CN114433971B - Method for carrying out stacking welding with assistance of magnetic vibration particles - Google Patents
Method for carrying out stacking welding with assistance of magnetic vibration particles Download PDFInfo
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- CN114433971B CN114433971B CN202111559057.1A CN202111559057A CN114433971B CN 114433971 B CN114433971 B CN 114433971B CN 202111559057 A CN202111559057 A CN 202111559057A CN 114433971 B CN114433971 B CN 114433971B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/085—Cooling, heat sink or heat shielding means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a device and a method for carrying out stacking welding by using magnetic vibration particles, wherein the device comprises a magnetic field controller, an upper magnetic field generator, a lower magnetic field generator, a heating controller, an upper heater, a lower heater and a bearing plate, wherein the upper heater and the lower heater are arranged in parallel and are connected with the heating controller, the upper magnetic field generator is arranged above the upper heater, the lower magnetic field generator is arranged below the lower heater, the upper magnetic field generator and the lower magnetic field generator are connected with the magnetic field controller, the magnetic field controller controls the upper magnetic field generator and the lower magnetic field generator to generate an alternating magnetic field, the bearing plate is arranged above the lower heater, and the upper device and the lower circuit board are stacked and welded on the bearing plate through the magnetic vibration particles in the solder balls.
Description
Technical Field
The invention belongs to the technical field of microelectronic packaging, and particularly relates to a device and a method for stacking and welding by using magnetic vibration particles.
Background
In system in package, three-dimensional stacking of circuit boards such as PCB substrates, ceramic package substrates, silicon substrates, glass substrates, and the like, and packaged devices, electrical and mechanical interconnections are typically achieved using solder balls. A typical welding method is as follows: firstly, pre-planting solder balls on a BGA packaging device or a circuit board, wherein common ball planting processes include an electroless plating method, a laser ball planting method, a stencil printing method, a vacuum ball planting method and the like; then, the BGA package or circuit board is soldered to another circuit board by heating with a heat gun, a heat table, vacuum infrared heating, hot air reflow heating, etc. as the conventional soldering method. In the welding process, a soldering flux is required to break off a solder oxide layer so as to ensure that the welding process is smoothly carried out; because the flux is generally corrosive, it must be cleaned after soldering. Stacked circuit boards/devices are often complex in structure, making flux cleaning solutions difficult to circulate and exchange, and the residual flux after cleaning is prone to itself corrosiveness that can affect long-term reliability of the product.
Lamination welding methods have been reported in the industry. A solder ball, which is a lead-free solder ball with a thermal shell structure and can be used for induction heating, is provided in chinese patent CN 102672665A by samsung electronics corporation, wherein a ferromagnetic core in the solder ball is induction heated by a magnetic field, and the solder ball is melted to complete the micro-connection of a component and a substrate. The method realizes the local heating of the solder balls, can effectively reduce or prevent the occurrence of the warpage of the substrate, and can reduce or prevent the damage of high temperature to the chip. However, this method requires the use of flux to remove the oxide layer of the solder metal in the solder ball during the heat soldering, and has the problem that the residual flux affects the long-term reliability of the product. In chinese patent CN 112466864a, wei et al, the institute of electronic instruments for ship, proposed a three-dimensional stacked microwave assembly based on high-temperature co-fired ceramic, wherein a stacked reflow soldering method for completing a soldering motherboard and a ceramic base using solder balls with copper cores is mentioned, and the method and assembly have the advantages of high soldering reliability, convenient debugging process, good maintainability, etc., but the reflow soldering requires the use of flux to remove the oxide layer of solder metal in the solder balls, and the problem of flux residue in stacked soldering is also existed. In chinese patent CN 112366181A, shang Shuli et al of the institute of western-style microelectronics technology propose a flip-chip stack assembly method of a multi-chip/silicon interposer assembly, and the ball-mounting and stack-bonding of the flip-chip or the silicon interposer are completed by vacuum reflow soldering, so that the assembly efficiency is high, the flip-chip with different thickness and size is compatible, but the assembly process relies on a vacuum system with higher manufacturing cost, and flux is used for multiple times, and the flux residue problem of stack-bonding also exists.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a device and a method for carrying out stacking welding by using magnetic vibration particles.
The aim of the invention is achieved by the following technical scheme: the utility model provides an use magnetism to shake supplementary welding that piles up of granule device, includes magnetic field controller, goes up magnetic field generator, lower magnetic field generator, heating controller, goes up heater, lower heater and loading board, go up heater and lower heater parallel arrangement and all be connected with heating controller, it is equipped with the magnetic field generator to go up the heater top, the heater below is equipped with down magnetic field generator down, go up magnetic field generator and lower magnetic field generator and all be connected with magnetic field controller, magnetic field controller control goes up magnetic field generator and lower magnetic field generator and produces alternating magnetic field, the lower heater top is equipped with the loading board, stacks the welding to upper device and lower floor's circuit board through the inside magnetism of solder ball and solder ball shake granule on the loading board.
Further: the switching period of the alternating magnetic field is 0.1-20 s, the magnetic field strength is 1-1000 Gs, the magnetic force lines of the alternating magnetic field are perpendicular to the bonding pad of the welded circuit board or device, the angle range of the magnetic force lines deviating from the perpendicular is 0-25 degrees, and the radial distribution range of the alternating magnetic field is 5-500 mm.
Further: the heating controller controls the upper heater and the lower heater to provide the heating temperature of room temperature to 400 ℃, and the bearing plate can resist the high temperature of more than 400 ℃ and can realize the penetration of an alternating magnetic field and the rapid conduction of heat.
Further: the solder ball is made of at least 1 of Sn, sn-Ag, sn-Au, sn-Cu, sn-Ag-Cu, sn-Bi-Ag, sn-Zn, sn-In, sn-Pb, in-Pb and In-Ag.
Further: the melting point of the solder balls is 100-400 ℃, and the typical size is 0.2-1.5 mm.
Further: the magnetic vibration particles are round particles, and the number of the magnetic vibration particles in a single solder ball and a single through hole is 1 or more.
Further: the magnetic vibration particle material is a single material or alloy material of Fe, co and Ni, and the alloy material is a soft magnetic material, such as kovar alloy, low carbon steel, ferrosilicon alloy, ferroaluminum alloy, pure iron, ferronickel alloy, low carbon steel, silicon steel alloy, ferrocobalt alloy, ferroaluminum alloy and manganese zinc ferrite.
Further: the Curie temperature of the magnetic vibration particles is 350-2000 ℃, and the typical size is 0.02-0.8 mm.
Further: the surface material of the magnetic vibration particles is at least 1 of Au, in, sn, ag, ni, ni-Pd-Au, sn-Ag, sn-Au, sn-Cu, sn-Ag-Cu, sn-Bi-Ag, sn-Zn, sn-In, sn-Pb, in-Pb and In-Ag, so as to meet the welding process requirement of wetting the magnetic vibration particles and solder, and the surface material of the magnetic vibration particles is prepared by electroplating, sputtering, chemical plating, barrel plating or tin coating.
A method for stack welding with the aid of magnetic particles, comprising the steps of:
s1: providing solder and magnetic vibration particles required by the device for stacking welding;
s2: providing a circuit chip or a device to be stacked and welded;
s3: aligning and compacting the customized screen plate with an upper bonding pad of an upper circuit board/device, wherein the alignment error is not more than 10%;
s4: placing the magnetic vibration particles into through holes of the screen, and placing a permanent magnet on the back of an upper circuit board/device to prevent the magnetic vibration particles from moving or popping up the through holes;
s5: printing soft soldering material into the through holes through a soldering paste printing process, so that the soldering paste coats the magnetic vibration particles and is in close contact with the upper bonding pads, and disassembling the screen after the soldering paste is printed, wherein the material of the soldering paste is consistent with that of the solder balls;
s6: using a hot air reflow soldering process to melt the solder paste obtained by printing to obtain solder balls, and completing a ball implantation process;
s7: aligning the solder balls of the upper circuit board or the device after ball implantation with the bonding pads of the lower circuit board or the device to form a combination body;
s8: placing a circuit board or a combination of devices on the bearing plate;
s9: heating to the melting point of the solder by using the upper heater, the lower heater and the heating controller; meanwhile, the upper magnetic field generator, the lower magnetic field generator and the magnetic field controller are used for generating an alternating magnetic field, so that magnetic vibration particles in the solder reciprocate to strike the solder and break down a solder oxide layer;
s10: cooling, and completing a flux-free stacking welding process which does not depend on a reducing atmosphere or a vacuum environment;
s11: repeating the above process to realize three-dimensional stacking welding of the multi-layer circuit board/device.
The foregoing inventive concepts and various further alternatives thereof may be freely combined to form multiple concepts, all of which are contemplated and claimed herein. Various combinations will be apparent to those skilled in the art from a review of the present disclosure, and are not intended to be exhaustive or all of the present disclosure.
The invention has the beneficial effects that: the invention provides a device and a method for carrying out stacking welding by using magnetic vibration particles in an auxiliary way, which are used for realizing the stacking welding which does not depend on reducing atmosphere, vacuum environment and soldering flux during the stacking welding by striking the solder and breaking a solder oxide layer through the reciprocating motion of the magnetic vibration particles in the solder under an alternating magnetic field, simplifying the welding process, avoiding the failure risk of devices caused by the residue of the soldering flux and being beneficial to realizing the stacking welding of high-reliability and high-density three-dimensional system-level packaging.
Drawings
FIG. 1 is a schematic view of the apparatus of the present invention;
fig. 2 is a schematic representation of the use of the device of the present invention.
Wherein, 1, a magnetic field controller, 2, an upper magnetic field generator, 3, a lower magnetic field generator, 4, a heating controller, 5, an upper heater, 6, a lower heater, 7, a bearing plate, 8, solder balls, 9, magnetic vibration particles, 10, an upper device, 11, an upper device bonding pad, 12, a lower circuit board, 13 and a lower circuit board bonding pad.
Detailed Description
Other advantages and effects of the present invention will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present invention with reference to specific examples. The invention may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present invention. It should be noted that the following embodiments and features in the embodiments may be combined with each other without conflict.
It should be noted that, for the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention are clearly and completely described below, and it is obvious that the described embodiments are some embodiments of the present invention, but not all embodiments.
In the description of the present invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," and the like indicate orientations or positional relationships in which the inventive product is conventionally placed in use, and are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements being referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal," "vertical," "overhang," and the like do not denote a requirement that the component be absolutely horizontal or overhang, but rather may be slightly inclined. As "horizontal" merely means that its direction is more horizontal than "vertical", and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In addition, in the present invention, if a specific structure, connection relationship, position relationship, power source relationship, etc. are not specifically written, the structure, connection relationship, position relationship, power source relationship, etc. related to the present invention can be known by those skilled in the art without any creative effort.
Example 1:
referring to fig. 1 and 2 together, the invention discloses a device for carrying out stacking welding by using magnetic vibration particles, which comprises a magnetic field controller, an upper magnetic field generator, a lower magnetic field generator, a heating controller, an upper heater, a lower heater and a bearing plate, wherein the upper heater and the lower heater are arranged in parallel and are connected with the heating controller, the upper magnetic field generator is arranged above the upper heater, the lower magnetic field generator is arranged below the lower heater, the upper magnetic field generator and the lower magnetic field generator are connected with the magnetic field controller, the magnetic field controller controls the upper magnetic field generator and the lower magnetic field generator to generate an alternating magnetic field, the bearing plate is arranged above the lower heater, and the upper device and the lower circuit board are stacked and welded on the bearing plate through solder balls and the magnetic vibration particles in the solder balls.
An alternating magnetic field is generated using a magnetic field controller 1, an upper magnetic field generator 2, and a lower magnetic field generator 3. The switching period of the alternating magnetic field is 0.5s, and the magnetic field strength is 10Gs. The magnetic force lines of the alternating magnetic field are perpendicular to the bonding pads of the to-be-stacked welding devices or circuit boards, and the angle range of the magnetic force lines deviating from the perpendicular is 0-25 degrees. The radial distribution range of the alternating magnetic field is 30mm. The heating temperature provided by the heating controller 4, the upper heater 5 and the lower heater 6 ranges from room temperature to 400 ℃, and the upper heater 5 and the lower heater 6 are heated by using an infrared radiation mode. The bearing plate 7 can resist the high temperature of 450 ℃ or higher, and can realize the penetration of an alternating magnetic field and the rapid conduction of heat.
The solder ball 8 material Sn-Pb required for soldering using the device has a melting point of 183 c and a typical size of 0.6mm. The magnetic vibration particles 9 required by welding by using the device are circular particles, the number of the magnetic vibration particles in a single welding ball is 1, the magnetic vibration particles 9 in the welding ball 8 are made of iron-nickel alloy, the Curie temperature of the magnetic vibration particles 9 in the welding ball 8 is more than 450 ℃, the typical size of the magnetic vibration particles 9 in the welding ball 8 is 0.05mm, the surface materials of the magnetic vibration particles 9 in the welding ball 8 are Ni and Sn-Pb, and the welding process requirement that the magnetic vibration particles 9 in the welding ball 8 are wetted with welding ball welding flux is met. The surface material of the magnetic vibration particles 9 inside the solder balls 8 is prepared by electroplating and tin lining processes.
The upper device 10 is a packaging device, and an upper device bonding pad 11 for welding is arranged on the surface of the packaging device; the lower circuit board 12 is a PCB substrate, and lower circuit board pads 13 for soldering are disposed on the surface of the lower circuit board 12.
The method for realizing the stacked welding of the packaging device and the PCB by using the device and the materials required by welding comprises the following steps:
s1: the device is prepared for the solder balls 8 and the magnetic particles 9 required for the stack soldering.
S2: an upper device 10 and a lower circuit board 12 to be stacked and soldered are prepared.
S3: the customized screen is aligned and pressed against the upper device pads 11 of the upper device 10 with an alignment error of no more than 10%.
S4: and (3) placing the magnetic vibration particles 9 in the step (S1) into the through holes of the screen in the step (S3), and placing a permanent magnet on the back of the upper device 10 to prevent the magnetic vibration particles 9 from moving.
S5: and (3) printing soft soldering paste into through holes of the screen plate through a soldering paste printing process, so that the soldering paste coats the magnetic vibration particles in the step (S1) and is in close contact with the upper device bonding pad 11 in the step (S3), and disassembling the screen plate after the soldering paste is printed. The solder paste is of a material consistent with the solder balls 8.
S6: and (5) using a hot air reflow soldering process to melt the soldering paste printed in the step (S5) to obtain the solder balls (8), and completing the ball mounting process.
S7: and (3) aligning the solder balls 8 of the upper device 10 after ball placement in the step (S6) with the lower circuit board bonding pads 13 of the lower circuit board 12 in the step (S2) to form a combination.
S8: the assembly obtained in S7 is placed on a carrier plate 7.
S9: heating the combination to above 183 ℃ of the melting point of the solder ball by using a heating controller 4, an upper heater 5 and a lower heater 6; meanwhile, using the magnetic field controller 1, the upper magnetic field generator 2 and the lower magnetic field generator 3 generate an alternating magnetic field, so that the magnetic vibration particles 9 in the solder balls 8 reciprocate to strike the solder and break the solder oxide layer.
S10: and cooling to complete the flux-free stacking welding process independent of a reducing atmosphere or a vacuum environment.
S11: the three-dimensional stacking welding of the multi-layer circuit board/device can be realized by repeating the above process.
The embodiment describes the stacking welding of a packaging device on a PCB, the device and the method can also realize the stacking welding of the packaging device and the packaging device, and the stacking welding of the PCB and the PCB, and the specific implementation situation is similar to the embodiment.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.
Claims (10)
1. A method for stack welding with the aid of magnetic particles, comprising the steps of:
s1: providing solder and magnetic vibration particles required by stacking welding;
s2: providing a circuit chip or a device to be stacked and welded;
s3: aligning and compacting the customized screen plate with an upper bonding pad of an upper circuit board or device, wherein the alignment error is not more than 10%;
s4: putting magnetic vibration particles into through holes of the screen plate, and placing permanent magnets on the back of an upper circuit board or a device to prevent the magnetic vibration particles from moving or popping up the through holes;
s5: printing soft soldering material into the through holes through a soldering paste printing process, so that the soldering paste coats the magnetic vibration particles and is in close contact with the upper bonding pads, and disassembling the screen after the soldering paste is printed, wherein the material of the soldering paste is consistent with that of the solder balls;
s6: using a hot air reflow soldering process to melt the solder paste obtained by printing to obtain solder balls, and completing a ball implantation process;
s7: aligning the solder balls of the upper circuit board or the device after ball implantation with the bonding pads of the lower circuit board or the device to form a combination body;
s8: placing a circuit board or a combination of devices on a bearing plate;
s9: heating to a solder melting point using an upper heater, a lower heater and a heating controller; meanwhile, an upper magnetic field generator, a lower magnetic field generator and a magnetic field controller are used for generating an alternating magnetic field, so that magnetic vibration particles in the solder reciprocate to strike the solder and break down a solder oxide layer;
s10: cooling, and completing a flux-free stacking welding process which does not depend on a reducing atmosphere or a vacuum environment;
s11: repeating the above process to realize three-dimensional stacking welding of the multilayer circuit board or the device;
the device used by the method for carrying out stacking welding with the assistance of magnetic vibration particles comprises a magnetic field controller, an upper magnetic field generator, a lower magnetic field generator, a heating controller, an upper heater, a lower heater and a bearing plate, wherein the upper heater and the lower heater are arranged in parallel and are connected with the heating controller, the upper magnetic field generator is arranged above the upper heater, the lower magnetic field generator is arranged below the lower heater, the upper magnetic field generator and the lower magnetic field generator are connected with the magnetic field controller, the magnetic field controller controls the upper magnetic field generator and the lower magnetic field generator to generate alternating magnetic fields, the bearing plate is arranged above the lower heater, and the upper device and the lower circuit board are stacked and welded on the bearing plate through the solder balls and the magnetic vibration particles inside the solder balls.
2. The method for performing stacked welding with the assistance of magnetic vibration particles according to claim 1, wherein the switching period of the alternating magnetic field is 0.1 s-20 s, the magnetic field strength is 1 Gs-1000 Gs, magnetic lines of force of the alternating magnetic field are perpendicular to a welding pad of a welded circuit board or device, the angle range of the magnetic lines of force offset from the perpendicular is 0-25 degrees, and the radial distribution range of the alternating magnetic field is 5-500 mm.
3. The method for stacked welding with the assistance of magnetic particles according to claim 1, wherein the heating controller controls the upper heater and the lower heater to provide a heating temperature of room temperature to 400 ℃, and the carrier plate can withstand a high temperature of 400 ℃ or higher and can realize penetration of an alternating magnetic field and rapid conduction of heat.
4. The method of claim 1, wherein the solder ball is made of at least 1 of Sn, sn-Ag, sn-Au, sn-Cu, sn-Ag-Cu, sn-Bi-Ag, sn-Zn, sn-In, sn-Pb, in-Pb, in-Ag.
5. The method of claim 1, wherein the solder balls have a melting point of 100-400 ℃ and a typical dimension of 0.2-1.5 mm.
6. The method of claim 1, wherein the magnetic particles are round particles, and the number of magnetic particles in a single solder ball or a single through hole is 1 or more.
7. The method of claim 1, wherein the magnetic particles are single material of Fe, co, ni or alloy material of soft magnetic material.
8. The method of claim 7, wherein the soft magnetic material is kovar, mild steel, ferrosilicon, ferroaluminum, pure iron, ferronickel, silicon steel, ferrocobalt, manganese zinc ferrite.
9. The method of claim 1, wherein the curie temperature of the magnetic particles is 350-2000 ℃, and the typical size is 0.02-0.8 mm.
10. The method for performing stacked welding with the assistance of magnetic vibration particles according to claim 1, wherein the surface material of the magnetic vibration particles is at least 1 of Au, in, sn, ag, ni, ni-Pd-Au, sn-Ag, sn-Au, sn-Cu, sn-Ag-Cu, sn-Bi-Ag, sn-Zn, sn-In, sn-Pb, in-Ag, and satisfies the welding process requirement of wetting the magnetic vibration particles with solder, and the surface material of the magnetic vibration particles is prepared by electroplating, sputtering, electroless plating, barrel plating, or tin lining process.
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