component of the planar composition (e.g., a conductor in the adhesive material, or an electrically conductive adhesive material), and introduces a current contact. High-frequency heating and microwave heating require special bonding materials in the planar composition, or use special adhesive materials (such as adhesive materials based on poly or polyethylene). These bonding materials or adhesives need to be tuned to specific Frequency and a sufficiently high dielectric loss factor will impose significant limitations on material selection. In addition, it is difficult for heating to limit the range of radiation to the area where the door is heated. Therefore, the risk of damage to the microelectronic components is high. A more advantageous way is to generate thermal energy in a planar composition containing at least a binder by magnetic induction. WO 2009/021801 A1 This method is not used in other aspects. No need to touch the plane to form the surface of the physicalized spokes 3. (Incorporating the adhesion of the imported conductive amine material. This microwave wave is made of material -15- 201222684 Ultra-wave welding is a kind of joint棚果夫# 4 @木 according to the method of α plastic. In principle, if you do not use the corresponding joints, you can only use the thermoplastics for the right and left. And the eight have enough plastics in each other to fight. J-phased 刖 刖 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' Μ, for example, in the joint of the 'will be in the film. And other soldering methods, must be input heat: vertical, leather medium and / or bonding material activation (such as the energy required to melt the connection comes from High-frequency mechanical vibration. This method is characterized in that the energy required for welding is generated in the weld by friction and vibration in the nucleus and/or parent side and/or in the flux. The method of the present invention suggests super The sound wave heats the adhesive material. Unlike the super sound, the super sound Heating is not mainly to generate heat in the interface, but to generate heat through the hysteresis loss in the adhesive material. The extremely high mechanical damping coefficient tan5 contributes to the occurrence of hysteresis loss; the required ultrasonic instruments are mainly It consists of: • Oscillator • Oscillation circuit (welding head) • Anvil B uses an oscillator to generate the ultrasonic frequency. The oscillator can change the supply voltage: high voltage and high frequency. The electric energy is sent to the Ϊ&quot ;! The Ϊ converter' is also the so-called frequency converter. The frequency converter usually works according to the two-piezoelectric effect, that is, it uses the specific crystal characteristics that will expand and receive when the resistance is turned on. It is transmitted to the horn through an amplitude impedance transformation section. The amplitude impedance transformation section can affect the amplitude of the oscillating amplitude. (4) It is usually transmitted to the welding head and its corresponding under the pressure of -2 to 5 MPa, the pressure -16 - 201222684. The workpiece between the anvils is used to generate the thermal energy required for activation. The localization is used to soften the adhesive and the mechanical damping coefficient increases. The mechanical damping coefficient The increase causes the output of thermal energy to increase, and the self-accelerating reaction effect is ensured. The present invention enables the adhesive to be activated quickly in this way, which contributes to achieving a short cycle time and high economic efficiency. Another advantage is that the temperature rise range is very limited, that is, it is limited to the range where the surface of the weld head is in contact with the composite. The bond will become very strong after cooling. Because the weld head is directly affected by the vibration of the super-wave. Therefore, there is a report on the material used to make the horn. = Requirements: Titanium with carbide coating is usually used as the material for manufacturing the horn. The above 14 methods are characterized by very short ultrasonic time and therefore high economics. Benefits. Ultrasonic time is preferably between 1 second and 3 seconds.仏In order to shorten the ultrasonic time, a favorable person®m” has the (1) method of adjusting the unit viscosity. The power of the area is adjusted to 3W/mm2 or more. The rear plane structure will be the person &amp; λ team blood / Bai < Permanent connection between the two. 'This method allows any different materials to be joined to each other. A singular finding is that 'even if the electronic components are under the welding head (but the 疋 is not in contact with the welding head), it will not Injury. One #生日############################################################################################### When the T is inserted into the surface of the welding head, the welding head cannot be touched. The surface of the object is pressed out to protect the surface of the cover layer from contact with the soldering tip from mechanical damage -17- 201222684, and finally to the cover layer and film, or to the contact material of the soldering tip. A protective film is placed between the welding heads (the sacrificial surface is coated with a layer of elastomer or viscoelasticity in order to reduce the risk of surface damage. An advantageous 疋 adjusts the power of the unit bonding area to less than G.5W/mm2. In order to reduce the risk of surface damage, on the other hand, the Boeing turbidity pq p is shortened as much as possible, and the time is only adjusted to 0.5 W/mm2 to 3w/mm2. The optimum ultrasonic energy of the unit bonded area calculated by multiplying the ultrasonic time and the input power is between 0.05 J/mm 2 and 9 J/mm 2 . According to an advantageous embodiment of the present invention, the continuous process is super The sonic energy is input via a straightenable horn. The corresponding ultrasonic technology belongs to the field of known ultrasonic welding. θ Another very advantageous way is to generate heat energy in a planar structure containing at least an adhesive material by magnetic induction. ΕΡ 1 453 360 Α 2 has not been applied in other aspects of the method. Compared with ultrasonic heating, the advantage of magnetic induction heating is that the planar structure and the cover layer or substrate are not By direct contact, the planar structure can be heated by an external heating device, and heating can be completed even without contact. For example, the planar structure can be loosely overlapped with each layer such as the substrate and the cover layer to make it non-phase. Contacting to perform induction heating. Then applying force (pressing the bonding position) in the next step to form a strong and long-term joint. An advantageous variant of the invention is to integrate the inductor into at least one tool. In this way, the induction field can be moved to make the non--18 - 201222684 hang close to the bonding position. Because the gi knee is imaginary, the y gate guard limits the spatial range of the sensing cymbal near the bonding position. It can be heated in the interactive magnetic field through various effects. : If the object heated in the combined magnetic field has a conductive area, the alternating magnetic field: induces a thirst flow in these areas. If the resistance of these areas is not:: the resulting eddy current loss will produce Joule heat (current...). The ability to form this (four) flow, the conductive area must reach the - minimum size 'and from the outside The lower the frequency of the alternating magnetic field, the larger the minimum size. However, if placed in the magnetic county i &amp; Λ and the object heated in the mutual magnetic field has a ferromagnetic region, then the elemental magnets in some areas will be The direction of quasi-parallel to the externally interacting magnetic field is outside. The hysteresis loss (repetitive magnetization loss) that occurs during the change of the ρ alternating magnetic field heats the object. Depending on the material of the object placed in the alternating magnetic field (ferromagnetic metal, For example, 胄m or ferromagnetic alloys, such as Mengyou Hejin; 5 4s β Λ, 〇 to 鲇 nickel-cobalt alloy, can use these two effects to heat objects at the same time, or can only use them. The effect heats the object (non-ferromagnetic metals can be heated by eddy current effects, such as aluminum, or metals with poor conductivity can only be heated by hysteresis, such as iron oxide particles). If the heat-activated viscous planar structure is to be thermally activated by induction heating, a planar composition containing a heat-activated adhesive material is usually applied, which is applied to the surface of a conductive layer, for example, with a metal film. Or a surface of a planar structure of a metallized polymer film, an interrupted metal film, a metal wire mesh, a flattened thin metal, a metal velvet or a metal fiber, *. The last mentioned discontinuous planar structure has the advantage that the adhesive material -19-201222684 can pass through the planar structure through holes in the planar structure, thus contributing to the improvement of the cohesive force of the planar structure, but this will pay the cost of reduced heating efficiency. . In recent years, the application of induction heating to bonding has regained industry attention. This is because of the nanoparticle systems that are available today, such as MagSiliCa® (EV〇nik AG), which can be placed in the material of the object to be heated, which heats the entire object, but not It will cause any loss worth mentioning for the mechanical stability of the object. MagSilica® is a tiny iron oxide particle coated with cerium oxide. For example, a belt called DUpl〇coll RCD® manufactured by Lohmann's adhesive material contains an inductively heated nanoparticle. Thermal energy is produced by the action of MagSilica® with a magnetic field. If the adhesive containing MagSilica® is in a rapidly changing magnetic field, the iron oxide particles will start vibrating like a compass pointer. This produces heat in the adhesive and the adhesive quickly hardens. Since there is no need to heat the electronic components, precious heat energy can be saved and the production process can be significantly accelerated. Many different heating devices are currently known for inductive heating. The different interactive devices generate different frequencies of interaction. Induction heating can be performed using a frequency range of 100 Hz to 200 kHz (so-called intermediate frequency, MF) or a frequency range of 300 kHz to l 〇〇 MHz (so-called high frequency, hf). However, due to the small size of the nano-system, this product cannot be effectively heated at the frequency of the intermediate frequency range in the alternating magnetic field, but it needs to be -20-201222684 to meet the two-frequency coincidence and not to activate the degree. The viscous susceptibility is left in the cause of the removal of the heat storage. The plate, the hot live IMPa plate is fully t-frequency in a 4-frequency range to be effective for heating. Shake the ancient 疋 加热 疋 heating at a frequency, the risk of damage to electronic components in the interactive field. The equipment required for the interaction of the magnetic field is economical. This is not the case, it is better to use the frequency of the intermediate frequency range. —Amazing :: Organic electronic components are not compromised in this frequency range. ..., in order to achieve the high processing requirements of the industrial manufacturing process, the heating time of the viscous planar composition must be very short: the heating time is controlled at 〇·! to 10 seconds. In order to achieve the desired bonding temperature, it is necessary to select the acceleration speed of the high rise, but the right is to form the heat-activated adhesive plane (4) 4 in the thermal conductive compound (thermal conductivity does not exceed 5W/mk), Yan Yishi ΛΛ i ^The heat that should be generated in the thousand-face composition cannot be completely discharged from the binder. This heat will adhere to the in-plane time and thus form heat storage there. Possible flat structures and adhesives are damaged by local overheating. If the thermal conductivity is very poor, the heat capacity is also very low, so it is impossible to temporarily:, the risk of overheating is higher. For example, when the adhesive surface contains a poly-adhesive, it has both low thermal conductivity and low heat capacity. Therefore, an advantageous method is to apply a force perpendicular to a surface section of the adhesive plane composition to the pre-composite composed of the base plane composition and the cover layer during induction heating (to a small, or It is preferably at least 3 MPa) in order to contact the adhesive material with the adhesive. The so-called "perpendicular to the heat-activated adhesive plane composition II &amp; face slave" means that when the plane is bonded, the pressure is at least perpendicular to the plane composition of - 21,222,684 for flat placement. (The two surfaces are also flat. The main extension of the 'female' is the adhesion of the three-dimensional space, which means that the pressure acts perpendicularly on a main extension of the planar composition, and therefore acts perpendicularly to the surface of the planar composition in a sub-region. The method of the present invention can be carried out using a commonly used induction heater (inductor). All common and appropriate induction heaters (inductors) can be used in the present invention, that is, when the AC current passes through its coil and the line is blocked, the application of the alternating magnetic field of appropriate strength is applied. The magnetic field strength required for heating can be generated by using a suitable current to flow through a w (., 4 turn device 1 such as a point sensor) having a proper number of turns of the coil. Feeling deer crying, Luxi heart 00 'has a magnet core, and can also have a magnet core composed of iron or compacted weaving powder. The complex can be placed directly on the resulting product. Another possible way is to place the coil arrangement as a primary coil on the primary side of a magnetic field transformer, wherein the magnetic field transformer has a secondary side that provides a relatively large current. Since a larger current supply can be obtained, the field coil disposed beside the composite can have a small number of ® and does not weaken the field strength of the alternating magnetic field. Another advantage of induction heating is that the risk of damage to the existing inorganic barrier layer in the substrate and/or overlay is significantly less than the longer passage of the barrier film due to the short heat pulse from the interior of the adhesive material. Conductive heating or mechanical ultrasonic heating. It is preferable to use a metal film, a polymer film, a composite film, or a film or composite film with an organic and/or inorganic layer as a substrate material for electronic components. All common metals and/or plastics for manufacturing films can be used. 201222684 Manufacture of such film/composite film, the following are a few examples: steel, aluminum, steel, polyethylene, polypropylene (especially oriented polypropylene (OPP) produced by uniaxial or biaxial stretching), cyclic olefin copolymer (COC), polyvinyl chloride (PVC), polyester (especially polyethylene terephthalate (PET) and polyethylene naphthalate (PEN)), ethylene vinyl alcohol (EV0H) 'poly Preference to polyvinylidene chloride (PVDC), polyvinylidene fluoride (PVDF), polyacrylonitrile (pAN), polycarbonate (PC), polymethyl methacrylate (pMMA), polyamine (pA), polysulfide Ether (PES), polyimine (pi). The substrate material can also be combined with an organic or inorganic coating or key film. There are a number of commonly used methods for this purpose, such as painting, pressing, printing, evaporation, sputtering, co-extrusion, lamination, and the like. The following are examples of some bond films: tantalum and aluminum oxide or nitride, indium oxide (ITO), and tantalum coating. The film/composite film (especially the polymer film) preferably has a permeation barrier against oxygen and water vapor, wherein the requirements for the permeation barrier of the package region are WVTRC10·1 g/(m2d) and OTIUIO·1 cm3/ (m2d bar), or preferably WVTR &lt;10-2 g/(m2d) and OTRclO.2 cm3/(m2d bar). Oxygen permeability (OTR) and water vapor permeability (WVTR) should be measured

According to DIN 53380 Part 3 (OTR) and ASTM F-124 9 (WVTRW regulations. Oxygen permeability is measured in an environment of 23 t and 50% relative humidity. The measurement of water vapor permeability is at 37 ^c And the environment with a relative humidity of 90%. Then the measurement result is normalized to a film thickness of 5 〇μπι. One advantage of the present invention for a film with a barrier layer is that it can reduce the heat input of -23-201222684 and its possible Damage caused by the layer structure of the permeable barrier. An advantageous way is to make the film/composite film transparent so that the entire structure of the electronic structure is transparent, or at least the line can be injected into the electronic structure or from the electronic structure. Injection. “Transparent” here refers to the average transmission of visible light with wavelengths from 4〇〇 to 8〇〇ηη.

At least 75%, or preferably more than 85% (measured according to ASTM D). The transparency or transparency of an object is determined by the reflectance of its matte surface and the wavelength of the light used for the measurement. Matting 疋 A property determined by the absorbance of the materials used. In order to have a transparent material, it is necessary to avoid absorption and reflection. Reflection occurs at all surfaces and material interfaces. The surface roughness and refractive index of the material used for reflection are determined. Scattered reflections also occur on the rough table. In the special case of transparent material and the vertical incidence of the beam and the sound of the center of the heart, the Fresnel equation can be transformed into: R = (n2-n1)2/(n2 + n,)2 R= at the interface Reflection n! = refractive index of medium 1 Μ" "refractive index 2 refractive index air refractive index nLuft is about i reflection occurs on all surfaces, thus causing objects, for example, assuming that the beam is incident on the film and From the film, the film of the refractive index nz=1.6 can reach a brightness of no more than 9〇%. The adhesive material and the carrier film are preferably transparent, and the wavelength is such that the light is over 1003. The number and coefficient obtained are succinct by the surface. The light transmittance of the transparent adhesive film is preferably greater than or preferably greater than 85% (according to ASTM D 1). Method for measuring 〇〇3) The light transmittance (usually simply referred to as transmission) in % is the ratio of the optical power that reaches the back of the object after passing through the object and the optical power that the light is incident on the front side. It will become smaller due to reflection and light absorption. Therefore, light transmittance = (1_reflectance_ Absorption rate) In principle, it is possible to use the same film as the substrate material/composite as a substrate and a cover layer which the cover layer contains the electronic structure. For example, the two faces of the composite are generally not required to be transparent. Therefore, it is possible to carry in a transparent substrate and an opaque cover layer. As described above, the substrate material and the cover layer are often composed of a material that is joined by a welding method (for example, ultrasonic welding or induction welding), so the prior art often It is joined by a hot-melt or pressure-sensitive adhesive surface composition. _ The present invention combines the generation of thermal energy and adhesion in a planar composition, compared to the use of a liquid adhesive or a solder-assisted film. Achieving an amazing combination of effects, including a substantial increase in the quality of the product, and the complexity of the material selection and the packaging process are greatly simplified. The use of pressure-sensitive adhesives can avoid the positioning and fixing measures of the layered composites. The method is to prepare a planar constituting/layered material containing at least one heat activated material, and then layering the plane The material is in contact with the substrate or the cover layer, wherein the heat-activated adhesive 〇 〇 〇 〇 〇 作 作 〇 〇 〇 〇 不能 不能 不能 不能 不能 不能 不能 不能 不能 -25 -25 -25 -25 -25 -25 -25 -25 -25 -25 -25 -25 -25 -25 -25 -25 -25 -25 -25 -25 -25 -25 -25 -25 A method of forming a layered structure is applied to a substrate or a cover layer, such as painting, stamping, evaporation, sputtering, co-extrusion, etc. The heat-activated adhesive material and substrate or cover produced in this manner An example of a composite composed of layers is a thermal encapsulation film which is conventionally used in the field of packaging, and has been applied to packaging of electronic structures such as PICHMC-1 film manufactured by Peccel Techn〇1〇gies, Japan. An advantageous refinement of the invention consists in first forming a pre-composite of the planar composition and the substrate material or covering material. For example, the substrate and the planar structure may be bonded together before the electronic component is placed on the substrate. Another possible way is to first make the cover layer and the planar composition form a pre-composite, and then position the electron. On the component. The method of forming the pre-composite is familiar to those skilled in the art, such as lamination, coating, stamping, sputtering, co-extrusion, and the like. The planar structures referred to in the present invention include common and suitable flat compositions. The planar composition can be formed into a planar bond and can be designed in a variety of forms, particularly soft adhesive films, tapes, adhesive labels, or blanks. The planar structure can be tailored to conform to the shape of the adhesive surface to reduce the risk of damage to the electronic component during heating. The planar structure referred to in the present invention has two faces, that is, a front side and a back side. The front side and the back side refer to two surfaces of the plane structure parallel to its main extension range (planar extension range, main extension surface) and are only used to distinguish the two opposing surfaces of the plane composition from each other instead of To define the absolute spatial position of the two surfaces, the front side can also mean that the planar structure is spatially located on the surface of the rear -26-201222684, while the back side is B-left and the front surface of the work. This heat activation persuades the witchcraft to engage the j_, & substrate. Therefore, the planar structure is bonded to the cover layer and at least one of the two surfaces of the U-form has a heat-activated adhesive material, an activating adhesive material.敎二生: ^ is the adhesive material that is hot-bonded and bonded at both surfaces when both surfaces have heat, and can appear in a negative form that can withstand mechanical force. In the simplest two = is sticky? The layer of heat-activated adhesive material of the material layer constitutes the surface constituent 疋, which is bonded to the substrate and the cover layer by the hi--the two layers of the material are defined by the 疋--the consistency of the work and it is in a six-door A ‧ , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Separately - the 疋 ▼ has a perforated, and the flat composition of the 'can also be made by the special F! u &quot; is when these different materials contribute to the layer - the second layer (especially the area can have the same thickness, It can also be used in agriculture.) The entire layer of the layer can also have more than one kind of function and different thickness. This is because the structure of the single layer structure is simple, the heat... makes the ultrasonic heating achieve high efficiency; The sonic addition is the mechanical loss factor of the heat-activated adhesive material with two favorable squares of 23t and a frequency of 1 Hz). The number δ is greater than 〇.1 (in order to avoid the substrate or the cover layer in the vertical heat 'tan5 &amp; *w material _ tanS 曰' σ heat occurs when it is added and the frequency of the strip is preferably at least at the temperature - 27-· 201222684 Poly 3 (such as teaching dazzling

..44s .. ...Bathing material 枓) The loss factor is in accordance with DIN (3)z). Torsional vibration test (test conditions: temperature ^, the frequency of the adhesive material loss factor is under the temperature hungry frequency iHz bar and the torque is negative, to the vibration shear test (dynamic mechanical analysis, 〇ΜΑ) Measured. This experiment is to study the rheological properties, in Phaletal. The "Praktische Rhe〇1〇gie" _

Ela St〇mere (Applied Rheology of Plastics and Elastomers, VDI-Verlag, 1995^ 57-60 Α 119·127) contains a detailed description of this experiment. This experiment is a controlled shear produced by the company Ares. The speed of the claws is carried out, and the plate diameter of the board to board is used. The single layer structure of the plane composition is also useful for induction heating. Thermal activity, adhesive material | The conductivity at 23 ° C is preferably Above 2QMS/m, the polymer itself rarely has such intrinsic conductivity but fillers can be added to achieve such conductivity. Conductivity is measured at a temperature of 23 ° C and a relative humidity of 50% according to ASTM D The specification of 2739_97 is carried out. Another feasible way is to make the adhesive material further have iron electromagnetic I1, ferromagnetic, or paramagnetic. For example, the above-mentioned nanoparticle can be added to achieve this effect. In order to facilitate induction heating, the present invention The planar composition has at least 3 different layers, that is, at least one conductive layer, at least one heat-activated adhesive material layer, and at least one additional adhesive material layer. The material layer and the at least one heat-activated adhesive material layer may be composed of the same or different adhesive materials. For example, another adhesive material layer may contain a heat-activated adhesive material, or a non-thermally activated -28-201222684 adhesive material. In principle, the at least one electrically conductive layer can be designed in any form, for example a layer that is very thin and completely intact, or a layer with perforations (for example a grid layer). The layer thickness of the electrically conductive layer is preferably less than 5 〇, 2. A, or preferably ΙΟ j ΙΟμηα. When the layer thickness is less than 1 〇 (xm, it is easy to limit the upper limit of the heating rate. All common and appropriate materials can be used to make conductive layers, such as aluminum and copper , gold, nickel, permalloy, AlNiCo permanent magnet alloy, ferrite, plastic nanotube, graphite, etc. The conductive layer preferably also has magnetic properties, especially iron electromagnetic or paramagnetic. Conductive layer conductive The ratio is preferably greater than 2 〇 MS / m (equivalent to a specific resistance of 5 〇 Qmm 2 / m), or preferably greater than 40 MS / m (equivalent to a small specific resistance of 25 nmm 2 / m), the above values are in Bar with m degree of 3 0 0 K In addition to the at least one electrically conductive layer, the planar composition may of course have other electrically conductive layers 'these other electrically conductive layers which may be the same or different from the at least one electrically conductive layer. Overall, f, heat may be The activated viscous planar structure is designed in any form. For example, in addition to the layers mentioned above, the planar constituting material may also have a layer thereof, such as a permanent or temporary carrier. In order to be able to achieve sufficient thickness with a small thickness. The bonding strength, the thickness of the adhesive material layer is preferably between the jaws and 20_. If a particularly strong joint is to be achieved, the thickness is preferably between 100 μη and 500 μηη. In principle all common heat-activated adhesive adhesive materials. The system can function as the at least one heat activated viscous adhesive material. In principle, heat-activated viscous adhesive materials can be divided into two categories: thermoplastic heat-activated viscous adhesive -29-201222684 material (hot-melt adhesive material) and reactive heat-activated viscous adhesive material (reactive adhesive material). Some adhesive materials can be classified into two major types at the same time, namely reactive thermoplastic heat-activated viscous adhesive materials (reactive hot melt adhesive materials). &quot; ... The thermoplastic adhesive material is a basic polymer which is reversibly softened when heated and hardens again during cooling. Conversely, the reaction: the thermally activated viscous adhesive material contains a reactive component. These reactive components are also referred to as "active resins" which cause cross-linking reaction by thermal heating in the active resin and form a joint which can maintain long-term stability even under pressure after the completion of the crosslinking reaction. The material preferably also contains elastic grades: for example, synthetic nitrile rubber. Due to its high flow viscosity, these elastic components can provide good shape stability for heat-activated viscous adhesives. A number of specially activated viscous adhesive material systems for the present invention will be described. The eight-ton thermal thermoplastic heat-activated viscous adhesive material contains bismuth plasticity. The thermoplastic base polymer is subject to the mobility of a very local poly-a. The pressure is 1 'sinking is very important for long-term bonding. The final::: can = "on a substrate with a rough substrate or other different states can also quickly adhere to the thermoplastic adhesive D known in the prior art. . All thermoplastic heat activated adhesive materials. For example, DE 1〇 2006 042 8 1 6 Α1 Α is used as a suitable thermoplastic adhesive material:;,, plastic adhesive material as a thermoplastic adhesive material. ... does not mean that this is only - -30 - 201222684 EP 1 475 424 A1 A typical forming tool for describing a thermoplastic adhesive material, such as a thermoplastic adhesive material, may contain one or more of the following ingredients (or one of the following ingredients) Or a plurality of components to form a wide polyolefin, an ethylene-vinyl acetate copolymer, an ethylene ethyl acrylate copolymer, a polyamidamine, an ester 'polyamino phthalate, a butadiene-styrene-block copolymer J. Jia is using the thermoplastic adhesive material listed in paragraph [〇〇27] of Ep丨475 424 A1. EP &quot;56 063 A2 describes other thermoplastic adhesive materials i especially suitable for special fields (such as bonded glass substrates). ) thermoplastic adhesive material). It is best to use a thermoplastic adhesive that can be added with a rheological additive to reduce the melting, such as the addition of pyrolytic acid, carbon black, carbon nanotubes, and/or other polymerizations. As a mixed component. On the other hand, the reactive heat-activated viscous adhesive material preferably contains an elastic base polymer and a modified resin, wherein the modified resin contains a viscous secret and/or an active resin. Due to the use of the elastic base polymer, the adhesive layer will have good dimensional stability. Appropriate reactive heat-activated viscous adhesive materials can be selected for all heat-activated viscous adhesive materials known in the prior art, depending on the application. For example, this also includes a reactive heat-activated viscous film based on a nitrile rubber or a derivative thereof (for example, a nitrile butadiene rubber) or a mixture of these basic polymers, and these base polymers further contain an active resin (for example, a phenol resin) ), commercially available tesa 84〇1 is such a product. Due to its high flow viscosity, nitrile rubber provides a good shape stability for heat-activated viscous membranes, so it achieves high adhesion on plastic surfaces after cross-linking. Of course, other reactive heat-activated viscous adhesives can also be used. 31- 201222684, for example, containing viscous polymers [50 to 95% by weight and one or more epoxy resins [5 to 50% ( The adhesive material of the weight percent). The viscous polymer is preferably an acrylic compound and/or a mercapto acrylate compound (having the formula CH^^CiR^KCOOR2) containing 40 to 94% by weight, wherein Ι ^=Η or CH3, R2 = H or a linear or branched alkyl chain having 1 to 30 carbon atoms), 5 to 30% by weight of the first copolymerizable polyethylene monomer, the ethylene monomer having at least An acid group (especially a carboxylic acid and/or a sulfonic acid group and/or a phosphate group), 1 to 10% by weight of a second copolymerizable polyethylene monomer having at least one epoxy group or anhydride a functional group, and a third copolyethylene monomer having a hydrazine to 20% by weight, the ethylene monomer having at least one functional group different from the functional groups of the first ethylene monomer and the second ethylene monomer. This adhesive material is quickly activated and achieves ultimate adhesion in a short period of time 'thus ensuring a stable bond on a non-polarized substrate. 0 Another reactive heat-activated viscous adhesive material that can be used contains 40 Up to 98% by weight of block copolymer (such block copolymer contains acrylic acid vinegar), 2 to 50% by weight of resin component, and 〇 to 10% by weight of hardening component . Resin component One or several kinds of resin, possible resin types include epoxy resin, novolac resin and phenolic resin. The function of the hardening component is to crosslink the resin in the resin component. Because of the strong physical cross-linking in the polymer, the advantage of this formulation is that the adhesive layer can achieve a large total thickness without adversely affecting the bond. Therefore, this adhesive layer is particularly: to compensate for the unevenness of the substrate. In addition, this adhesive material also has excellent 32-201222684 anti-aging properties and low initial degassing characteristics, which is very beneficial for many electronic applications. As previously described, in addition to these particularly advantageous adhesive materials, all other thermally activated adhesive materials may be selected and used in accordance with the actual needs of the application. It is preferable to use a heat-activated viscous adhesive material system package (photoelectric) electronic structure having a water vapor permeability or a low oxygen permeability. Eg EP 〇 674

432 Al, US 2006/0100299 Al, WO 2007/08728 1 A1, DE 10 2009 036 970 A, JP 2005 298 703 A, EP 1 670 292 A, and US 2007 1 35552 A all mention this thermal activation Adhesive materials are known to all skilled artisans. Adhesive material systems that are activated by actinic radiation (eg, UV radiation) are also readily heat activated by the addition of a suitable promoter (eg, peroxide). The WVRT of the adhesive material system is preferably less than 100 g/m 2 d, or most preferably less than 1 〇g/m 2 d ' and/or 〇 TR is preferably less than 8 〇〇〇 cm 3 / claw dbar, less than 3000 cm 3 / m 2 dbar, Or preferably less than 1〇〇cm3/m2dba, the material system preferably contains permeate (for example, oxygen and water scavenging materials, Tian &amp;& u can greatly extend the penetration of the permeate required for penetration Time. For example, a woven object such as the gas-retaining agent described in US 6,936,13 1 (B2), a sound cleaner, and a desiccant can be familiar with the material of the skill familiar to the skilled person. For prostitutes, the way to activate the catch is to use a material that can be heated or mechanically or physically transferred. The so-called heating or mechanical activation refers to the absorbed permeate? The advantage of material, expulsion and/or reaction elimination is that the material can be trapped in the atmosphere of water vapor·33- 201222684. The force is caused by the force (4). Example: If you are in the induction of the permeate: heat =::::= need to make up the needy agent - 偭 plus the firm 1. Right right "If you add force, then another appropriate device that can apply pressure is used as the pressure-filling spoon of the present invention." For example, pneumatic presses or hydraulic presses, or i-types can be used. Cup counters, screw presses, etc. θ / , 々 的 press (such as pressure roller). The pressurizing device can smash a separate unit, and set up at least one as the first - 軚 疋 疋 σ 压 pressure tool Pressurization of the punch element, ^; a punch element also has induction plus crying. It can move the induction field to the area where the soil is not properly soiled,,,,,,,,,,,,,,,,,, The range is limited to the vicinity of the bonding position. [Embodiment] Features and advantages are further described. Among them, the first type of structure of the electronic component 1 is shown in Fig. 1. The 70 piece 1 has a substrate 2, and The electron junction 3 on pure 2. The substrate 2 itself acts as a barrier to the permeate and thus also forms part of the package of the substructure 3. The electronic structure 3 is a cover layer 4' as an additional barrier layer in this example There is a gap between the cover layer 4 and the electronic structure 3 In order to enclose the side of the electronic structure 3 and to bond the cover layer to the electronic zero #1, the planar structure containing at least one heat-activated pressure-sensitive or hot-melt adhesive material 5 is along the substrate 2. The edge of the upper substructure 3 encloses the electronic structure 3. The planar structure "winter energy can be biased to be used to electrically connect the substructures to -4 - 201222684 盍 layer 4, and the substrate 2 is connected Together, as long as the thickness of the planar structure 5 is sufficient, the original spacing of the cover layer 4 from the electronic structure 3 can be maintained. - The planar composition 5 is a thermally soluble adhesive material based on a crosslinked ethylene aromatic block copolymer described in the following examples. The task of the planar composition 5· is not only to connect the substrate 2 and the cover layer 4, but also to form a barrier layer for the permeate to prevent permeate (for example, water vapor and oxygen) from infiltrating into the electronic structure from the side. 3. In the present embodiment, the planar structure 5 is a punched member which is punched out by double-sided tape. The use of such blanks is particularly convenient and does not directly cause damage to electronic components. The second figure shows another construction of the (photoelectric) electronic component i. As shown in Fig. 2, the electronic structure 3 is placed on the substrate 2 and sealed by the substrate 2 from the bottom. Both the upper side and the side of the electronic structure 3 are sealed by the planar structure 5 in a full area. Therefore, the entire upper portion of the electronic structure 3 is sealed by the planar structure 5. Next, a cover layer 4 is provided above the planar structure 5. Since the planar composition has provided a good barrier effect, the cover layer 4 does not have to have a good barrier effect as in the first construction mentioned above. For example, the cover layer 4 may have only mechanical protection, and of course, the cover layer 4 may also have an osmotic barrier function. In the present embodiment, the heating of the planar structure 5 may be performed on the entire adhesive material layer, or only a partial region may be heated, for example, an area where the electronic structure is not covered. FIG. 3 shows another type of (photoelectric) electronic component 1. Construction method. Different from the previous two constructions, the construction of Fig. 3 uses two planar structures 5a' 5b, which in the present embodiment are the same planar components - 35· 201222684 constituents 5a, 5b (But it can also be a different planar composition). The first planar structure 5a covers the entire substrate 2. The electronic structure 3 is placed on the planar structure 5a and fixed by the planar structure 5a. Next, the composite of the planar structure 5a and the electronic structure 3 is entirely covered by the other planar structure 5b, and each surface of the electronic structure 3 is encapsulated by the planar structures 5a, 5b. The same 'in the plane composition is also provided with a cover layer 4. In this element, the 'planar constituents 5 a, 5 b may themselves be heated, or the planar constituent 5a or 5b itself may be heated. In this configuration, neither the substrate 2 nor the cover 4 need to have a barrier effect on the permeate. It is of course also possible to provide the substrate 2 and the cover 4 with a barrier to permeate to prevent penetration of the permeate into the electronic structure 3. ° It should be noted here that Figures 2 and 3 are only schematic views. It is not seen from these that the planar structure 5 is preferably coated with a thickness average thickness. The advantage of uniform coating is that there is no sharp corners at the transition to the electronic structure', but a smooth transition to the electronic structure while retaining the original unfilled and inflated small area. However, if necessary, the planar structure can be completely adhered to the substrate, especially in a vacuum. In addition, since the planar structure is locally compressed by different twists, the difference in thickness at the corners can be reduced to some extent via the flow process. Moreover, for ease of illustration and understanding, the above illustrations are not drawn to the correct scale, especially where the electronic structure is actually very flat and the thickness is typically less than Ιμιη. In all of the above embodiments, the flat structure 5 was made into a tape for -36-201222684. In principle this can be a double-sided tape with a substrate, a heat-activated film, or a substrate-free double-sided tape. This embodiment is a heat activated film. Whether made as a substrateless double-sided tape, a heat-activated film' or coated on a flat composition, the thickness of the 'planar composition' is between Ιμπι and ΒΟμιη, preferably from the claw to 75μηι Between, or preferably between 12 μηη and 50 μιη. If it is desired to increase the adhesion on the substrate and/or to achieve a shock absorbing effect in the (photoelectric) electronic component, a thick planar constituent layer (between 5 〇μπι and 15 〇μηι) can be used. However, the disadvantage of this is that the penetration section will become larger. Smaller thicknesses (between 1μηι and 12μηι) can be I® small penetration cross sections to reduce lateral penetration and total thickness of (optoelectronic) electronic components. However, the disadvantage of this is that it reduces the adhesion on the substrate. The optimum thickness range mentioned above can be at a smaller thickness (so the permeation break 2 is smaller to reduce the lateral penetration) and the larger thickness (to generate enough A good balance between the sticky forces). The ideal thickness is determined by factors such as 70 (photovoltaic) electrons, end applications, and the type of planar composition (and sometimes flat substrates). έ 验 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用= ‘(屯屯) The lifetime of electronic components has a direct effect. Ring two test: measuring the use of (photoelectric) electronic components; life. The very thin (four) layer measured in the nitrogen test deposits a lifetime of -70 parts of electrons. The thickness of the layer is about -37- 201222684 1 OOnm. In order to seal the calcium layer, a frame-like planar composition (edge length of the heat-activated adhesive material: 3〇mm X 3 0mm, rib width 2mm) is used to surround the calcium layer in a nitrogen atmosphere, and is surrounded by a thin glass. A sheet (200 μm, manufacturer: Firma Schott) was used as the cover layer. Heating is then applied to activate the adhesive and compress the adhesive surface at an appropriate pressure (depending on the adhesive material used). After the activation time was over, the composite was continuously pressurized for 30 seconds and then the pressurization device was removed. Since the glass substrate and the glass cover of the tape are not infiltrated, only the penetration through the bonding surface is measured. This test is based on the reaction of calcium with water vapor and oxygen, for example in the following two articles: A G. Eriat et. Al. M7th Annual Technical Conference Proceedings-

Society of Vacuum Coaters,,, 2004, pages 054-659, and Μ. E. Gross et. Al. “46th Annual Technical Conference

Proceedings-Society 〇f Vacuum Coaters», 2003, pages 89-92. The transmittance of the light to the calcium layer is monitored during the test and this transmission becomes larger as the calcium is converted to calcium hydroxide and calcium oxide. When the area of the calcium layer is halved, it is considered that the service life has ended. The measurement environment is 90% relative humidity. Visual and manual inspection Since the soft (photovoltaic) electronic structure was encapsulated between polyester films, the subsequent test was to use a polyester film having a thickness of 1 μm, such as Meiinex 506 manufactured by Jin DuPont Film Co., Ltd. Since the film itself does not have a barrier layer, the life test cannot be performed. Therefore, only the adhesion is visually inspected&apos; and the resulting bond is manually inspected. -38- 201222684 Activating adhesive material adhesive material 1 (pressure sensitive adhesive material): 50 parts Kraton FG 1924 maleic anhydride modified SEBS with 13% block poly 36% diblock and 1% Malay Acid (manufacturer: Kratmi, 50 parts Kraton FG 1901 maleic anhydride modified SEBS, containing 30% block poly without diblock and 1.7% maleic acid (manufacturer: Kraton, 70 parts Escorez 5615 softening temperature 115 °C hydrogenated KW resin (manufacturer 7^^ 25 parts Ondina 917 white oil from paraffin and naphthenic components (manufacturer: 1 part acetamidine------- made pressure from solution) Sensitive adhesive material. Dissolve various ingredients in a stupid (solid content 40%), and apply it on a deuterated release paper at a coating amount of 1.5 g/m2, and then dry at 1 20 ° C for 15 minutes. Finally, a layer of adhesive material with a mass per unit area of 25 g/m2 is produced. The activation of the coordination bond of the aluminum chelate complex is activated, resulting in a significant decrease in viscosity, and the activation temperature is about 120 ° C. Adhesive material 2 (pressure Sensitive Adhesive Material): 100 parts of SiBStar 103T block 30% triblock SiBS (manufacturer: Kaneka) 20 parts of SiBStar 042D block polystyrene content of 15% diblock SiB (manufacturer: Kaneka). A hot-melt adhesive material was prepared from the solution. The various components were dissolved in toluene (solid content 40%) and The coating amount of 1.5 g/m2 is coated on the deuterated release paper, and then dried at 12 ° C for 15 minutes to finally produce a bond of -39 to 201222684 mass per unit area of 25 g/m 2 and/or i3 g/m 2 . The material layer. Therefore, after the release paper is torn off, a film composed of a pure hot-melt adhesive material can be obtained. The activation temperature is about 95 ° C. Adhesive materials 3 to 7 : Thermal activation using several different chemical groups and different thicknesses Adhesive film as other heat-activated adhesive film (see table below), some of which are commercially available heat-activated films (teas SE, Hamburg or Peccell Technologies Inc., Japan). Table 1 shows Other Adhesive Materials Used: Thermally Active Adhesive Film (HAF) No. Chemical Base / Activation Temperature Original Thickness [βη] Commercially available products for ultrasonic thickness [um] Thickness for induction Γ // m] 3 N/P/18 (TC 30 Teas 84 71 25 13 4 PA/90°C 40 Teas 8440 25 13 5 PET/115°C 100 Teas 8464 25 13 6 SR/EP/16 (TC 35 Teas 8865 25 13 7 MI/120°C 50 Peccell PECHM-1 50 — Abbreviation. N/P : Nitrile rubber / phenolic resin PA . Copolyamine PET : Copolyester SR / EP : Synthetic rubber / Epoxy MI : Modified ionomers teas 8 4 7 1 is a kind of gambling rubber / Age-based resin-based thermal cross-linking 糸-40 - 201222684 (thermosetting). Teas 8440 is a copolyamine based thermofusible adhesive (thermoplastic). Teas 8464 is a pure hot melt adhesive (thermoplastic) based on copolyester. Teas 8865 is a nitrile rubber/epoxy based heat exchange system (thermosetting). Adhesive material 8 (pressure-sensitive adhesive material): 25 parts of Oppanol B15 BASF company's polyisobutyl hydrazine, Mw=75_g/m〇i 5 parts Oppanol B100 BASF §] produced polyisotropy, Mw=n_〇 g/m〇i 50 parts Escorez 5615 company produced j temperature i 15t hydrogenated Kw resin 20 parts DCP company produced dicyclodecane dihydroxy oxime dimercapto acrylate, dimethacrylate monomer —1 part DLP : Oxidation ~~— A hot-melt adhesive material is prepared from the solution. The ingredients were dissolved in heptane (solid content 45%) and coated on a deuterated release paper at a coating amount of 15 g/m2, and then dried at 10 (rc for 15 minutes to finally produce a unit area mass of 25 g). /m2 adhesive material layer. The substrate-free double-sided adhesive material is additionally covered with a release paper at a degree of about 120 ° C during storage. The planar composition is made to obtain a thinner film thickness than the commercially available adhesive material. The product may be dissolved in 纟2_丁_ or toluene if necessary, and then coated and dried to form a layer of adhesive material of the desired thickness from the solution. The film is laminated on each surface of the conductive planar structure. The film is called a (four) film having a thickness of 36 as a conductive planar composition for induction heating. The metal film and the adhesive material are in the temperature of TC to not -41-201222684. The layers are laminated together. This process does not produce sufficient viscosity and initiate cross-linking reaction of the thermoplastic film, but only produces an attached effect. The substrate and the cover layer used are made of floating glass with a thickness of 3 mm and an area of 50×50 mm 2 . Use the s Substrate and cover layer used - In addition, a 5〇6 type poly film (thickness 100 μm) produced by Teijin_DuPont_Film Co., Ltd. was used. Execution and results of the method of the present invention: Ultrasonic activation: Ultrasonic machine PS Mpcr manufactured by Hermann Ultraschamechnik +m,,~v rate is 35kH A This machine is the working frequency of sheep 35kHZ, the maximum welding power is 1〇〇〇w. 煜萌,甘am... The ruler uses special titanium carbide to set the pressure; Before the surface activation, the library should be secreted. After the ultrasonic wave is inserted into the ultrasonic machine, continue to apply the sputum # on the anvil. Turn off the overbought pressure for 30 seconds to make the adhesion. Material hardening. -42- 201222684 Table 2 shows the test data and results: Example No. Adhesive material film number substrate / overlay ultrasonic time [S] Ultrasonic power [W] Pressure [MPa] Service life 目 Visual/manual inspection 1 1 Glass/glass 0.5 350 1 434 undamaged, fully bonded 2 1 PET/PET 0.5 350 1 — undamaged, fully bonded 3 2 glass/glass 0.4 350 1 408 undamaged, fully bonded 4 2 PET/PET 0.4 350 1 — not Damage, fully bonded 5 3 glass/glass 0.8 550 3 144 undamaged, fully bonded 6 3 PET/PET 0.8 450 3 — undamaged, fully bonded 7 4 glass/glass 0.5 400 1 45 undamaged, fully bonded 8 4 PET/PET 0.5 400 1 — undamaged, fully bonded 9 5 glass/glass 0.6 400 1 235 undamaged, fully bonded 10 5 PET/PET 0.6 400 1 — undamaged, fully bonded 11 6 glass/glass 0.8 450 1 680 undamaged, fully bonded 12 6 PET/PET 0.8 450 1 — undamaged, fully bonded 13 7 glass/glass 0.6 400 1 139 undamaged, fully bonded 14 7 PET/PET 0.6 400 1 — not affected Damage, fully bonded 15 8 glass/glass 0.6 350 1 380 undamaged, fully bonded 16 8 PET/PET 0.6 350 1 — undamaged, complete adhesion test results show that the method of the invention can produce tightness completely The permeation characteristics of the activated adhesive material system (especially -43-201222684 is the evaporation of water). Conversely, the life of a test specimen that is not completely sealed on a giant view is usually less than one hour. Induction heating Adhesion was carried out using an EW5F type induction device manufactured by IFF GmbH (Ismaning). The inductor that locally generates an alternating magnetic field is a coil of a ferrite core. Fig. 4 shows a side view (not drawn to scale) in a schematic manner: Element symbol 1 1 represents a layer structure for calcium test, and ferrite core 12 is wound by coil 13 . The size of the ferrite core 12 matches the size of the tape. The inductor was buried in a substrate composed of polyetheretherketone (PEEK), and the thus formed configuration was used as a lower punch member of a pressurizing device having an upper punch member. The pressure generated by the force F to vertically press the layer structure between the lower punch member and the upper punch member against the surface of the heat activated viscous planar structure is shown in Table 3. The distance between the bonding gap and the inductor is about 3 mm. The PTFE sheet was placed under the polyester film. An experimental alternating magnetic field (frequency 10 kHz, pulse width 10%) was generated using a modified inductive device. The pulse width represents the percentage of the pulse duration (pulse length) of the alternating magnetic field to the total period duration of the alternating magnetic field (the sum of the pulse duration and the duration between the two front and back pulses). The time during which the thermally activated viscous planar structure is subjected to an alternating magnetic field (i.e., the time of induction heating) is between 0.5 and 2 seconds. After cutting off the magnetic field, continue to apply pressure for 30 seconds to harden the adhesive material. -44- 201222684 Table 3 shows the test data and results: Example No. Adhesive Material Film No. Substrate/Cover Layer Sensing Time [S] Pulse Width [%] Pressure [MPa] Service Life [h] Visual/Manual Inspection 15 1 Glass / Glass 1 10 2 324 undamaged, fully bonded 16 1 PET/PET 1 10 2 — undamaged, fully bonded 17 2 glass/glass 1 10 2 385 undamaged, fully bonded 18 2 PET/PET 1 10 2 — Uncorrupted, fully bonded 19 3 glass/glass 2 10 10 113 undamaged, fully bonded 20 3 PET/PET 2 10 10 slightly deformed adhesive seam, fully bonded 21 4 glass/glass 1 10 2 64 intact, Fully bonded 22 4 PET/PET 1 10 2 — undamaged, fully bonded 23 5 glass/glass 1.5 10 2 201 undamaged, fully bonded 24 5 PET/PET 1.5 10 2 — undamaged, fully bonded 25 6 glass /Glass 2 10 2 587 undamaged, fully bonded 26 6 PET/PET 2 10 2 ~ The adhesive joint area is slightly deformed, and the results of the complete adhesion test show that the method of the present invention can produce the tightness completely by the activation used. Penetration of adhesive material systems The characteristics (especially for water vapor) are determined by the package. Conversely, the life of a test specimen that is not completely sealed on a giant view is usually less than one hour. The temperature in the test plane 6 was measured using a Ti20 type infrared camera manufactured by Fluke Corporation. For this purpose, the cover layer should be removed from the layer structure mentioned above -45-201222684, and the pressurizing device cannot be switched on during the induction time so that the camera can capture one side of the heat-activated viscous planar structure. Change the sensing time. The test results are shown in Table 4: Example No. Adhesive Material Membrane Number Substrate / Covering Layer Induction Time (4) Pulse Width [%1 Pressure [MPal Maximum Temperature m Τ1 6 ΡΕΤΛ 1 10 — — | ^ 1 104 Τ 2 6 PET/- 1.5 10 — 171 Τ3 6 PET/- 2 10 — 264 The temperature measured in this test is also representative of other bonding examples because the materials and dimensions of the susceptor that produces the magnetic field are the same. Execution and results of the comparative example: Heating was carried out using a conventional hot press manufactured by Muhlbauer for comparison. The aluminum top hot pressing tool facing the cover layer has the same shape as the bonding surface for the calcium test. Lower hot left tool 疋 an aluminum plate at room temperature. The pressure of the crucible (which is based on the bonding surface) is introduced via the upper hot pressing tool, and the thermal energy is applied to the lower =I tool by heat conduction before the hot pressing. After the hot pressing time is over, the upper hot pressing tool is briefly opened, and an aluminum plate having a sheet temperature of room temperature is placed, and then pressure is continued for 30 seconds to harden the adhesive material. A heat-activated viscous planar composition of the same thickness (25 μm) is bonded to the ultrasonic wave. • 46- 201222684 Table 4 shows the test data and results: Example No. Adhesive Material Membrane No. Substrate/Cover Thermal Pressure Time Μ Tool Temperature rci Pressure [MPal Lifetime “hi Visual/Manual Inspection VI 1 Glass/Glass 1 250 2 — Uncorrupted, unbonded V2 1 glass/glass 5 250 2 338 undamaged, fully bonded V3 1 PET/PET 1 200 2 -- significantly deformed in the adhesive gap area, unbonded V4 1 PET/PET 5 200 2 ... Significant deformation in the adhesive gap area, fully bonded V5 1 PET/PET 10 160 2 — slightly deformed in the adhesive gap area 'completely bonded V6 3 PET/PET 5 250 10 125 intact, fully bonded V7 3 PET/PET 10 160 10 ~ Slightly deformed in the adhesive gap area, fully bonded, only thermoplastic, because the activation temperature is not reached V8 3 PET/PET 30 180 10 — significant deformation in the adhesive gap area, fully bonded V9 6 glass/glass 1 250 2 — undamaged, unbonded V10 6 glass/glass 5 250 2 432 undamaged, fully bonded VII 6 PET/PET 10 160 2 — slightly deformed in the adhesive gap area, fully bonded comparative test It has been shown that the prior art method can be formed on a polymeric substrate or in a cover layer only if the activation temperature is below 190 ° C (i.e., the temperature at which the polymer film is significantly damaged by the thermal punch). In this case, the bonding time is also much longer than the time required for the present invention. Furthermore, as can be seen from Example 26, the method of the present invention can tolerate the bonding gap due to the short processing time. Short-time overheating that occurs in the range of heat-activated adhesive materials does not cause any damage to the PET film (so-called overheating means heating beyond the temperature that the substrate can withstand). -47- 201222684 [Simple Schematic Description Fig. 1: Schematic diagram of the first construction mode of (photovoltaic) electronic components. Fig. 2: Schematic diagram of the second construction mode of (optoelectronic) electronic components. Fig. 3: The third construction mode of (optoelectronic) electronic components Schematic. [Main component symbol description] 1 (photoelectric) electronic component 2 substrate 3 electronic structure 4 cover layer 5, 5a, 5b planar composition / hot-melt adhesive material layer structure ferrite magnetic Coil 111213-48-

Claims (1)

201222684 VII. Patent application scope: 1. A method for encapsulating electronic components to block penetration, comprising the following steps: preparing a planar composition having at least one heat-activated pressure-sensitive or heat-soluble adhesive material; The substrate comprising the electronic component is such that the planar structure surrounds at least the area to be packaged of the electronic component; - adding a cover layer to the electronic component and at least the adhesive material surrounding the electronic component, wherein the adhesive material is in contact with the cover layer; The area of at least one sub-area of the adhesive material is then thermally activated, thereby forming a composite of at least a substrate and a cover layer; wherein the thermal energy required for thermal activation is self-generated in a planar composition comprising at least the adhesive material. 2. A method of encapsulating electronic components to block penetration, including the following steps: Preparing a planar composition having at least one heat-activated pressure-sensitive or hot-melt adhesive material; - on a substrate carrying/containing electronic components, or on a cover layer for packaging electronic components, making a plane The composition surrounds at least the area to be packaged of the electronic component; - a cover layer for the electronic component coated with the at least the adhesive material surrounding the electronic component, wherein the adhesive material contacts at least the substrate; - then adheres The area of at least one sub-region of the material is thermally activated, thereby forming a composite of at least a substrate and a cover layer; wherein the thermal energy required for thermal activation is self-generated within the planar composition comprising at least the adhesive material. -49- 201222684 3. As for the scope of the patent application, the sound wave passes through the superheat energy in the method of at least the adhesive material. In the plane composition of the material, it is generated by itself. 4. For example, the third part of the patent application is φ, the method, in which the heat is generated by the magnetic induction in the villa to any of the villain and the evening. ^ S has a planar composition of the adhesive material 5. As in the patent application scope of the National Music 4 method, which is salty in at least one stamping tool. The slashing benefit is integrated into 6. The method of inductive addition of the magnetic field in the scope of the aforementioned patent application, wherein the medium frequency rib diagram is used; the frequency is in the middle frequency range of MOHz to 200 kHz, and/or induction The heating time of the heat is from 0.1 second to 10 (7). The method according to any one of the preceding claims, wherein the activating adhesive material is an activating pressure sensitive adhesive material. A method according to at least one of the claims, wherein the iron oxide particles coated with cerium oxide are contained in the planar composition, particularly in the adhesive material of the planar composition. In any one of the methods, wherein the substrate material and/or the cover layer has a permeation barrier to oxygen and water vapor, wherein the permeation resistance is WVRT^U^g/Cm2 d) and/or OTIKlO — km3/ (m2d bar), Or preferably wVRT&lt;l〇-2g/(m2d) and/or 〇TR&lt;l(T2cm3/(m2d). The method of at least one of the preceding claims, wherein the visible light is on the substrate The average transmittance of the material and/or cover layer is at least 7 5 %, or preferably more than 8 5 %. -50- 201222684 11 12 13 14 15 The method of claiming at least one of the patent claims, wherein the mechanical loss factor tan5 of the thermally activated twin adhesive material is greater than 0.1 or preferably; and/or tan5 material · tan § substrate or a value of at least 1 °, as in any one of the claims, wherein the heat-activated adhesive material is at 23 ° C The electrical conductivity is greater than 20 MS/m. The method of any one of the claims, wherein the heat-activated adhesive material has a WVRT of less than 10 μg/m 2 d, or preferably less than 1 μg/m 2 d, And / or 0TR is less than 8 〇〇〇 cm3 /, less than 3 〇〇〇 Cm3 / m2dbar, or preferably less than 100cm3 / m2dbai. The method of any one of the preceding claims, wherein the heat-activated adhesive material contains A material for compensating for a permeate. The planar composition for induction heating of at least one of the preceding claims has at least three non-jw, j-increasing, that is, at least one conductive Layer, at least one heat-activated Material layer, and another layer of adhesive material.