CN103270618A - Method for encapsulating an electronic arrangement - Google Patents
Method for encapsulating an electronic arrangement Download PDFInfo
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- CN103270618A CN103270618A CN2011800495437A CN201180049543A CN103270618A CN 103270618 A CN103270618 A CN 103270618A CN 2011800495437 A CN2011800495437 A CN 2011800495437A CN 201180049543 A CN201180049543 A CN 201180049543A CN 103270618 A CN103270618 A CN 103270618A
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- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229920006132 styrene block copolymer Polymers 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 230000035900 sweating Effects 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000000699 topical effect Effects 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 239000003190 viscoelastic substance Substances 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M17/00—Producing multi-layer textile fabrics
- D06M17/04—Producing multi-layer textile fabrics by applying synthetic resins as adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2265—Oxides; Hydroxides of metals of iron
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
Abstract
The invention relates to a method for encapsulating an electronic arrangement against permeation, in which: a sheet material comprising at least one bonding or hot-melt adhesive mass that can be thermally activated is provided and the sheet material is applied, at least about the region of the electronic arrangement to be encapsulated, to a substrate that supports or encloses the electronic arrangement; a cover is provided for the electronic arrangement and the adhesive mass at least enclosing said electronic arrangement, wherein the adhesive mass is brought into contact with the cover; and the adhesive mass is then thermally activated at least in a sub-region of the surface thereof so that a bond is formed at least to the substrate and the cover, wherein the heat required for activation is substantially generated in the sheet material at least comprising the adhesive mass itself.
Description
Technical field
The present invention relates to the method for encapsulating electronic device.
Background technology
(light) electronic installation is used for commercial product or desire more and more continually and introduces market.This class device comprises organic or the inorganic electronic structure, for example, and organic, organic metal or polymer semiconductor or their combination.According to the application of expectation, these devices and product show as rigidity or flexible form, and wherein the needs for flexible apparatus constantly increase.For example, make this type of device by print process (as letterpress, intaglio printing, silk screen printing or lithographic printing) or so-called " not having the line-at-a-time printing of pressure " (as heat transfer printing (Thermotransferdruck), ink jet printing or digital printed).In many cases, also use vacuum method, for example chemical vapour deposition technique (CVD), physical vaporous deposition (PVD), plasma enhanced chemical or physical deposition method (PECVD), sputtering method, (plasma) etching or vapour deposition coating method (Bedampfung) are wherein generally carried out patterning by mask.
Commercialization or comprise at the example of (light) electronic application that receives publicity aspect its market potential: electrophoresis or electrochromism structure or display, organic or polymer LED in reader or display device (OLED or PLED) or as lighting device, electroluminescent lamp, light-emitting electrochemical cell (LEEC), organic solar batteries (preferred coloring agent or polymer solar battery), (the preferred film solar cell is particularly based on silicon for inorganic solar cell, germanium, copper, those of indium and selenium), the organic field effect transistor, the organic switching element, the organic photoelectric multiplier tube, the organic laser diode, organic or inorganic inductor or based on the RFID transponder of organic substance or inorganic matter.
In organic and/or inorganic (light) person in electronics, especially in organic (light) person in electronics, be that their assemblies of comprising of protection avoid suffering penetrant to damage for what realize that sufficient life-span of (light) electronic installation and function can regard technological challenge as.Penetrant can be various low-molecular-weight organic or inorganic compounds, particularly steam and oxygen.
In the situation of organic and/or inorganic (light) electronic device, especially in the situation of organic (light) electronic device, need flexible adhesives solution (flexible especially
), this flexible adhesives solution constitutes the antiseepage barrier (Permeationsbarriere) to penetrant (such as oxygen and/or steam etc.).In addition, also have many other requirements for these (light) electronic installations.This flexible adhesives solution not only obtains effective adhesiveness between two kinds of base materials, but also to satisfy such as following performance requirement: high shear strength and peel strength, chemical stability, ageing-resistant, highly transparent, processing, and high flexible and pliability easily.
Therefore, prior art a kind of approach commonly used be with electronic installation be placed on can not the permeate water steam and two substrates of oxygen between.Then, seal at the edge.For the inflexibility structure, use glass or metal substrate, they provide high antiseepage barrier but are very responsive to mechanical load.In addition, these substrates make whole device have bigger thickness.In addition, in the situation of metal substrate, there is not the transparency.
On the contrary, for flexible apparatus, use smooth substrate, as transparent or opaque film, this film can have multilayer form.Not only can use the combination of different polymer under this situation, but also can use organic layer or inorganic layer.Use this smooth substrate can access soft structure as thin as a wafer.
For different application, there are various possibility substrate, for example film, woven fabric, nonwoven fabrics and paper or their combination.
In order to obtain effective seal, use specific antiseepage adhesive (BarrierKlebemassen).The good adhesive that is used for sealing (light) electronic building brick has low oxygen permeability, low water vapour permeability particularly, to device have sufficient adhesiveness and can be on device good flow.Device is had low adhesiveness reduced anti-seepage effect at the interface, thereby oxygen and steam are entered, and irrelevant with the character of adhesive.Only when the contact between adhesive and the substrate when being continuous, the character of adhesive is only the decisive factor of the anti-seepage effect of adhesive.
In order to characterize anti-seepage effect (Barrierewirkung), specify OTR oxygen transmission rate OTR and vapor permeability WVTR usually.Described transmitance shows respectively separately, and under the specified conditions of temperature and dividing potential drop and optional other measuring condition (as relative ambient humidity), the Oxygen Flow of pass through film of per unit area and unit interval or steam flow.These values are more low, and the respective material that then is used for encapsulation is more suitable.At this moment, not only based on WVTR or OTR value, and always comprise the explanation (for example, the thickness of material) that the average journey of infiltration is grown or be normalized to specific journey long for the description of infiltration.
Permeability P the measuring for the permeability of gas and/or liquid that be substrate.The low good anti-seepage effect of P value representation.For specific infiltration journey length, dividing potential drop and temperature, under limit, the permeability P of specified material and appointment penetrant is specific value.Permeability P is the product of diffusion term D and solubility item S:
P=D*S
In this application, solubility item S describes the antiseepage adhesive to the affinity of penetrant.For example, under the situation of steam, hydrophobic material obtains low S value.Diffusion term D is penetrant the measuring and directly depend on such as character such as molecular migration rate or free volumes of animal migration in impervious material.In the material of highly cross-linked or highly crystalline, usually obtain lower D value.Yet the material of highly crystalline is not too transparent usually, and higher crosslinked cause flexible lower.Permeability P increases along with the molecular migration rate usually and rises, for example, and when the rising temperature or when exceeding glass transition temperature.
As for the infiltrative influence to steam and oxygen, the method that increases the adhesive anti-seepage effect must be considered this two parameter D and S especially.Except these chemical property, also necessary consideration physical effect is particularly on average permeated the long and interfacial property (flowing property of adhesive, adhesiveness) of journey to infiltrative influence.Desirable antiseepage adhesive has low D value and S value, and base material is had extraordinary adhesiveness.
Low solubility term S is not enough to obtain good barrier properties usually.Particularly, the example of class classics is silicone elastomers.This material extremely hydrophobic (little solubility item), but because its free rotating Si-O key (big diffusion term) has quite little anti-seepage effect to steam and oxygen.Therefore, for good anti-seepage effect, good balance is essential between solubility item S and the diffusion term D.
Up to now, mainly use liquid adhesive and be used for this purpose (WO98/21287A1 based on the adhesive of epoxides; US4,051,195A; US4,552,604A).
Because highly cross-linked, these adhesives have little diffusion term D.Their main use fields are that the edge of rigid mount is bonding, but also are used for the device of medium flexibility.Be cured with heat or by the UV radiation.Cause shrinking owing to solidify, it is bonding to be difficult to be implemented in whole zone, because produce stress between setting up period adhesive and the base material, and stress and then can cause layering (Delaminierung).
The use of these liquid adhesives has brought a series of shortcoming.For example lower-molecular-weight component (VOC-VOC) but the electronic structure of sensitivity in the breaking plant and can hinder preparation manipulation.Adhesive has to be administered on each independent member of device in the mode of complexity.In order to ensure accurate location, need to adopt expensive distributor and permanent plant.And method of application hinders continuous processing fast, because low viscosity, the laminated step that needs subsequently may make that also bed thickness and the bonding width of realizing regulation in narrow limit are more difficult.
In addition, these highly cross-linked adhesives are residual flexible low after solidifying.In low temperature range or in two components system, the use of heat cross-linking system is subject to pot life, and this pot life i.e. process time when gelation takes place.At high temperature range, and particularly in the situation in long reaction time, responsive (light) electronic structure and then limited the possibility of using this system again---adoptable maximum temperature is usually at about 90 ° of C, even also preliminary damage may take place because be higher than this temperature in this (light) electronic structure.Particularly, contain organic electronic element and the flexible apparatus of the complex encapsulation that constitutes with transparent polymer film or by polymer film and inorganic layer has narrow restriction at this.This also is applicable to the laminated step under the high pressure.For the durability that obtains to improve, advantageously abandon elevated temperature heat at this and carry (Hoch temperaturbelastendent) step and under lower pressure, carry out laminated.
Advantageously use contact adhesive or hotmelt to be used for this type of (light) electronic structure of sealing.The use of (for example US2006/0100299A1, WO2007/087281A1, US2005/0227082A1, DE 10 2,008 047 964A, DE 10 2,008 060 113A) known pressure-sensitive adhesives in the prior art.Because especially make the anti-seepage effect of this type of adhesive to be improved by the cross-linking reaction of introducing with applied energy, so preferably use contact adhesive here, its energy (for example photochemical radiation or heat) that after bonding, passes through to apply be activable (US2006/0100299A1, WO2007/087281A1).
Equally, the use of hotmelt also is known in background technology.Often use the copolymer of vinyl, for example ethylene-ethyl acetate copolymer (EEA), ethylene-acrylic acid copolymer (EAA), ethylene-butyl acrylate copolymer (EBA) or ethylene-methyl acrylate copolymer (EMA) at this.Especially for the solar module based on silicon wafer, usually use crosslinked ethane-acetic acid ethyenyl ester (EVA) copolymer.Carry out during the crosslinked seal operation under the temperature that is higher than about 120 ° of C and certain pressure in this case.Because the mechanical load that high temperature or pressure apply, this technology is disadvantageous to many kinds based on organic semiconductor or (light) electronic structure of making in thin layer technology.Yet in JP2002260847, point out that equally this operation is used for Organic Light Emitting Diode.
Other hotmelt based on block copolymer or functional polymer is described in US5, among 488,266A, WO2008/036707A2, WO2003/002684A, JP2008004561A, JP2005298703A and the US2004/0216778A1.Also known for hotmelt, can improve the performance (WO2008/036707A for example of this type of adhesive by the caused cross-linking reaction of energy that for example applies with photochemical radiation or form of heat, WO2003/002684A, JP2005298703A, US2004/0216778A1).
The shortcoming of the pressure-sensitive or hotmelt that uses in the prior art is not have under the crosslinked situation, and anti-seepage effect is lower than epoxide-resin glue, and especially to the barrier properties of oxygen, and the cohesive force of adhesive sharply descends when higher temperature.Therefore, increased structure under heat and the wet condition during the risk of foaming takes place.
Usually with " interior poly-(
) " the expression physical effect, it has the combination (Zusammenhalt) of material or mixture of substances because of intermolecular and/or intramolecular interaction.Therefore cohesive force determined viscosity and the flowability of adhesive, and they can be confirmed as viscosity and anti-shearing time.In order on purpose to improve the interior poly-of adhesive, additionally it is carried out crosslinkedly usually, add (being crosslinkable) component or other chemical cross-linking agents of reaction to adhesive, and/or adhesive stands ionising radiation and is used as reprocessing for this reason.
Usually with " bonding (
) " be expressed as follows physical effect, namely this effect makes two to combine in the intermolecular interaction that occurs owing to the there at the interface of two phases that contact with each other.Bonding thereby influence adhesive adhering on substrate surface, it can be defined as touching viscosity (i.e. so-called " viscosity (Tack) ") and bonding force (Klebraft).In order on purpose to influence the bonding of adhesive, be generally adhesive and add plasticizer and/or bonding force enhancing resin (so-called " tackifier ").
The adhering technique characteristic of adhesive is at first determined by bonding and interior poly-ratio.So employed adhesive is poly-in the height, namely have very strong inside cohesion, this for example uses for some is very important.
On the contrary, when the adhesive heat cross-linking, heat must be by structure towards the adhesive joints transmission.At this, need avoid electricity structure to damage dangerous temperature usually.In addition, restriction treats that the heat input is comparatively difficult on the adhesion area.For example when introducing heat with hot padding by polymer film, short as far as possible in order to make heating time, the temperature that described hot padding will reach in must the specific adhesion seam is high a lot.This not only can damage polymeric layer and when using required impervious barrier usually, and damage electricity structure by the sidepiece hot-fluid.Especially in optional mode, run into the difficulty of partial restriction heat input, wherein, before the joint of adhesive joints, importing heat (for example by infrared radiation or by the convection current of hot gas).
Pressure-sensitive or the hotmelt of crosslinking with radiation exposes possible this defective of electricity structure radiation damage and this defective of necessity of radiation penetrating component structure again.Because assembly, especially organic electronic are learned and many employed polymer are responsive for the UV load usually, so other Additional Protection measures can had, adhere to long open air use under the situation as other coverlays.It can be in UV hardens binding system apply after the UV sclerosis, the increase that this is extra the complexity of manufacturing and the thickness of device.When the difficulty of energy that partial restriction applies also appears at crosslinking with radiation.Though use mask to remedy to some extent, cost is too high technically in produced in series.
At US6, shown the ultrasonic sealing of Organic Light Emitting Diode among 706, the 316B2 by the fusing of low-melting point metal alloy.For this reason, between substrate and covering, inserted metal with as metal wire, and pushed under the situation at ultrasonic impact under 2900 to 14500MPa the extremely high pressure.Because the metallic character of encapsulant must be made very high temperature in adhesive joints.The present invention is with desired high pressure in addition and be not suitable for polymeric material.Glass, metal and pottery have only clearly been described in the text.In addition because the conductivity of encapsulant, must electric insulation layer in structure.
At US6, a kind of similar seal process under the situation of using low-melting glass, metal or liquid crystal polymer (LCP) has been described among 195, the 142B1.It has the shortcoming similar to said method.Handle substrate of glass and glass cover in example, ultrasonic time is longer, is 20 to 30s.At this PET is called possible flexible substrates, covering is then made by steel or glass.Epoxy resin, polyimide resin and other big molecular glue adhesive materials clearly show relatively poor applicability at this.
These two kinds of necessary high temperature of method expose in addition by conducting heat and damage the danger of electricity structure, and described heat transfer is to carry by the high-termal conductivity of substrate or cover stock material in addition.
At US6, among 803, the 245B2, be used for encapsulating electronic device and and the combination of ultrasound that is not used in activated adhesive be known as the substitute of adhesive bond.
Introduced a kind of method for packaging electronic part function assembly in DE10309607A1, wherein, the encapsulation that is installed on the functional unit is combined closely by ultra-sonic welded and substrate.But in the preferred implementation of this method, can the ultra-sonic welded between substrate and packing arrange the material of the ultra-sonic welded of sealing in the past.But preferred, not only substrate, and also encapsulation is made of welding thermoplastic, and they self can be to each other by ultra-sonic welded.The weak point of ultra-sonic welded is that for the typical molecule infiltration (counterdiffusion) of realizing that material is used to weld, as all welding methods, two joints are to carrying out the transition to the melt flows state at its interface.When molecule infiltration should be carried out because of the incompatibility of material, on the joint face of being everlasting, use the welding auxiliary agent.It generally is converted into the melt flows state fully when welding, and can spread mutually with the interface that engages right same molten state at the interface at two.Just in this point, ultra-sonic welded is not distinguished to some extent with other welding methods.Defective is, engages receiving damage at its section or when film is thinner even at its place, gross section at this.This especially occurs in the thin polymer film that uses, is equipped with the inorganic impermeable layer in order to encapsulate, thereby forms the danger of revealing at pad.
Encapsulant among the DE10309607A1 can be chosen from glass solder and adhesive at this, wherein, clearly refers to be epoxy resin when choosing adhesive.Shortcoming during the adhesive of use such as epoxy resin is, is necessary the accurate dosage of adhesive with liquid state or pasty state form, and is necessary to avoid adhesive to run off in ultra-sonic welded.Because when ultra-sonic welded, higher pressure must be set, with in the acoustic energy guiding structure, so almost keep away unavoidably liquid glue is extruded from weld seam.
In addition, encapsulant can be chosen from flexible organic polymer thin film or thermoplastics, and they use as the welding auxiliary agent.At this, than the adhesive of quoting before, engage right compatibility according to encapsulant with two and make a choice, thereby guarantee counterdiffusion.Therefore it has significant limitation.The impaired danger of encapsulating material that preamble had been described appears in addition in the method.
Summary of the invention
The purpose of this invention is to provide a kind of improving one's methods and stop penetrant for encapsulating electronic device, especially can be easily and the steam that passes through fast and oxygen, reach good encapsulation purpose simultaneously.In addition, the life-span of (light) electronic installation should be prolonged by suitable by using, especially flexible adhesive.
This purpose will be by being accomplished as the method for recording and narrating in the independent claims.This method preferred embodiment is the theme of dependent claims.
Correspondingly, the present invention relates to the method that encapsulating electronic device stops penetrant, wherein
Provide the chip architecture that comprises the activable contact adhesive of at least a heat or hotmelt and
Assembling/comprising this chip architecture of Zoned application that need encapsulate around electronic installation at least in the substrate of this electronic installation,
For described electronic installation and the adhesive that surrounds it at least arrange covering, wherein adhesive contacts with covering, and
At least this adhesive of thermal activation on the subregion of adhesive surface has substrate and obducent complex at least thereby form then,
Wherein, activation institute calorific requirement is by self producing in the chip architecture that comprises adhesive at least basically.
Stop in the alternative approach of penetrant that at encapsulating electronic device for this electronic installation arranges covering, this covering surrounds the adhesive of this electronic installation at least, wherein adhesive contacts with covering at least.
In this application, not only be expressed as with described chip architecture double team completely as encapsulation, but also the expression described chip architecture of topical application on (light) electronic installation zone to be packaged, perhaps single face covers or surrounds electronic structure.
Penetrant on the present specification meaning is that those permeablely go into device or assembly, more specifically electronic installation or photoelectron device or the chemical substance (for example atom, ion, molecule etc.) of assembly accordingly, they can specifically cause function destruction in described device or assembly.Casing or shell itself can be for example passed through in this infiltration, also can be by the opening of described casing or shell or by generations such as seam, binding site, pads.Casing or shell are interpreted as referring to surround wholly or in part the assembly of sensing assembly in this meaning, and it also is being intended to except their mechanical functions specifically for the protection of described sensing assembly.
Penetrant on the present specification meaning specifically is low-molecular-weight organic or inorganic compound, for example hydrogen (H
2), oxygen (O especially
2) and water (H
2O).Described penetrant can specifically be the form of gas or steam.
The present invention is according to following beat all cognition, namely be used for adhesive internal pair production heat in the measure that elaborates subsequently for electronic installation without any adverse effect, especially himself heating not worth mentioning or even damage.At this, the background technology of putting down in writing in DE10309607A1 [0008] section for claimed here method, even whole volumes of adhesive all are heated is in order to produce or to consolidate combination.In addition, the package quality method that can pass through to recommend has beat all obvious improvement than traditional heating means.
According in the method for the present invention, heat is favourable being defined on the face that remains on adhesive basically.Because in chip architecture self, produce heat, so only need be heated to activation temperature.And then the method based on heat conduction, radiation or convection current can abandoned is for the necessary temperature gradient of the heat transfer of smoothness and resultant overheated.Thereby heating can be kept within a short period of time, and the strong restrictions side direction hot-fluid on the electronic component direction especially.
Be also advantageous in that in addition, with regard to electronic structure and substrate and covering, and needn't set special measure in order to produce heat, namely contact in order to carry electric current, but it only is implemented in the inner heat that produces of adhesive by the acting in conjunction of adding the contained chip architecture of adhesive and exterior technology measure.
By the known different appropriate mechanical device of prior art, can be implemented in the chip architecture self by them and to produce heat, such as the heating that changes (for example crystallization) by heat-producing chemical reaction or physics mutually, pass through resistance heating, absorption by photochemical radiation, by magnetic induction or since with the interaction of high-frequency electric field, for example microwave radiation.
At this, that chemical reaction and physical phase transition generally do not have is enough (based on volume), and specific heat comes for activation available on the adhesive techniques.The electric conducting material that resistance heating must limit is used as the part (for example embedded conductor or electroconductive binder in adhesive) of chip architecture and contacts for delivery of electric current with the external world.High-frequency heating and microwave heating is essential special suitable material or corresponding special proper adhesive (for example on polyamide or polyvinyl chloride basis) in chip architecture, and they have dielectric loss coefficient that coordinate mutually with frequency, sufficiently high.This has obviously limited to the selection of material.In addition, in microwave heating, be difficult to radiation is limited in the scope to be heated.The danger of damaging electronic installation by microwave is bigger.
Therefore, to produce heat in the chip architecture that contains adhesive at least be particularly advantageous by ultrasonic.For another purposes known Ben Fafa in WO2009/021801A1.
Ultra-sonic welded is a kind of method for the assembling plastics.This can not have corresponding in conjunction with the situation of element under sweating heat thermoplastic plastic only basically.Only when described thermoplastics was enough compatible with each other, it obtained lasting combination.When incompatible or non-thermoplastic material should be bonded to each other, known placement produced the welding auxiliary agent of the combination that material determines, for example bonding between place polymer film.The same with other welding methods, material must activate for example fusing by the energy input in welding or bonding place.When ultra-sonic welded, produce institute's energy requirement by high-frequency mechanical vibration.The principal character of this method is, at part or in the welding auxiliary agent, is created in the required energy of welding in the weld seam by molecule and/or interface friction or vibration.
In the method that this recommends, adopt ultrasonic heated adhesive.With respect to ultra-sonic welded, what heat was less results from the interface at this, but is created in the material self of adhesive by magnetic hysteresis loss basically, promotes it by higher mechanical attenuation coefficient tan δ.
Basically constituted by following assembly at this desired ultrasonic device:
● generator
● vibrational structure (ultrasonic generator)
● anvil (Amboss)
Produce supersonic frequency by generator.It is converted into high pressure and high frequency with line voltage.Electric energy is passed to ultrasonic tr-ansducer by protective wire, i.e. so-called transducer.Generally according to the piezoelectric effect operation, wherein, the crystal that serviceability is clear and definite, described crystal extend in set alternating electric field and shrink transducer.Produce mechanical oscillation thus, it is passed on the supersonic generator (so-called soldering tip) by amplitude part transition.Can influence the size of vibration amplitude by the amplitude part that makes the transition.Vibration usually be passed under 2 to 5MPa the pressure be fixed on supersonic generator and as the workpiece between the anvil of counter pair on wherein, produce the required heat of activation.
Adhesive softens by the rising of local temperature, and mechanical attenuation coefficient rises.The rising of attenuation coefficient causes further producing heat, and this has just guaranteed the effect of self-accelerating reaction.Adhesive is very fast activation in this way according to the present invention, and this causes circulation timei of lacking very much and better economic thus.
Favourable part is in addition, can gem-pure restriction heating on how much, because heating occurs over just on the supersonic generator face in the scope that contacts with compound.
Being bonded in the cooling back solidifies.Because supersonic generator continues to bear ultrasonic vibration, so very high to the requirement of material.In most cases use the titanium of carbide coating.
This method is characterised in that very short ultrasonic time, and is better economic.Therefore preferred ultrasonic time is in 0.1 to 3s scope.
In order to realize short ultrasonic time, favourable is greater than 3W/mm with power setting on the adhesive surface
2
By chip architecture the most at last as the permanent combination between substrate and the covering, in addition can be with arbitrarily, the material that differs from one another mutually combines by these class methods.
Beat allly be, even electronic installation is positioned under the supersonic generator, but do not contact with supersonic generator, the damage of electronic installation also can not occur.For example when and constitute frame shape in conjunction with the supersonic generator face that touches mutually, and when frame mid portion is added to groove in the supersonic generator face, this situation for example just often occurs, thereby the scope that electronic installation is positioned at wherein can not contact when the extruding supersonic generator with supersonic generator.
Avoid mechanical failure in order to protect with the contacted blanket surface of supersonic generator; preferably insert diaphragm (loss film) between covering and supersonic generator, perhaps supersonic generator is from be coated with elastomer or viscoelastic material on its contact-making surface.
For the danger with damaged surfaces keeps as far as possible for a short time, favourable is less than 0.5W/mm with power setting on the adhesive surface
2
On the one hand keep as far as possible for a short time for the danger with damaged surfaces, the ultrasonic time in order to realize lacking as far as possible but then, therefore favourable is 0.5 to 3W/mm with power setting on the adhesive surface
2
Therefore the preferred ultrasonic energy that obtains from ultrasonic time product and used power is 0.05J/mm at adhesive surface
2And 9J/mm
2
In the particularly preferred execution mode of the present invention, ultrasonic energy is introduced on the extensible supersonic generator in a time-continuing process.Known corresponding ultrasonic technique in the scope of ultra-sonic welded.
In addition, particularly advantageously in the chip architecture that comprises adhesive at least, produce heat by magnetic induction.For other purposes known this method in EP1453360A2.
Than ultrasonic heating, induction heating has following advantage, i.e. the heating of chip architecture and do not require chip architecture or covering or substrate in external heat equipment directly and near contact, its enforcement opposite even can touchless.Chip architecture also for example can realize contacting with obducent with substrate according to of the present invention by loose stacked adding thus.Can in a step subsequently, carry out the application of force (compression adhesive joints) in order to form firm also lasting combination.
In addition, the variation that this method is favourable is, inductor is integrated in the compression tool at least, because induction field can be at this very near the bonding place, and can spatially be limited to this.
Different effects can be contributed to some extent to the heating in the alternating magnetic field: when the substrate of putting into alternating field in order to heat has conductive region, will cause eddy current at this regional internal induction by alternating magnetic field.When this zone has when being not equal to zero resistance at this, embody vorticity line path loss consumption in this form with Joule heat (electrical current heat).In order mainly to form this type of eddy current, conductive region then must have minimum dimension; Conductive region is more big, and is just more low from the frequency of the alternating magnetic field of outer setting.
Yet when to introduce matrix in the alternating field in order heating and to have ferromagnetic zone, this regional unit magnet is parallel to outside alternating magnetic field orientation respectively.The magnetic hysteresis loss (core loss) that external magnetic field occurs when changing adds hot basal body equally.According to the material that is incorporated in the alternating magnetic field, two kinds of effects can contribute to jointly the heating (ferromagnetic material such as iron, nickel and cobalt or ferrimag such as dilval (Mu-Metall) and alnico alloy (Alnico)) of matrix or respectively only a kind of in two kinds of effects contribute to heating (when non-ferromagnetic metal such as aluminium only when eddy current or the relatively poor material of conductivity such as ferric oxide particles only hysteresis).
When the cohesible chip architecture of thermal activation during by induction heating and thermal activation, usually use following chip architecture for this reason, be that it contains the bonding adhesive of thermal activation, described adhesive is arranged on the side of conductive layer, as has planar structure, perforated metal foil, the woven wire of metal forming or metallized polymeric film, metal lath, metal felt or the metallic fiber of planar extension.The discontinuous planar structure of the latter has following advantage at this, and namely adhesive can pass each planar structure by opening, and it is bonding totally to improve the inside of chip architecture thus, yet this cost that the efficiency of heating surface reduces just occurred.
In recent years, the induction heating in bonding becomes the focus of concern again.Reason is to begin now to seek available nanoparticle system, for example
(Evonik AG), it can join the material for matrix to be heated, and so realizes the heating on the whole volume of matrix, and therefore its mechanical stability is not caused bigger damage.
Can obtain trade mark from for example Lohmann company is Duplocoll
Adhesive tape, but it contains the nano particle of induction heating in adhesive.Core is
Interaction with magnetic field.
When
When contained adhesive stood faster alternating magnetic field, ferric oxide particles just began vibration---can compare with compass needle.At this autotelic generation heat in adhesive, sclerosis rapidly after the described adhesive.Because further heated components, it has saved valuable heat energy, and production process can obviously be accelerated on the whole.
In principle, the various heaters for induction heating are known; In addition, they can be distinguished according to frequency, and described frequency has the alternating magnetic field that heater was produced with separately.Therefore can realize induction heating under the situation of using magnetic field, the frequency in described magnetic field (is so-called intermediate frequency at about 100Hz to the frequency range of about 200kHz; MF), to the frequency range of about 100MHz, (be so-called high frequency at about 300kHz perhaps; HF).
Yet because the less size of nanoscale system can not make this type of product effectively heat with the frequency in the intermediate frequency range in alternating magnetic field.More precisely require the frequency in the high-frequency range for novel system.Yet just when this frequency, expose the risk that electronic component damages in alternating magnetic field.In addition, forming alternating magnetic field with the frequency in the high-frequency range needs higher equipment cost, and therefore also improper on economy.
Therefore preferably use the frequency in the intermediate frequency range.Beat all is that the organic electronic part self does not bear heating or other damage in described frequency range just.
In order to obtain the desired higher process velocity of industrial manufacture process, the heating time of heat-activatable bonding chip architecture is only very short.Therefore be 0.1 to 10s preferred heating time.
Require as followsly in order to reach required tack temperature, namely select the very high rate of heat addition.Yet when engaging between during the cohesible chip architecture of bonding described thermal activation, it only has lower thermal conductivity, that is to say, thermal conductivity is up to 5W/mK, so the heat that induction produces in chip architecture can not be by its enough fast derivation.Heat more at first rests on a period of time in the adhesive surface, forms thermal chokes thus there.Therefore, chip architecture and bonding to can local overheating, and damage thus.Bonding when having lower equally thermal capacity extraly when than low heat conductivity, risk of overheating is just higher, is because do not provide the possibility of interim heat accumulation like this.The two is for example as follows in bonding centering situation, and namely it has polymer at the adhesive surface place.
Therefore the invention has the advantages that, wherein, but the side cross-section perpendicular to thermal activation bonding sheet structure is basad, chip architecture and obducent pre-complex and induction heating apply simultaneously minimum for 1MPa, especially minimumly be the pressure of 3MPa (extruding force), thereby adhesive contacts with bonded substrate comprehensively." but perpendicular to the side cross-section of thermal activation bonding sheet structure " this direction means at this, bonding for the plane, wherein chip architecture (and two side) is the plane, pressure (main at least) vertically acts on the main extension of chip architecture, opposite, therefore bonding for three-dimensional circular arch, pressure acts on perpendicular on the main bearing of trend of chip architecture, and acts at least in the subregion perpendicular to the side of chip architecture.
Can under the situation of using the general induction heating agent (inductor) that is used for induction heating, implement the inventive method.Consider all routines and suitable device be used as induction heating agent (inductor), i.e. the coil that flows through of alternating current, the conductor loop line, they form the alternating magnetic field of proper strength owing to the electric current that flows through.Therefore, can provide heating required magnetic field intensity by the coil device of the corresponding number of turn and loop length, corresponding electric current flows through described coil device, and it is for example as the some inductor.Can not have electromagnetism nuclear and constitute it, but or the nuclear with iron or compression ferrite powder formation.The bonding magnetic field that can directly stand formation like this.Optionally, also possible certainly, arrange above-mentioned coil device as the main coil on the main face of magnetic field transducer (transformer), inferior coil wants to provide on the face corresponding higher electric current secondarily.Can have the lower number of turn because of higher electric current thus with the real magnet exciting coil of bonding direct close installation, and not reduce the field intensity of alternating magnetic field therefrom.
In addition, the special advantage of induction heating is, pass through the conduction heating of antiseepage film or compared with the ultrasonic heating of machinery, the damage danger of the inorganic impermeable layer of existence in substrate and/or covering significantly becomes littler by thermal pulse very of short duration in the adhesive inside compared with permanent relatively.
Preferably use metal forming, polymer film, composite membrane at present or be provided with the film of organic and/or inorganic layer or the base material that the composite membrane conduct is used for electronic installation.This type of film/composite membrane can be made of all common metal and/or plastics of being used for thin film fabrication, is listed below, and is not limited to this:
Steel, aluminium, copper, polyethylene, polypropylene-especially is by the oriented polypropylene (OPP) of single shaft or biaxial stretch-formed formation, cyclic olefine copolymer (COC), polyvinyl chloride (PVC), polyester-especially PETG (PET) and poly-naphthoic acid glycol ester (PEN), vinyl-vinyl alcohol copolymer (EVOH), Vingon (PVDC), Kynoar (PVDF), polyacrylonitrile (PAN), Merlon (PC), polymethyl methacrylate (PMMA), polyamide (PA), polyether sulfone (PES) or polyimides (PI).
Base material can also make up organic or inorganic coating or layer.This can be undertaken by conventional method such as surface-coated, printing, vapour deposition coating, sputter, coextrusion or lamination.Example includes but not limited to, for example the oxide of silicon and aluminium or nitride, tin indium oxide (ITO) or sol-gel coating.
Particularly preferably, these film/composite membranes (especially polymer film) are provided with the antiseepage barrier to oxygen and steam, and wherein this antiseepage barrier surpasses requirement (WVTR＜10 of packaging field
-1G/ (m
2D); OTR＜10
-1Cm
3/ (m
2D bar), WVTR＜10 especially
-2G/ (m
2D); OTR＜10
-2Cm
3/ (m
2D bar)).
The permeability (WVTR) of the permeability of oxygen (OTR) and steam is determined according to DIN53380Teil3 (OTR) and ASTM F-1249 (WVTR) respectively.Permeability at 23 ° of C and 50% time measurement of relative humidity oxygen.Permeability at 37.5 ° of C and 90% time measurement of relative humidity steam.The result normalizes to the thickness of 50 μ m.
According to method of the present invention just in time for this type of film that is provided with impervious barrier provides following advantage, namely make heat input and thus the damage of possible impervious barrier structure minimize.
This external preferred embodiment in, film/composite membrane can be transparent form, thus the overall structure of such electronic structure also is to be transparent form, perhaps light enters electronic structure at least.Among the present invention, " transparent " refers to be at least 75% at the mean transmissivity of visible-range, preferably is higher than 85% when wavelength is 400 to 800nm, measures according to ASTM D1003.The transparency of substrate or transmitance depend on its extinction coefficient, surface reflection and are used for the employed light wavelength of research.Extinction coefficient is material behavior, and depends on the absorption of material therefor.In order to obtain the higher material of transmissivity, must both avoid absorbing and also avoid reflection.
Reflection occurs on all surface and the material interface.It depends on the surface roughness of material therefor on the one hand, depends on the refractive index of material therefor on the other hand.Extra generation scattering on rough surface.By the Fresnel equation describe at the interface reflection and the correlation between the refractive index of adjacent layer.For relating to transparent material and light beam vertical incidence and can ignoring for this special circumstances of wavelength affects, the Fresnel equation can followingly be simplified:
R=(n
2-n
1)
2/(n
2+n
1)
2 GI.1
Reflection on the R=interface
n
1The refractive index of=media 1
n
2The refractive index of=media 2
Air refraction n
Air≈ 1
Reflect on present all interfaces, and therefore reduce the transmissivity of object.Light beam is also followed the Fresnel reflection law both in inciding film the time when outgoing from film, be n so for example can consider refractive index
2The maximum accessible transmission of=1.6 polyester film is no more than 90 ° value.
Adhesive but also also have carrier thin film preferably transparent not only, and being described below, namely transparent adhesives preferably has the transmitance greater than 60%, especially when wavelength 400 to 800nm the time transmitance greater than 85%, definite according to ASTM D1003.
Usually come given transmitance (also abbreviating transmission sometimes as) with %, refer to luminous power rate on the light transmission matrix back side and the ratio of front incident optical power.Subtract and transmissivity by reflection and absorption.
Just: transmissivity=(1-reflectivity-absorptivity).
Can use identical film or composite membrane to be used as covering in principle, as its operating position in base material.At this, substrate can be different with covering in containing the complex of electronic structure.It is transparent for example often not requiring the two sides of complex, thereby can form the encapsulation of transparent substrates and non-transparent cover.
Because just as described, base material and covering often are made of combination of materials, it can not come combination by welding method (for example ultra-sonic welded, induction welding), so often use the chip architecture of hotmelt or contact adhesive to come for bonding in the prior art.
The present invention gets up the advantage of generation heat and the combination of advantages of adhesive bond in the chip architecture self, wherein, obtain unexpected synergy, such as the extreme of package quality improve and for the situation of using fluid binder or welding auxiliary film material select and the very big simplification of process implementing.Location and the fixation of costliness when especially dispensing the composite bed combination by the use adhesive.
Prepare to comprise the chip architecture/layer material of at least a activable adhesive and contact with substrate or covering subsequently according to the present invention, should also comprise this class methods, wherein activable adhesive is applied on substrate or the covering in the method that constitutes layer, for example is coated with, pushes, spraying or coextrusion.The composite material of the preparation like this that is made of activable adhesive and substrate or covering is for example known to the heat sealing film in the packaging area, and has been used for the sealed electrical minor structure, for example the PECHM-1 film of Japanese Peccel Technologies company.
In the favourable execution mode of the present invention, in the pre-complex of substrate or cover stock material, provide chip architecture.For example substrate and chip architecture can just be combined in the substrate before being applied to electronic installation.Alternatively, covering and chip architecture also can at first be inserted in the pre-complex, and place on the electronic installation afterwards.The method of the pre-complex of the known manufacturing of professional is so can use such as lamination, coating, extruding, spraying or coextrusion.
Especially all suitable constructions common and that have in fact plane form extension can be considered the chip architecture in the application's category.This has realized that the plane is bonding, and different moulding can be arranged, especially flexibly as adhesive foil, adhesive tape, adhesive label or shaping membrane.Chip architecture can constitute the chip architecture of cutting out, and in order to reduce the danger of electronic installation cause thermal damage in heating process, the shape of its shape and adhesive surface is complementary.
In the application's category, chip architecture specifically has both sides, a front and a back side.It is relevant that the concept of front and back is parallel to its two surfaces of mainly extending (surface extension, main extended surface) in this and chip architecture, and only be used for distinguishing these two planes on the opposite face that is installed in chip architecture, and do not determine two spatial arrangements that face is absolute by the selection of concept; Therefore, just formed it spatially during a preposition side when the back side, the front also can be a chip architecture rearmounted side spatially.
The cohesible chip architecture of described thermal activation should be bonding with bonded substrate and covering.For this reason, at least one in its both sides of chip architecture has even preferably all has the cohesible adhesive of thermal activation on the two sides.The bonding adhesive of thermal activation is all adhesives that add heat bonding and the combination that mechanically can bear is provided after cooling under higher temperature.Generally speaking, adhesive exists with the form of adhesive phase.In the simplest situation, chip architecture is made of independent heat-activatable adhesive phase, and is bonding with its two sides and substrate and covering.
The plane of Elementary Function system arranges and is called layer, and its size ratio at (thickness and height) on the direction in space is obviously little on two other directions, and other directions have defined main extension (length and width).Especially when participating in the Elementary Function of layer, this type of layer can be configured compactness or also have perforation, and constitutes by homogenous material or by different materials.Layer can have uniform thickness on extending on its whole plane, perhaps has different thickness.In addition, layer can also have the function more than certainly.
Single layer structure is because its simplification is particularly suitable for ultrasonic heating.In order to carry out ultrasonic heating especially effectively, it is favourable that activable adhesive has greater than 0.1 loss factor tan δ and frequency with 1Hz in the time of 23 ℃.
For fear of self the intrinsic heating when the ultrasonic heating of substrate or covering, under the frequency of 23 ℃ and 1Hz, determine difference
Tan δ
Adhesive-tan δ
Substrate or coveringPreferably be at least 1.
In twisting vibration test, under 23 ℃ and 1Hz frequency, determine for example loss factor of hotmelt of polymer according to DIN53445.
Will be under torque load (dynamic mechanical analysis is determined the loss factor of contact adhesive in DMA) in the oscillatory shear test under the frequency of 23 ℃ and 1Hz.This test is used for the research rheological behavior, and (Pa Er etc. " plastics and elastomeric actual flow sex change ", the VDI version is in 1995,57 to 60 pages and 119 to 127 pages) describe in detail in Pa Er.In the controlled flow graph of the shear rate of Ares company, carry out this test under the torsional load, wherein, use plate diameter to be flat board-flat geometry of 25mm.
The chip architecture of single layer structure also can be used for induction heating.To this, self preferably have conductivity greater than 20MS/m at 23 ℃ of activable adhesives, this almost is inaccessiable for self conductive polymer, but can reach under the situation of filled conductive filler.When 23 ℃ and 50% relative air humidity, determine conductivity according to ASTM D2739-97.Optional or additionally, can by add particle, especially above-mentioned nano particle be designed to ferromagnetism, ferrimagnetism or paramagnetism with adhesive.
Advantageously, have at least three different layers, i.e. at least one conductive layer and bonding adhesive phase and another adhesive phases of at least one thermal activation for induction heating according to chip architecture of the present invention.Described another adhesive phase can be identical or different with it with the bonding adhesive of described at least one thermal activation.Thereby another adhesive phase for example can comprise the bonding adhesive of thermal activation or even comprise not heat-activatable contact adhesive.
Can constitute at least one conductive layer suitably according to wish in principle, for example as layer (for example as grid) thin comprehensive compactness or perforation.Preferably, the bed thickness of conductive layer is less than 50 μ m, especially less than 20 μ m or even less than 10 μ m.The latter makes in simple relatively mode upwards restriction of the rate of heat addition.
Conductive layer can be made of all common suitable materials, for example is made of aluminium, copper, gold, nickel, dilval, alnico alloy, permalloy, ferrite, carbon nano-tube, Graphene and similar material.Conductive layer preferably also additionally is magnetic, especially ferromagnetism or paramagnetism at this.Conductive layer (is equivalent to than resistance less than 50m Ω mm in the conductivity that this advantageously has greater than 20MS/m
2/ m), especially the conductivity greater than 40MS/m (is equivalent to than resistance less than 25m Ω mm
2/ m), determine at 300K respectively.
Except described at least one conductive layer, chip architecture can also have other conductive layer certainly; They can be identical with described at least one conductive layer or different with it.
The cohesible chip architecture of thermal activation can present any appropriate moulding generally.So chip architecture can have other layer, for example permanent carrier or temporary transient carriers except aforementioned layers.
In order to reach enough bonding strengths when the less thickness, adhesive phase advantageously can have the thickness of 5 μ m to 20 μ m.On the contrary, for firm especially adhesive bond, that thickness is favourable is 100 to 500 μ m.
Basically can use the bonding adhesive composition of all common thermal activations to be used as the bonding adhesive of described at least a thermal activation.The bonding adhesive of thermal activation can be divided into two classes basically: the adhesive (hotmelt) that thermoplastic heat activated is bonding and the bonding adhesive (reacting adhesive) of reaction heat activation.This division also comprises following adhesive, and it can be summarized as above-mentioned two kinds, namely reacts the bonding adhesive of thermoplastic heat activated (reaction heat melt adhesive).
Thermoplastic adhesives are based on following polymer, and it is reversible softening when heating, and solidify again in cooling.In contrast, the bonding adhesive of reaction heat activation contains reactive ingredients.Latter's component is called as " reaction resin ", wherein causes cross-linking process by heating, also can guarantee continual and steady combination even if it finishes the back in cross-linking reaction when bearing pressure.These type of thermoplastic adhesives preferably also contain elastomeric component, for example artificial synthetic nitrile rubber.Even if this type of elastomeric component also gives the bonding adhesive of thermal activation very high dimensional stability under pressure because of its higher kinematic viscosity.
Subsequently will the pure exemplary typical system of introducing the bonding adhesive of some thermal activations, its with context of the present invention in indicate very favorable one side.
The bonding adhesive of thermoplastic thermal activation contains thermoplastic base polymer.It has had the good mobility energy under lower pressure, thereby final bonding force very important for the fastness of durable adhesion can be set in short extrusion time, and therefore can also carry out quick-binding on bases coarse or other keys.Can use all thermoplastic adhesives known in the prior art to be used as the bonding adhesive of described thermoplastic thermal activation.
For example be suitable for as those the heat-activatable adhesives described in the DE102006042816A1, but be not limited to wherein description.
Exemplary composition has been described in EP1475424A1.So thermoplastic adhesives can comprise one or more following components or be made up of them: polyolefin, ethylene-vinyl acetate-copolymer, ethylene-propylene acetoacetic ester-copolymer, polyamide, polyester, polyurethane or butadiene-styrene-block copolymer.The preferred thermoplastic adhesives of in EP1475424A1 [0027] section, mentioning that use.Described other thermoplastic adhesives in EP1956063A2, it is particularly useful for special application, for example is particularly suitable for the bonding bonded substrate that is made of glass.The following thermoplastic adhesives of preferred use improve its melt viscosity by rheologic additive, for example by adding pyrolysis silicic acid, carbon black, carbon nano-tube and/or other polymer as the blending component.
On the contrary, the bonding adhesive of reactive thermal activation advantageously has elastomer class base polymer and modified resin, and wherein said modified resin comprises binder resin and/or reaction resin.Owing to used elastomer class base polymer can access the adhesive layer that has high dimensional stability.Can use the bonding adhesive of all thermal activations well known in the prior art as the bonding adhesive of reactive thermal activation corresponding to concrete separately application.
It for example also comprises the bonding film of reactive thermal activation based on the base polymer of nitrile rubber or derivatives thereof such as acrylonitrile-butadiene rubber or the mixture of these base polymers (blend), and it is extra contains reaction resin such as phenolic resins; Can buy this series products with title tesa8401.The bonding film that nitrile rubber is given thermal activation owing to its higher kinematic viscosity thus, can be realized higher bonding force at frosting with outstanding dimensional stability after implementing cross-linking reaction.
Certainly can also use the bonding adhesive of other reaction heat activation, as following adhesive: but its adhesive polymer and mass fraction of comprising that mass fraction is 50 to 95 weight % are the epoxy resin of 5 to 50 weight % or the mixture of multiple epoxy resin.But adhesive polymer is CH at this favourable acyclic compound that comprises 40 to 94% weight % and/or general formula
2=C (R
1) (COOR
2) methacrylic compound (R
1Expression here is selected from H and CH
3Residue, and R
2Expression here is selected from the residue of alkyl chain of 1 to 30 carbon atom of H and straight or branched), but the vinyl monomer of first copolymerization of 5 to 30 weight %, it has acid groups at least, especially carboxylic acid group and/or sulfonic group and/or phosphate, but the vinyl monomer of second copolymerization of 1 to 10 weight %, it has epoxides or anhydride-functional at least, but and the vinyl monomer of the 3rd copolymerization of 0 to 20 weight %, it has a functional group at least, but but itself and the functional group of the vinyl monomer of first copolymerization and different with the functional group of the vinyl monomer of second copolymerization.This type of adhesive has been realized bonding with fast activating wherein just having reached final bonding force within a short period of time, has guaranteed whole higher strong bonded at the bottom of the nonpolar group thus.
The block copolymer that contains acrylate that another provides the bonding adhesive of applicable reaction heat activation of special advantage to comprise 40 to 98 weight %, the curing agent component of the resinous principle of 2 to 50 weight % and 0 to 10 weight %.Resinous principle contains and is selected from one or more following resins: the epoxy resin, linear phenol-aldehyde resin (Novolakharze) and the phenolic resins that promote bonding force (tackify).Using curing agent component is in order to make the resin crosslinks of resinous principle formation.This type of saying can access the adhesive phase that has big integral thickness owing to its physical crosslinking stronger in polymer has following special benefits, and in the bonding load-bearing capacity of this not whole damage.Adhesive phase is very suitable for compensating the out-of-flatness in the substrate thus.In addition, this type of adhesive has good resistance to ag(e)ing and lower exhaust phenomenon, and this is very favorable in many electronics regions bonding.
As previously mentioned, yet except particularly advantageous adhesive, in principle can also be at choosing and use the bonding adhesive of every other thermal activation for bonding desired character separately (Profil).
Preferred steam or the lower bonding adhesive system of thermal activation of oxygen permeability of using comes for encapsulation (light) electronic structure.For example this type of activatable adhesive is known in EP0674432A1, US2006/0100299A1, WO2007/087281A1, DE102009036970A, JP2005298703A, EP1670292A and US2007135552A.It is known to those skilled in the art that namely when adding corresponding initator at this, for example during peroxide, can activate binding system also by actinic radiation for example by UV radiation calorifics activation easily.
Preferably, adhesive composition has less than 100g/m
2D is especially less than 10g/m
2The WVTR of d and/or less than 8000cm
3/ m
2D bar is especially less than 3000cm
3/ m
2D bar and very especially less than 100cm
3/ m
2The OTR of d bar.
Preferably, because can obviously prolong the time of break-through of penetrant by adhesive joints at this, so adhesive system is equipped with the capture material for penetrant (for example oxygen, steam).For the professional, for example at US6, described in 936,131 (B2) like that, known these materials under the title of Getter, Scavenger or Desiccant.
Very particularly preferably use catch characteristic through the capture material of calorifics or mechanical activation (
).Calorifics activation or mechanical activation for example are interpreted as chemistry or physical conversion at this, and the destruction of sheathing material or the penetrant that will receive discharge and/or discharge.Its advantage is as follows, namely can contain the described capture material of processing under the air ambient of steam, and not limit it basically to catching the carrying capacity of penetrant in final structure.For example obtain the catcher of micropackaging.
Situation for apply extruding force to complex in induction heating requires extra extrusion equipment for this reason.All equipment that are suitable for pushing can both be as described extrusion equipment, the extruder of discontinuous work for example, as pneumatic extruder or hydraulic press, eccentric extruder, crank-type extrusion press (Kurbelpresse), curved bar structures extruder (Kniehebelpresse), screw extruder or similar extruder, the perhaps extrusion equipment of continuous operation is as compression roller.Described equipment can be made as separate unit, perhaps be combined existence with inductor.The following equipment of preferred use, it contains at least one pressure ram element as first compression tool, and described pressure ram element has the induction heating means in addition.Can make induction field very near the bond locations for the treatment of combination thus, and therefore also spatially limit the plane of bond locations.
Description of drawings
Be described more specifically other details of the present invention, purpose, feature and advantage below with reference to preferred illustrative embodiments.In the accompanying drawings:
Fig. 1 shows the schematic diagram of first (light) electronic installation.
Fig. 2 shows the schematic diagram of second (light) electronic installation.
Fig. 3 shows the schematic diagram of the 3rd (light) electronic installation.
Embodiment
Fig. 1 shows first execution mode of (light) electronic installation 1.This device 1 has substrate 2, arranging electronic structure 3 in this substrate.Substrate 2 itself is designed to the barrier form of penetrant and forms the part of the encapsulation of electronic structure 3 thus.Other covering 4 that shows as the barrier form be arranged in electronic structure 3 above, in this example, also have space length therebetween.
In addition, for packaging electronic structure 3 from the side and simultaneously covering 4 is combined with the remainder of electronic installation 1, provide hotmelt 5 at the periphery of substrate 2 upper edge electronic structures 3.Chip architecture 5 is with covering 4 and substrate 2 combinations.In addition, by the structure of suitable thickness, chip architecture 5 can also make covering 4 and electronic structure 3 separate.
In addition, in this example, chip architecture 5 also provides with the die-cut form that comprises two-sided tape.Can use especially simply for this die-cut.
Fig. 2 shows the alternative embodiments of (light) electronic installation 1.Show again electronic structure 3 be arranged in above the substrate 2 and by substrate 2 from following encapsulation.Chip architecture 5 now is arranged in above the electronic structure 3 and on the whole zone of side.Therefore, electronic structure 3 is encapsulated by chip architecture 5 at these points.Then covering 4 is applied to chip architecture 5.Opposite with aforementioned embodiments, described covering 4 does not need to satisfy high antiseepage requirement, because chip architecture itself provides barrier.For example, covering 4 is only brought into play the mechanical protection effect, and perhaps form that also can the antiseepage barrier additionally provides.In this device, the heating of chip architecture 5 not only can comprise whole adhesive phase, and alternatively, can comprise only part surface, for example the zone of overlay electronic structure not.
Fig. 3 shows another alternative embodiments of (light) electronic installation 1.Opposite with aforementioned embodiments, now disposed two kinds of chip architecture 5a and 5b, they show as identical form in this example.The first chip architecture 5a is arranged on the whole zone of substrate 2.Then electronic structure 3 is provided on the chip architecture 5a, described electronic structure is fixed by chip architecture 5a.The assembly that will comprise chip architecture 5a and electronic structure 3 is then covered by another chip architecture 5b on whole zone, and electronic structure 3 is encapsulated by chip architecture 5a or 5b at all faces as a result.Then, again covering 4 is provided on the chip architecture 5b.Alternately, in this device, chip architecture 5a or 5b or the two can intrinsicly heat.
Therefore, in this execution mode, substrate 2 and covering 4 all must not have barrier properties.Yet, in order further to limit penetrant to the infiltration of electronic structure 3, also can dispose them and have barrier properties.
For Fig. 2,3, must paying special attention in this application, these figure are schematic diagrames.Particularly, can not find out obviously from figure that chip architecture 5 applies with uniform layer thickness herein and preferably in each case.Therefore, at the electronic structure transition position, do not have to form the sharp edges as seeming among the figure to exist, this transition is smooth and zone that may keep little unfilled or gas filling on the contrary.Yet, if suitable, also can transform substrate, when particularly under vacuum, applying.In addition, chip architecture is compressed in various degree by the part, therefore because flow process can carry out some compensation to the difference in height at marginal texture place.In addition, illustrated dimension is not drawn in proportion, and only in order to be easier to expression.Particularly, electronic structure itself is usually expressed as the design (thickness is often less than 1 μ m) of relatively flat.
In the illustrative embodiments shown in all, use chip architecture 5 with the form of adhesive tape.In principle, it can be the two-sided tape with carrier, heat-activatable film or transfering belt.Select the scheme of heat-activatable film in this application.
Thickness with the form of transfering belt, the chip architecture that exists with the form of heat-activatable film or in the mode that is coated on the planar structure is preferably about 1 μ m to about 150 μ m, more preferably about 5 μ m are to about 75 μ m, and especially preferably approximately 12 μ m to about 50 μ m.When purpose is when obtaining adhesiveness that substrate is improved and/or the damping in (light) electronic structure, adopt the high bed thickness of 50 μ m～150 μ m.Yet the shortcoming of this moment is that the infiltration cross section increases.The low bed thickness of 1 μ m～12 μ m has reduced the infiltration cross section, and then has reduced horizontal infiltration, and the integral thickness of (light) electronic structure.Yet this moment, the adhesiveness to base material also reduced.In particularly preferred thickness range, between the composition film of low composition thickness (produce low infiltration cross section thus, reduced infiltration) and adequate thickness (produce enough bonding), exist good compromise.The character of optimum thickness and (light) electronic structure, final application, chip architecture execution mode, and flat base (if possible) is relevant.
Test method
Life test:
But will be defined as the characteristic value of target bonding quality for the potting degree of the bonding sheet structure of different thermal activations and distinct methods parameter.The tightness of encapsulation directly acts on the life-span of (light) electronic structure.
Adopt CAL (Calciumtest) measuring as (light) the electronic structure life-span.For this reason, under nitrogen atmosphere, will be of a size of 10x10mm
2Thin calcium be deposited upon on the glass plate (substrate).The thickness of calcium layer is approximately 100nm.Placing the length of side around the calcium mirror equally under nitrogen atmosphere for the encapsulation of calcium layer is that the gap width (Stegbreit) of 30mm * 30mm and heat-activatable adhesive is the shaped as frame chip architecture of 2mm, and (200 μ m, Schott company) is set to covering with thin glass sheet.Adhesive calorifics activation subsequently, wherein adhesive surface compresses with different pressure according to selected adhesive.After soak time carries out, also will continue to press 30 seconds, and after remove extrusion equipment.Because the glass cover of non-permeability glass substrate and adhesive tape is only determined infiltration by adhesive surface.
This test is based on the reaction of calcium and steam and oxygen, for example at following document: people such as A.G.Erlat are at " 47th Annual Technical Conference Proceedings-Society of Vacuum Coaters ", 2004, in the 654-659 page or leaf, with people such as M.E.Gross at " 46th Annual Technical Conference Proceedings-Society of Vacuum Coaters ", describe in 2003, the 89-92 page or leaf.The light transmittance of monitoring calcium layer, this light transmittance is converted into calcium hydroxide because of the calcium layer and calcium oxide increases.Half time that will reach the transmission of the corresponding testing equipment that does not have the calcium mirror is called the life-span.Select 60 ℃ and 90% relative air humidity as test condition.
Vision and manual operation evaluation
Because especially Rou Ruan (light) electronic structure is encapsulated between the polyester film of modification, after experiment in used thickness be the polyester film of 100 μ m, the Melinex506 film of Teijin-DuPont-Films company for example.Because film self does not have the antiseepage barrier layer, therefore can not carry out life test.Thereby only estimate bonding by vision, and manual test is bonding on the formation state of combination.
Employed activatable adhesive
Adhesive 1 (contact adhesive):
50 parts of Kraton FG1924 contain the maleic anhydride modified SEBS of 13 weight % block polystyrene, 36 weight % diblocks and 1 weight % maleic acid, from Kraton
50 parts of Kraton FG1901 contain 30 weight % block polystyrene, no diblock and contain the maleic anhydride modified SEBS of 1.7 weight % maleic acids, Kraton
The hydrogenation KW resin of 115 ° of C of 70 parts of Escorez5615 softening points is from Exxon
25 parts of white oils that Ondina917 is made up of paraffin distillate and cycloalkyl cut (parafinic and naphthenic fraction) are from Shell
1 part of acetopyruvic acid aluminium
By the formulations prepared from solutions contact adhesive.For this reason, with each independent components dissolved (solid content is 40%) in toluene, be applied to 1.5g/m
2The silication barrier paper on, and dry 15 minutes of 120 ° of C, so obtaining weight per unit area was 25g/m
2Adhesive phase.When depositing, cover on the transfering adhesive with another barrier paper.Activate by the coordinate bond of disintegrating aluminium chelate compound, viscosity acutely descends thus, and activation temperature is about 120 ℃.
Adhesive 2 (hotmelt):
100 parts of SiBStar103T contain three block SiBS of 30 weight % block polystyrene, from Kaneka company
20 parts of SiBStar042D contain the diblock SiB of 15 weight % block polystyrene, from Kaneka company
By the formulations prepared from solutions hotmelt.For this reason, with each independent components dissolved (solid content is 40%) in toluene, be applied to 1.5g/m
2The silication barrier paper on, and dry 15 minutes of 120 ° of C, so obtaining weight per unit area was 25g/m
2Or 13g/m
2Adhesive phase.So after removing barrier paper, can access the film that pure hot melt material constitutes.Activation temperature is about 95 ℃.
The heat-activatable binder film of the different bed thickness on the use different chemical basis is used as other heat-activatable adhesive (seeing Table).At this, a part may be relevant with commercially available heat-activatable film (the Peccell Technologies Inc. of the tesa SE in hamburger or Japan).
Following table 1 has shown other employed adhesives:
Abbreviation:
N/P: nitrile rubber (Nitrilkautschuk)/phenolic resins (Phenolharz)
PA: copolyamide
PET: copolymerization fat
SR/EP: synthetic rubber/epoxy resin
MI: the ionomer of modification
Tesa8471 is based on the heat cross-linking system of nitrile rubber/phenolic resins (" thermosetting ").
Tesa8440 is based on the pure hotmelt (thermoplastics) of copolyamide.
Tesa8464 is based on the pure hotmelt (thermoplastics) of copolymerization fat.
Tesa8865 is based on the heat cross-linking system of nitrile rubber/epoxy resin (" thermosetting ").
Adhesive 8 (contact adhesive):
25 parts of Oppanol B15 polyisobutene, BASF AG, M
w=75,000g/mol
5 parts of Oppanol B100 polyisobutene, BASF AG, M
w=1,100,000g/mol
The hydrogenation KW resin of 115 ° of C of 50 parts of Escorez5615 softening points, Exxon company
20 parts of DCP dimethacrylate dicyclo dodecane-diformazan alcohol esters, the dimethylacrylate monomer is from Sigma-Aldrich company
1 part of two dodecane acyl group of DLP peroxidating
By the formulations prepared from solutions contact adhesive.For this reason, with each independent components dissolved (solid content is 45%) in heptane, be applied to 1.5g/m
2The silication barrier paper on, and dry 15 minutes of 100 ° of C, so obtaining weight per unit area was 25g/m
2Adhesive phase.When depositing, cover on the transfering adhesive with another barrier paper.Activation temperature is about 120 ℃.
The manufacturing of chip architecture
In order to obtain being thinner than the bed thickness of commercially available adhesive, may under the situation thicker product be dissolved in 2-butanone or the toluene, and from solution by the floating and dry adhesive phase that obtains necessary thickness.For the thickness that the manufacturing chip architecture is selected is seen above table.
Laminate thickness is the film of 13 μ m on each face of conducting strip structure for induction heating.Use the thick aluminium foil of 36 μ m as the conducting strip structure that is used for induction heating.Metal forming and adhesive phase are in about 90 ℃ to 110 ℃ temperature laminated together.At this, thermoplastic film viscosity is enough, and chemical crosslink reaction does not take place, and adheres to but only cause.
Employed substrate and covering
For life test, used thickness is the float glass sheet of 3mm and is of a size of 50 * 50mm
2As substrate with as covering.
In addition, used thickness is the polyester film of Melinex506 type of the Teijin-DuPont-Films company of 100 μ m.
The enforcement of the inventive method and result
Implement bonding with using PS MPC (+) the numerical control ultrasonic device of Hermann Ultraschalltechnik company.This equipment is worked under 35kHz, and maximum weld efficient is 1000W.Use specific titanium carbide Sonotroden (sonotrode), it has the shape for the adhesive surface of CAL.Introduce given pressure (with respect to adhesive surface) and ultrasonic wave with this sonotrode.Sample was mechanically anchored on the anvil (Ambo β) in the past at ultrasonic activation.In order to realize the curing of sticky matter, after closing, also continued ultrasonic wave to keep-up pressure 30 seconds.
Table 2 has clearly shown test and result thereof:
Test has shown and can only determine its tightness by the used Penetration Signature (especially for steam) that activates binding system with the inventive method manufacturing and encapsulation.By adhesive bonding method, the sample that can not seal fully on the macroscopic view generally demonstrates on the contrary and is lower than 1 hour life-span.
Induction heating
The EW5F type sensing apparatus through adjusting by IFF GmbH company (Ismaning) is implemented adhesive bonding method.To equip the coil of ferrite nuclear core as the local inductor that alternating magnetic field is provided here.Fig. 4 (not in scale) signal in end view has shown this device:
Wherein, the 11st, for the layer structure of CAL, and 12 are ferrite nuclear cores, it is twined by coil 13.The size of ferrite nuclear core 12 and adhesive tape element coupling.
Inductor is inserted in the matrix that polyether-ether-ketone (PEEK) constitutes, and the device that will so obtain uses as the following pressure ram element of extrusion equipment, it also possesses last pressure ram element in addition.Extruding force is presented at respectively in the table 3 based on power F, but wherein downwards the layer structure between pressure ram element and the last pressure ram element provide this power F perpendicular to the side of thermal activation bonding sheet structure.The spacing of adhesive joints and inductor is respectively about 3mm.In polyester film correspondingly with PTFE plate pad below.
By the induction installation through adjusting, the pulse duration manufacturing frequency with 10% is that the alternating magnetic field of 10kHz is used for research.The pulse duration (pulse length) that pulse duration has provided alternating magnetic field accounts for the percentage of the whole Cycle Length (pulse duration and two face the duration sum of suspending between the pulse mutually) of alternating magnetic field.
But thermal activation bonding sheet structure stands the time (being the time of induction heating) of pulse alternating magnetic field in 0.5 to 2s scope.Pressure still continues to keep 30s after magnetic field is closed, with cure adhesive.
Table 3 is summarized and has been shown experiment and result thereof:
Test has shown and can only determine its tightness by the used Penetration Signature (especially for steam) that activates binding system with the inventive method manufacturing and encapsulation.By this adhesive bonding method, the sample that can not seal fully on the macroscopic view generally demonstrates the life-span that is lower than 1h on the contrary.
Determine in chip architecture corresponding to testing 6 temperature that occur by the Ti20 type infrared camera of Fluke company.To this, in the aforementioned layers combination, dismantle, and in the sensitive time, do not close extrusion equipment, thereby a side of thermal activation bonding sheet is visible for camera.Sensitive time is variable.The results are shown in Table 4:
Determined temperature also is representational for other embodiment are bonding, is identical in material and size respectively because be used for the receptor in magnetic field.
The enforcement of control methods and result:
In order to compare, implement heating by the conventional hot-press machine of M ü hlbauer company.The top that use is made of aluminium (in the face of covering) hot-pressing tool, it has the shape for the adhesive surface of CAL.Use possesses the aluminium sheet of room temperature as the below instrument.Introduce setting pressure (with respect to adhesive surface) with the top compression tool, and conduct to introduce heat by heat.Sample is below being mechanically fixed in before the hot pressing on the instrument.With heated instrument above the of short duration unlatching, the aluminium sheet that will be present in room temperature adds therebetween, and afterwards pressure is continued to keep 30s, is used for cure adhesive after hot pressing time finishes.
With using the bonding sheet structure of thermal activation, corresponding to the thickness (25 μ m) that is used for ultrasonic bonds.
Table 4 is summarized and has been shown experiment and result thereof:
Contrast test demonstrates, and only works as activation temperature below 170 ℃ temperature, namely under the temperature by hot padding apparent damage polymer film, can form encapsulation on polymeric substrates or with polymeric cover with the method for prior art.In this case, bonding in order to form, need be than the inventive method longer time basically.That the inventive method also stands within adhesive joints is of short duration, because be limited to overheated (that is to say and exceed the heat that for substrate, surpasses withstand temperature) of activatable adhesive basically than the weakness reason time, but the PET film be there is no (embodiment 26) of obvious damage.
Claims (15)
1. encapsulating electronic device stops the method for penetrant, wherein
Provide the chip architecture that comprises the activable contact adhesive of at least a heat or hotmelt and
Assembling/comprising this chip architecture of Zoned application that need encapsulate around electronic installation at least in the substrate of this electronic installation,
For described electronic installation and the adhesive that surrounds it at least arrange covering, wherein adhesive contacts with covering, and
At least this adhesive of thermal activation on the subregion of adhesive surface has substrate and obducent complex at least thereby form then,
Wherein, activation institute calorific requirement is by self producing in the chip architecture that comprises adhesive at least basically.
2. encapsulating electronic device stops the method for penetrant, wherein
Provide the chip architecture that comprises the activable contact adhesive of at least a heat or hotmelt and
Assembling/comprising in the substrate of this electronic installation or be provided with this chip architecture of Zoned application that need encapsulate around electronic installation at least on the covering of encapsulating electronic device,
For this electronic installation arranges covering, this covering surrounds the adhesive of this electronic installation at least, and wherein adhesive contacts with covering at least, and
At least this adhesive of thermal activation on the subregion of adhesive surface has substrate and obducent complex at least thereby form then,
Wherein, activation institute calorific requirement is by self producing in the chip architecture that comprises adhesive at least basically.
3. method according to claim 1 and 2 is characterized in that, described heat produces by ultrasonic wave in the chip architecture that comprises adhesive at least.
4. according at least one described method in the claim 1 to 3, it is characterized in that described heat produces by magnetic induction in the chip architecture that comprises adhesive at least.
5. method according to claim 4 is characterized in that, inductor is integrated at least one compression tool.
6. according at least one described method in the aforementioned claim, it is characterized in that realize induction heating under the situation of using magnetic field, its frequency is arranged in the intermediate frequency range of 100Hz to 200kHz, and/or use and be used for heating time of 0.1 to 10s induction heating.
7. according at least one described method in the aforementioned claim, it is characterized in that described activatable adhesive is activable contact adhesive.
8. according at least one described method in the aforementioned claim, it is characterized in that, in chip architecture, especially in the adhesive of chip architecture, have a ferric oxide particles that is wrapped up by silicon dioxide.
9. according at least one described method in the aforementioned claim, it is characterized in that base material and/or covering are provided with the antiseepage shielding at oxygen and steam, wherein, described antiseepage shielding has less than 10
-1G/ (m
2D) WVTR and/or less than 10
-1Cm
3/ (m
2D bar) value of OTR is particularly less than 10
-2G/ (m
2D) WVTR and/or less than 10
-2Cm
3/ (m
2D bar) OTR.
10. according at least one described method in the aforementioned claim, it is characterized in that described base material and/or described covering have at least 75%, preferably are higher than 85% transmitance in visible-range.
11., it is characterized in that described activable adhesive has greater than 0.1, is preferably greater than 1 mechanical loss coefficient tan δ, and/or tan δ according at least one described method in the aforementioned claim
Adhesive-tan δ
Substrate or coveringDifference preferably be at least 1.
12. according at least one described method in the aforementioned claim, it is characterized in that described activable adhesive is 23 ℃ of conductivity that have greater than 20MS/m.
13. according at least one described method in the aforementioned claim, it is characterized in that described activatable adhesive has less than 100g/m
2D, especially less than 10g/m
2The WVTR of d and/or less than 8000cm
3/ (m
2D bar), especially less than 3000cm
3/ (m
2D bar) with very especially less than 100cm
3/ (m
2Dbar) OTR.
14. according at least one described method in the aforementioned claim, it is characterized in that described activatable adhesive is equipped with the capture material for penetrant.
15. according at least one described method in the aforementioned claim, it is characterized in that described chip architecture for induction heating has at least three layers, i.e. at least one conductive layer and bonding adhesive phase and another adhesive phase of at least one thermal activation.
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| DE102010039320 | 2010-08-13 | ||
| DE102010039320.7 | 2010-08-13 | ||
| PCT/EP2011/062881 WO2012019909A1 (en) | 2010-08-13 | 2011-07-27 | Method for encapsulating an electronic arrangement |
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| CN103270618A true CN103270618A (en) | 2013-08-28 |
| CN103270618B CN103270618B (en) | 2016-08-10 |
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| CN201180049543.7A Expired - Fee Related CN103270618B (en) | 2010-08-13 | 2011-07-27 | The method of encapsulating electronic device |
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| KR (1) | KR101871317B1 (en) |
| CN (1) | CN103270618B (en) |
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- 2011-07-27 KR KR1020137006303A patent/KR101871317B1/en active IP Right Grant
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| CN105462529A (en) * | 2014-09-28 | 2016-04-06 | 嘉兴山蒲照明电器有限公司 | Hot melt adhesive used for LED straight lamps |
| US11686457B2 (en) | 2014-09-28 | 2023-06-27 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED tube lamp |
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| US11226073B2 (en) | 2015-03-10 | 2022-01-18 | Jiaxing Super Lighting Electric Appliance Co., Ltd. | Led tube lamp |
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| US10876690B2 (en) | 2015-09-02 | 2020-12-29 | Jiaxing Super Lighting Electric Appliance Co., Ltd. | LED tube lamp |
| CN105957980A (en) * | 2016-05-30 | 2016-09-21 | 京东方科技集团股份有限公司 | OLED packaging equipment and OLED packaging method |
| CN109791885A (en) * | 2016-09-23 | 2019-05-21 | 株式会社斯库林集团 | Substrate board treatment |
| US20210198536A1 (en) * | 2018-05-25 | 2021-07-01 | 3M Innovative Properties Company | Phase separated articles |
| CN114433971B (en) * | 2021-12-20 | 2023-07-25 | 中国电子科技集团公司第二十九研究所 | Method for carrying out stacking welding with assistance of magnetic vibration particles |
| CN114433971A (en) * | 2021-12-20 | 2022-05-06 | 中国电子科技集团公司第二十九研究所 | Device and method for stack welding with assistance of magnetic vibration particles |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2012019909A1 (en) | 2012-02-16 |
| KR20130097755A (en) | 2013-09-03 |
| TW201222684A (en) | 2012-06-01 |
| KR101871317B1 (en) | 2018-06-27 |
| DE112011102705A5 (en) | 2013-05-29 |
| CN103270618B (en) | 2016-08-10 |
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