CN108637520A - A kind of unleaded multilayer welding pellet and its preparation method and application - Google Patents
A kind of unleaded multilayer welding pellet and its preparation method and application Download PDFInfo
- Publication number
- CN108637520A CN108637520A CN201810410981.5A CN201810410981A CN108637520A CN 108637520 A CN108637520 A CN 108637520A CN 201810410981 A CN201810410981 A CN 201810410981A CN 108637520 A CN108637520 A CN 108637520A
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- China
- Prior art keywords
- tin solder
- ferromagnetism
- solder
- middle layer
- sphere
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention relates to a kind of unleaded multilayer welding pellets and its preparation method and application, belong to electronic package material field.A kind of unleaded multilayer welding pellet, it is ferromagnetism sphere that the soldered ball, which has three-layer nuclear shell structure, kernel, and tin solder middle layer is covered outside ferromagnetism sphere, tin solder outer layer is covered outside tin solder middle layer, the tin solder middle layer includes the following following components of mass fraction：8.5 ~ 9%Zn, 0.1 ~ 0.2%Cr, 0.5 ~ 1%Ag and surplus Sn；The tin solder outer layer is one kind in Sn 3Ag 0.5Cu, Sn 5Sb, Sn 3.5Ag or Sn 0.7Cu, and the fusing point of ferromagnetism sphere is higher than the fusing point of tin solder outer layer.Solder ball kernel of the present invention is magnetic material, and under the action of electromagnetic field, only soldered ball is heated, and other parts are not heated, can be to avoid thermal damage's problem of other component.
Description
Technical field
The present invention relates to a kind of unleaded multilayer welding pellets and its preparation method and application, belong to electronic package material field.
Background technology
With the continuous renewal and development of electronics and IT products, to being miniaturized of electronics and IT products, low cost, more work(
Energy, more stringent requirements are proposed for portable and high reliability.Microelectronic packaging technology is constantly brought forth new ideas, and wherein flip-chip is micro-
It is used widely in Electronic Packaging, becomes the mainstream technology that chip encapsulation technology moves towards microminiaturization.The main work of Electronic Packaging
With being to transmit electric power and circuit signal, sinking path, carrying and protection packaging structure are provided.
Currently, common welding material is tin solder, tin solder the most typical is Sn-37Pb.However, with Europe
The implementation of alliance's WEEE/ROHS bills, the use of lead are greatly restricted, for this purpose, lead-free solder becomes the hot spot of this field research.Mesh
Preceding common lead-free tin solder, such as Sn-Cu, Sn-Ag, Sn-Cu-Ag, Sn-Bi, alternative Sn-37Pb are used as solder.
When being welded using these solders, one of problem is the temperature due to Reflow Soldering substantially 200 or so, can lead to base
Plate, chip etc. deform.
Invention content
In order to solve the above technical problems, a kind of unleaded multilayer welding pellet of present invention offer and preparation method and application, institute
Stating lead-free solder can solve the problems, such as that substrate, chip etc. deform.
A kind of unleaded multilayer welding pellet, it is ferromagnetism sphere, ferromagnetism that the soldered ball, which has three-layer nuclear shell structure, kernel,
Tin solder middle layer is covered outside sphere, and tin solder outer layer is covered outside tin solder middle layer,
The tin solder middle layer includes the following following components of mass fraction：8.5~9% Zn、0.1~0.2% Cr、0.5~1%
Ag and surplus Sn；The tin solder outer layer is one kind in Sn-3Ag-0.5Cu, Sn-5Sb, Sn-3.5Ag or Sn-0.7Cu,
And the fusing point of ferromagnetism sphere is higher than the fusing point of tin solder outer layer.
Ferromagnetism sphere of the present invention is preferred, and the material of the ferromagnetism sphere is iron, cobalt, nickel metal or their conjunction
Gold.Ferromagnetism sphere of the present invention can be according to prior art providing method, such as metallurgical powder preparation method, gas atomization method
It is made or commercially available.
Further, it is preferable to which the diameter of the ferromagnetism sphere can be according to the pre- period between substrate and chip to be welded
Away from determination, it is preferably 50 ~ 300 microns.
Ferromagnetism sphere of the present invention is the uniform ferromagnetism ball of granular size.
Ferromagnetism sphere of the present invention is preferred, the Curie temperature of the ferromagnetism sphere higher than tin solder middle layer and
The Curie temperature of tin solder outer layer.
Unleaded multilayer welding pellet of the present invention is preferred, and the thickness of the tin solder middle layer is 5 ~ 50 microns.
Unleaded multilayer welding pellet of the present invention is preferred, and the tin solder intermediate layer material includes that mass fraction is following
Following components：8.75 ~ 9% Zn, 0.1 ~ 0.15% Cr, 0.5 ~ 0.8% Ag, surplus Sn.
Further, the tin solder intermediate layer material includes the following following components of mass fraction：8.86% Zn、
0.14% Cr, 0.62% Ag, surplus Sn.
Tin solder intermediate layer material of the present invention is made as follows：It, will under nitrogen atmosphere by material rate
Metal Sn and metal Zn particles are allowed to be completely melt at 600 ~ 620 DEG C, and keep the temperature at least 2h, obtain Sn-Zn alloys；
Sn-Zn alloys are mixed with metal Ag and metal Cr particles, under argon atmosphere, under air-proof condition, 900 ~ 980 DEG C are allowed to complete
Fusing, and keep the temperature at least 2h.
Unleaded multilayer welding pellet of the present invention is preferred, and the thickness of the tin solder outer layer is 100 ~ 500 microns.
Unleaded multilayer welding pellet of the present invention is preferred, and the tin solder cladding material is Sn-3Ag-0.5Cu, Sn-
One kind in 5Sb, Sn-3.5Ag or Sn-0.7Cu.
It is a further object of the present invention to provide the preparation methods of above-mentioned lead multilayer welding pellet, and the method includes following steps
Suddenly：On ferromagnetism sphere formed tin solder middle layer, after outside tin solder middle layer formed tin solder outer layer, obtain pre-
Solder ball processed；By the whole processing 10 in the range of temperature is+0 ~ 10 DEG C of tin solder middle layer fusing point of prefabricated solder ball ~
120s, it is cooling, both.
The another mesh of the present invention is to provide the method welded using above-mentioned solder ball, specially：By several welderings
Pellet is fixed on chip, so that circuit board is passed through hot pressing with solder ball and is pre-fixed, and it is whole to constitute an encapsulation；Will encapsulation it is whole in
It is heated in electromagnetic induction heating device, circuit board is made to be welded and fixed with chip,
It is ferromagnetism sphere that the soldered ball, which has three-layer nuclear shell structure, kernel, is covered among tin solder outside ferromagnetism sphere
Layer, tin solder middle layer cover tin solder outer layer outside,
The tin solder middle layer includes the following following components of mass fraction：8.5~9% Zn、0.1~0.2% Cr、0.5~1%
Ag and surplus Sn；The tin solder outer layer is one kind in Sn-3Ag-0.5Cu, Sn-5Sb, Sn-3.5Ag or Sn-0.7Cu,
And the fusing point of ferromagnetism sphere is higher than the fusing point of tin solder outer layer.
Beneficial effects of the present invention are：Unleaded multilayer welding pellet provided by the invention has three-layer nuclear shell structure, kernel
For ferromagnetism sphere, ferromagnetism sphere covers tin solder middle layer, tin solder outer layer is covered outside tin solder middle layer outside,
The fusing point of the tin solder middle layer is less than about 20 DEG C of the fusing point or more for covering tin solder outer layer, and ferromagnetism sphere is molten
Fusing point of the point higher than tin solder outer layer.Solder ball kernel of the present invention is magnetic material, under the action of electromagnetic field, only
There is soldered ball to be heated, and other parts are not heated, it can be to avoid thermal damage's problem of other component, while the present invention utilizes
Adhesive layer of the tin solder intermediate layer material as ferromagnetism kernel and tin solder middle layer, allows total to fasten
Interlayer structure；Furthermore middle layer is similarly tin solder, can also melt the effect for playing solder in the welding process, to
It ensure that uniform ferromagnetism sphere is distributed between surface to be welded, control its spacing is uniform, the welding effect obtained.
Specific implementation mode
The protection domain of invention is not limited to following embodiment disclosure of that, and invention is carried out simple deformation and combined
Within all belonging to the scope of protection of the present invention.
The preparation method of unleaded multilayer welding pellet described in following embodiments, the method includes following step：Utilize object
The method of coating that physical vapor deposition, plating or the prior art provide forms tin solder middle layer on ferromagnetism sphere, rear profit
The method of coating provided with physical vapour deposition (PVD), plating or the prior art is formed outside tin solder middle layer outside tin solder
Layer, obtains prefabricated solder ball；By prefabricated solder ball it is whole in temperature be tin solder middle layer fusing point（Liquidus temperature）+ 5 DEG C
60s is handled in range, it is cooling, both.
Tin solder middle layer described in following embodiments is in alloy raw material ratio, under nitrogen atmosphere, by metal Sn and gold
Belong to Zn particles to be allowed to be completely melt at 620 DEG C, and keep temperature 2h, obtains Sn-Zn alloys；By Sn-Zn alloys and metal
Ag and the mixing of metal Cr particles, under argon atmosphere, under air-proof condition, 950 DEG C are allowed to be completely melt, and keep the temperature extremely
2h；
Embodiment 1
A kind of unleaded multilayer welding pellet, it is ferromagnetism sphere that the soldered ball, which has three-layer nuclear shell structure, kernel,（Diameter 50 is micro-
Rice）, tin solder middle layer is covered outside ferromagnetism sphere（5 microns）, tin solder outer layer is covered outside tin solder middle layer（It is thick
80 microns of degree）,
The ferromagnetism ball material is Fe.The tin solder intermediate layer material includes the following following components of mass fraction：
8.86% Zn, 0.14% Cr, 0.62% Ag, surplus Sn, solidus temperature are 197.7 DEG C, and liquidus temperature is 202.3 DEG C.
The tin solder cladding material is Sn-3Ag-0.5Cu.
Embodiment 2
A kind of unleaded multilayer welding pellet, it is ferromagnetism sphere that the soldered ball, which has three-layer nuclear shell structure, kernel,（Diameter 50 is micro-
Rice）, tin solder middle layer is covered outside ferromagnetism sphere（5 microns）, tin solder outer layer is covered outside tin solder middle layer（It is thick
80 microns of degree）,
The ferromagnetism ball material is Fe-Ni alloy/C.The ferromagnetism ball material is Fe.The tin solder middle layer material
Material includes the following following components of mass fraction：8.86% Zn, 0.14% Cr, 0.62% Ag, surplus Sn, solidus temperature are
197.7 DEG C, liquidus temperature is 202.3 DEG C.The tin solder cladding material is Sn-5Sb.
Embodiment 3
A kind of unleaded multilayer welding pellet, it is ferromagnetism sphere that the soldered ball, which has three-layer nuclear shell structure, kernel,（Diameter 50 is micro-
Rice）, tin solder middle layer is covered outside ferromagnetism sphere（5 microns）, tin solder outer layer is covered outside tin solder middle layer（It is thick
80 microns of degree）,
The ferromagnetism ball material is Fe-Co alloy/C.The tin solder intermediate layer material includes under mass fraction is following
State component：8.5% Zn, 0.15% Cr, 0.66% Ag, surplus Sn, solidus temperature are 198.2 DEG C, and liquidus temperature is
203.3℃.The tin solder cladding material is Sn-3.5Ag.
Embodiment 4
A kind of unleaded multilayer welding pellet, it is ferromagnetism sphere that the soldered ball, which has three-layer nuclear shell structure, kernel,（Diameter 50 is micro-
Rice）, tin solder middle layer is covered outside ferromagnetism sphere（5 microns）, tin solder outer layer is covered outside tin solder middle layer（It is thick
80 microns of degree）,
The ferromagnetism ball material is Fe-Co-Ni ternary alloy three-partalloys.The tin solder intermediate layer material include mass fraction such as
Under following components：8.5% Zn, 0.15% Cr, 0.66% Ag, surplus Sn, solidus temperature are 198.2 DEG C, liquidus curve temperature
Degree is 203.3 DEG C.The tin solder cladding material is Sn-0.7Cu.
Embodiment 5
A kind of unleaded multilayer welding pellet, it is ferromagnetism sphere that the soldered ball, which has three-layer nuclear shell structure, kernel,（Diameter 100 is micro-
Rice）, tin solder middle layer is covered outside ferromagnetism sphere（30 microns）, tin solder outer layer is covered outside tin solder middle layer
（300 microns of thickness）,
The ferromagnetism ball material is Fe-Co-Ni ternary alloy three-partalloys.The ferromagnetism ball material is Fe.The tin solder
Intermediate layer material includes the following following components of mass fraction：8.86% Zn, 0.14% Cr, 0.62% Ag, surplus Sn, solid phase
Line temperature is 197.7 DEG C, and liquidus temperature is 202.3 DEG C.The tin solder cladding material is Sn-3.5Ag.
Embodiment 6
A kind of unleaded multilayer welding pellet, it is ferromagnetism sphere that the soldered ball, which has three-layer nuclear shell structure, kernel,（Diameter 100 is micro-
Rice）, tin solder middle layer is covered outside ferromagnetism sphere（30 microns）, tin solder outer layer is covered outside tin solder middle layer
（300 microns of thickness）,
The ferromagnetism ball material is Fe-Co alloy/C.The ferromagnetism ball material is Fe.The tin solder middle layer material
Material includes the following following components of mass fraction：8.86% Zn, 0.14% Cr, 0.62% Ag, surplus Sn, solidus temperature are
197.7 DEG C, liquidus temperature is 202.3 DEG C.The tin solder cladding material is Sn-3.5Ag.
Embodiment 7
A kind of unleaded multilayer welding pellet, it is ferromagnetism sphere that the soldered ball, which has three-layer nuclear shell structure, kernel,（Diameter 100 is micro-
Rice）, tin solder middle layer is covered outside ferromagnetism sphere（30 microns）, tin solder outer layer is covered outside tin solder middle layer
（300 microns of thickness）,
The ferromagnetism ball material is Fe-Ni alloy/C.The tin solder intermediate layer material includes under mass fraction is following
State component：8.5% Zn, 0.15% Cr, 0.66% Ag, surplus Sn, solidus temperature are 198.2 DEG C, and liquidus temperature is
203.3℃.The tin solder cladding material is Sn-5Sb.
Embodiment 8
A kind of unleaded multilayer welding pellet, it is ferromagnetism sphere that the soldered ball, which has three-layer nuclear shell structure, kernel,（Diameter 100 is micro-
Rice）, tin solder middle layer is covered outside ferromagnetism sphere（30 microns）, tin solder outer layer is covered outside tin solder middle layer
（300 microns of thickness）,
The ferromagnetism ball material is Fe-Co-Ni ternary alloy three-partalloys.The ferromagnetism ball material is Fe.The tin solder
Intermediate layer material includes the following following components of mass fraction：8.86% Zn, 0.14% Cr, 0.62% Ag, surplus Sn, solid phase
Line temperature is 197.7 DEG C, and liquidus temperature is 202.3 DEG C.The tin solder cladding material is Sn-0.7Cu.
Claims (8)
1. a kind of unleaded multilayer welding pellet, characterized in that it is ferromagnetism ball that the soldered ball, which has three-layer nuclear shell structure, kernel,
Body, ferromagnetism sphere cover tin solder middle layer, tin solder outer layer are covered outside tin solder middle layer outside,
The tin solder middle layer includes the following following components of mass fraction：8.5~9% Zn、0.1~0.2% Cr、0.5~1%
Ag and surplus Sn；The tin solder outer layer is one kind in Sn-3Ag-0.5Cu, Sn-5Sb, Sn-3.5Ag or Sn-0.7Cu,
And the fusing point of ferromagnetism sphere is higher than the fusing point of tin solder outer layer.
2. solder ball according to claim 1, characterized in that the material of the ferromagnetism sphere be iron, cobalt, nickel metal or
Their alloy.
3. solder ball according to claim 1, characterized in that the Curie temperature of the ferromagnetism sphere is higher than tin solder
The Curie temperature of middle layer and tin solder outer layer.
4. solder ball according to claim 1, characterized in that the first component alloy includes under mass fraction is following
State component：8.75 ~ 9% Zn, 0.1 ~ 0.15% Cr, 0.5 ~ 0.8% Ag, surplus Sn.
5. solder ball according to claim 1, characterized in that the first component alloy includes under mass fraction is following
State component：8.86% Zn, 0.14% Cr, 0.62% Ag, surplus Sn.
6. solder ball according to claim 1, characterized in that the tin solder intermediate layer material is made as follows
：By material rate, under nitrogen atmosphere, metal Sn and metal Zn particles are allowed to be completely melt at 600 ~ 620 DEG C, and protect
The temperature at least 2h is held, Sn-Zn alloys are obtained；Sn-Zn alloys are mixed with metal Ag and metal Cr particles, in argon atmosphere
Under, under air-proof condition, 900 ~ 980 DEG C are allowed to be completely melt, and keep the temperature at least 2h.
7. the preparation method of solder ball described in claim 1, characterized in that the method includes following step：In ferromagnetism ball
On body formed tin solder middle layer, after outside tin solder middle layer formed tin solder outer layer, obtain prefabricated solder ball；It will be pre-
Solder ball processed is whole to handle 10 ~ 120s in the range of temperature is+0 ~ 10 DEG C of tin solder middle layer fusing point, cooling, both.
8. the method welded using any one of claim 1 ~ 6 solder ball, characterized in that by several claims 1
The solder ball is fixed on chip, so that circuit board is passed through hot pressing with solder ball and is pre-fixed, and it is whole to constitute an encapsulation；It will encapsulation
It is whole to be heated in electromagnetic induction heating device, so that circuit board is welded and fixed with chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810410981.5A CN108637520A (en) | 2018-05-02 | 2018-05-02 | A kind of unleaded multilayer welding pellet and its preparation method and application |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810410981.5A CN108637520A (en) | 2018-05-02 | 2018-05-02 | A kind of unleaded multilayer welding pellet and its preparation method and application |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108637520A true CN108637520A (en) | 2018-10-12 |
Family
ID=63749020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810410981.5A Withdrawn CN108637520A (en) | 2018-05-02 | 2018-05-02 | A kind of unleaded multilayer welding pellet and its preparation method and application |
Country Status (1)
| Country | Link |
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| CN (1) | CN108637520A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114433971A (en) * | 2021-12-20 | 2022-05-06 | 中国电子科技集团公司第二十九研究所 | Device and method for stack welding with assistance of magnetic vibration particles |
| CN116441786A (en) * | 2023-04-26 | 2023-07-18 | 深圳前海振百易科技有限公司 | Electromagnetic hot-melting tin alloy solder, preparation method thereof and soldering method |
-
2018
- 2018-05-02 CN CN201810410981.5A patent/CN108637520A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114433971A (en) * | 2021-12-20 | 2022-05-06 | 中国电子科技集团公司第二十九研究所 | Device and method for stack welding with assistance of magnetic vibration particles |
| CN116441786A (en) * | 2023-04-26 | 2023-07-18 | 深圳前海振百易科技有限公司 | Electromagnetic hot-melting tin alloy solder, preparation method thereof and soldering method |
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Application publication date: 20181012 |
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