WO2015068585A1

WO2015068585A1 - Sealing member, sealed substrate sealed by sealing member, and method for manufacturing same

Info

Publication number: WO2015068585A1
Application number: PCT/JP2014/078275
Authority: WO
Inventors: 六田　充輝; 芳樹中家
Original assignee: ダイセル・エボニック株式会社
Priority date: 2013-11-07
Filing date: 2014-10-23
Publication date: 2015-05-14
Also published as: TWI666741B; CN105706229A; TW201523814A; KR20160083892A; JPWO2015068585A1

Abstract

　A sealed region of a device (1) is housed by a sealing member (11) having a film-shaped or tray-shaped form, at least a peripheral edge part (13) of which includes a thermoplastic resin (copolymer polyamide-based resin or the like), the peripheral edge part of the sealing member (11) is heat-bonded to a substrate (2) of the device (1) in a form in which the sealing member (11) is separated from surface-mounted components (3a-3c) of the device (1) inside the sealed region, and a sealed device is manufactured in which the sealed region of the device (1) is covered by the sealing member (11). The copolymer polyamide-based resin may include units derived from a long-chain component having a C_8-16 alkylene group (a C_9-17 lactam, amino C_9-17 alkane carboxylic acid, or the like). The sealing member selectively and effectively seals and protects a predetermined part of the device.

Description

Sealing member, sealing substrate sealed with this sealing member, and method for manufacturing the same

The present invention relates to a sealing member useful for covering and sealing a substrate on which a component (electronic component or the like) is mounted, a sealing substrate covered and sealed with this sealing member, and a method for manufacturing the same About.

In order to protect against moisture, dust, etc., precision parts (or electronic devices) such as printed circuit boards, semiconductor elements, solar cells, etc. are placed in the mold cavity, fluid resin is injected, and precision parts are sealed with resin. To be done.

In a typical method, a thermosetting resin (for example, epoxy resin) having low viscosity and high fluidity is used. However, since additives such as a crosslinking agent or curing agent for curing are added to the thermosetting resin, quality control as a thermosetting resin is difficult not only in relation to the pot life, but also cured. For the reaction, usually a long time of several hours or more is required.

A method of sealing (or protecting) precision parts by injection molding of a thermoplastic resin is also known. However, the greater the sealing area, the higher the fluidity required for the resin. For this reason, the molding conditions have to be higher and higher pressure, and the mounted precision parts may be damaged by heat or pressure. In Japanese Patent Laid-Open No. 2000-133665 (Patent Document 1), a printed circuit board on which electronic components are mounted is placed in a mold cavity, and a polyamide resin heated and melted at 160 to 230 ° C. is 2.5 to 25 kg / cm. A method is disclosed in which a printed circuit board on which electronic components are mounted is sealed by being injected into the mold cavity with a pressure of ² . In an example of this document, it is described that a polyamide resin is injected into a mold at a melting temperature of 190 ° C. and a pressure of 20 kg / cm ² to seal a printed circuit board. However, even in this method, the electronic component may be damaged because a relatively high temperature and pressure are applied to the electronic component. In particular, when the sealing area is increased, higher temperature and higher pressure molding conditions are required, and thus the possibility of damage to the electronic component is increased.

Also, the resin cannot be completely filled into every corner of precision parts, and if a small void is generated, the electronic circuit may be corroded or short-circuited due to the influence of resin additives or low molecular weight components.

Furthermore, due to the expansion and contraction stress of the resin under the use conditions, a fine crack may be generated and damaged in the solder part for fixing the electronic component to the substrate. When the solder portion is damaged in this manner, an electronic device malfunctions. The occurrence of metal whiskers from the terminals of electronic components, which has been a problem in recent years, may be due to such contact between the resin and the electronic components and their terminals, or incomplete sealing.

In order to avoid the adverse effects of heat and pressure in injection molding, it has also been proposed that the resin be powdered and sealed with powder. However, when powder is used, the voids are more likely to occur than in the case of injection molding, and damage to the solder due to resin expansion and contraction stress cannot be resolved. In addition, the powder is easily scattered and it is difficult to efficiently seal a desired portion.

On the other hand, a method of sealing using a film has also been proposed. In the case of a film, the adverse effects of heat and pressure in injection molding can be avoided, and the problem of solder damage can be solved because the shape is thin. In Japanese Patent Laid-Open No. 2001-284779 (Patent Document 2), a circuit board provided with electronic components is inserted into a cylindrical film, and both openings of the cylindrical film are closed to pack the circuit board. A method, a method of covering an area provided with the electronic component with a sheet-like film, a method of covering both front and back surfaces of a circuit board with two sheet-like films and packing the circuit board with the sheet-like film, and forming an electronic circuit A method of manufacturing an article is disclosed, covering with a preheated and softened film, depressurizing between the film and the substrate, and causing the film to follow the component or the substrate. Yes. Japanese Patent Application Laid-Open No. 11-259021 (Patent Document 3) discloses a liquid crystal display panel member in which liquid crystal display panel members made of a plurality of liquid crystal display panel members are wrapped and laminated, and polyamide is also exemplified as a plastic film. ing. However, these methods cannot protect or unprotect only certain parts of the electronic device. For example, when an electronic device has connectors that need to be attached and detached, the electronic device is packed up to this connector part. For this reason, the connectors cannot function as a single part of an electric / electronic product, do not make an electronic device, and are not practical. In addition, problems such as corrosion and short circuits of the electronic circuit still remain due to non-uniform contact with the mounted electronic components. Furthermore, in the sealing with a film, one technical focus is how to make the film follow the uneven portion on the surface of the electronic device. For this reason, vacuum forming or the like has been proposed, but it is technically difficult to protect only a specific portion of the substrate in vacuum forming. In addition, after the composite with the substrate is completed, it is necessary to cut off unnecessary outer edges of the film.

Japanese Patent Application Laid-Open No. 2008-282906 (Patent Document 4) relates to a method of manufacturing a solar cell module in which a solar cell is sealed with a resin between a substrate and a film, and the substrate, the solar cell, A first sealing resin sheet that covers substantially the entire surface of the substrate is disposed between, and a second sealing resin sheet that covers substantially the entire surface of the substrate is disposed between the film and the solar battery cell. To produce a laminated body, stack the laminated body in a plurality of stages, place a backing plate on the outer side of the film of the uppermost laminated body, exhaust air between the substrate and the film, and heat It is disclosed that the resin is melted and cooled and sealed, and the sealing resin is a kind of resin selected from the group consisting of ethylene-vinyl acetate copolymer, polyvinyl butyral, and polyurethane. It is.

Furthermore, JP 2009-99417 A (Patent Document 5) includes a barrier film for sealing an organic electronic device formed on a substrate, and a hot melt type is provided between the organic electronic device and the barrier film. An organic electronic device sealing panel in which a member is disposed is disclosed, wherein the hot melt member includes a moisture scavenger and a wax, and the hot melt member has a thin film shape with a thickness of 100 μm or less. Yes. Japanese Patent Application Laid-Open No. 2009-99805 (Patent Document 6) discloses a hot-melt type member for organic thin-film solar cells (a hot-melt type member having a thin film shape, a plate shape, an indeterminate shape, etc.) containing a moisture scavenger and a wax. It is disclosed.

However, any of these techniques using a film-like sealant is a technique based on the premise that the sealant is in close contact with the part to be sealed or the region to be protected of the electronic device. Therefore, such a method has various problems that occur because the electronic device and the sealant are in close contact as described above, for example, the site to be sealed and the protection due to the expansion / contraction stress of the sealant. It has potential or obvious problems due to adverse effects on the area, unintended voids and incomplete adhesion.

Japanese Patent Application Laid-Open No. 2012-87292 (Patent Document 7) covers at least a part of a device with a film-like sealant containing a copolymerized polyamide resin, and heat-melts the sealant to cool it. Covering and sealing. This film-like sealant has a high followability to the uneven portion of the device, and can tightly seal over the details of the device while preventing the generation of voids. However, the technique of Patent Document 7 is also a technique for sealing and protecting the electronic device and the sealing agent in a form in which the electronic device and the sealing agent are in close contact, and is premised on the sealing agent being in close contact. Therefore, in the same manner as described above, the method described in Patent Document 7 also has problems caused by the close contact between the electronic device and the sealing agent, for example, the site to be sealed due to the expansion / contraction stress of the sealing agent. And potential problems or problems caused by unintended voids and incomplete adhesion.

JP 2000-133665 A (Claims, Examples) Japanese Patent Laid-Open No. 2001-284779 (Claims) JP-A-11-259021 (Claims, [0022]) JP 2008-282906 A (Claims) JP 2009-99417 A (Claims, [0024]) JP 2009-99805 (Claims) JP 2012-87292 A (Claims)

An object of the present invention is to provide a sealing member capable of selectively and effectively sealing and protecting a predetermined portion of a substrate (mounting substrate, device) including a component (a mounting component such as an electronic component), and covering with the sealing member And a sealed mounting substrate (protective substrate) and a manufacturing method thereof.

Another object of the present invention is to seal a substrate (mounting substrate, device) provided with a component (mounting component such as an electronic component) with a high adhesion force, and also according to temperature fluctuations under use conditions. It is in providing the sealing member which can protect a part effectively, the mounting board | substrate (protection board | substrate) sealed with this sealing member, and its manufacturing method.

Still another object of the present invention is a sealing member that is excellent in productivity, does not damage the mounted electronic component even if the sealing and protection area is large area, and can prevent corrosion and short circuit of the electronic circuit, It is providing the mounting board | substrate (protection board | substrate) sealed with this sealing member, and its manufacturing method.

Another object of the present invention is to provide a sealing member that does not require work such as excision of the outer edge of the film, even if it has a form such as a film, and is mounted and sealed with this sealing member It is providing a board | substrate and its manufacturing method.

As described above, all the conventional methods are based on the recognition that if there is a void between the substrate and / or the component and the sealing resin, moisture, gas or the like enters and the sealing performance is lowered. It is assumed that the sealing resin is closely adhered to the component and / or the substrate and sealing is performed without forming a void. However, in such a method, since the component, the substrate, and the solder portion are closely bonded to the sealing resin, the expansion / contraction stress of the sealing resin acts directly on the component and the solder portion, and the solder portion Cracks or cracks can occur. Furthermore, there is a risk that voids are inevitably generated.

As a result of intensive studies to achieve the above-mentioned problems, the present inventors have made the sealing resin follow the shape of the component and the board, and the sealing area of the mounting board is tightly adhered over the whole and sealed. The present invention was completed by further developing the invention according to Patent Document 7, with an idea completely different from the idea of doing. That is, only the peripheral part of the sealing member of a predetermined form such as a film is thermally bonded to the predetermined part of the device (peripheral part of the sealed region), and the inner region of the sealing member is released from the mounting component. Covering the device with the form can not only prevent the generation of voids, but also effectively prevent the thermal expansion / contraction stress from acting on the mounting parts and solder part, and the mounting substrate while sealing tightly with high adhesion force We found that we can protect effectively.

In the sealed device of the present invention, the area to be sealed of the device is sealed with a sealing member. The sealing device has a film-like or tray-like form, and at least a peripheral portion of the sealing member includes a thermoplastic resin; the sealing member is separated from a mounting component of the device, and the sealing device The periphery of the stop member is bonded to the device. That is, inside the sealed area of the device, the sealing member is separated from the device (including circuits and mounting components) to form a free space; the peripheral edge of the sealing member is bonded to the substrate of the device And the sealing part which seals a to-be-sealed area in the peripheral part of the to-be-sealed area of a device is formed.

At least the peripheral portion of the sealing member includes a thermoadhesive thermoplastic resin (for example, a copolymerized polyamide resin), and may have a film shape or a tray shape. Further, only the peripheral portion of the sealing member may be thermally bonded to the device substrate.

Further, the film-like or tray-like sealing member may have a peripheral portion that can be in line contact or surface contact with the substrate of the device, and includes a copolymerized polyamide resin having at least one of the following characteristics. Also good.

(1) Melting point or softening point is about 75 to 160 ° C. (for example, melting point is 90 to 160 ° C.) (2) Crystallinity (3) Crystallinity and melting point of about 90 to 160 ° C.

Further, the sealing member may be a multi-component copolymer, for example, a copolymer polyamide resin of a binary copolymer to a quaternary copolymer (for example, binary or ternary copolymer). The copolymerized polyamide resin may have at least one unit described below.

(A) a unit derived from a long chain component having a C _8-16 alkylene group (eg, a C _10-14 alkylene group) (b) at least selected from C _9-17 lactam and amino C _9-17 alkane carboxylic acid Units derived from one component (c) Units derived from at least one component selected from laurolactam, aminoundecanoic acid and aminododecanoic acid.

Furthermore, the sealing member may have a laminated structure as well as a single layer structure, for example, a sealing layer containing a copolymerized polyamide-based resin, laminated on one surface of the sealing layer, and And a protective layer formed of a heat resistant resin. The heat resistant resin may have, for example, a melting point or softening point of 170 ° C. or higher, and the heat resistant resin may be at least one selected from a polyester resin, a polyamide resin, and a fluororesin. . The thickness (total thickness) of the sealing member may be, for example, about 10 to 1000 μm. The sealing member of the present invention may be applied to both sides of the device, but is useful for application to one side of the device.

The present invention also includes a method of manufacturing a sealed device in which a sealed region of the device is sealed with a sealing member. In this method, a sealing member having a film shape or a tray shape and having at least a peripheral portion containing a thermoplastic resin is used. Then, in a form in which the sealing member is separated from the device mounting component inside the sealed region, the peripheral portion of the sealing member is adhered to the substrate of the device (peripheral portion of the sealed region), and the sealing member A device is manufactured in which the sealed area of the device is covered and sealed.

In the manufacturing method, at least a peripheral portion of the sealing member covers a region to be sealed of the device with a sealing member (a sealing member in the form of a film or a tray) containing a copolymerized polyamide resin, and the sealing member The peripheral edge of the substrate may be cooled by being thermally bonded to the substrate of the device.

Furthermore, the present invention also includes a sealing member for sealing the sealed area of the device. The sealing member is formed into a film shape or a tray shape, and the peripheral portion includes a thermoplastic resin. The sealing member includes an inner region for forming a free space without adhering to the device; and a peripheral portion (peripheral portion adjacent to the inner region) that can be bonded to the substrate of the device. ing. The sealing member may include a peripheral portion (adhesive portion) that can be thermally bonded (or thermally fused) to the substrate of the device, and at least the peripheral portion may include a copolymerized polyamide resin. .

In this specification, the term “copolymerized polyamide resin” refers to not only a copolymer (copolyamide) of a plurality of amide-forming components having different types or carbon numbers, which are amide-forming components that form a homopolyamide. , And is used to include a mixture of a plurality of different types of copolymers (copolyamides) formed from a plurality of amide-forming components.

The term “device” means a functional member (electrical or electronic member) that is required to be protected by sealing, and an electronic component such as a functional element or an electric circuit (including a semiconductor circuit) is formed. And a substrate on which components (electronic components such as functional elements) are mounted, for example, a printed wiring board on which electronic components are mounted or mounted. The “device” usually has a flat portion in many cases.

“Free” means that the device is not substantially bonded to the device, and the sealing member of the free space may be in physical contact with the component of the device and, if necessary, the substrate.

In the present invention, the sealing member is separated from the device (circuit, component, etc.) inside the sealed region of the device (forms a free space), and the periphery of the sealing member is the base substrate of the sealed region. The device is sealed in a bonded form, and the mounted component and the solder part are not sealed by being molded with a sealing resin. Therefore, the predetermined part of the device can be selectively and effectively sealed and protected. In particular, since the bonding area of the sealing member to the substrate is small, generation of voids can be suppressed, and stress does not act on the mounting component and the solder part even if the temperature fluctuates under use conditions. Therefore, the corrosion and short circuit of the circuit can be prevented, and the mounted component and the solder portion can be protected from damage. Moreover, since at least the peripheral portion of the sealing member contains a thermoplastic resin (particularly, a thermoadhesive thermoplastic resin such as a copolymerized polyamide-based resin), the peripheral portion of the sealed region can be sealed with high adhesion. . Furthermore, even if the sealed area (sealing and protection area) is a large area, the mounted electronic component is not damaged, and corrosion and short circuit of the electronic circuit can be prevented. Further, it is not necessary to melt or vacuum-form the entire film or powder resin, and the adhesion area of the sealing member to the substrate can be substantially reduced, so that the productivity of the sealing device can be improved. Furthermore, since it is sufficient to use a sealing member having a size suitable for the region to be sealed, it is not necessary to cut off the outer edge of the film. Even if the sealing is performed in the above-described form, the mounting component and the solder part can be effectively protected from moisture by the thermoplastic resin sealing member. Thus, according to the present invention, the device can be effectively protected with high reliability simply and reliably.

FIG. 1 is a schematic side view showing an example of the sealing device of the present invention. FIG. 2 is a schematic side view showing another example of the sealing device of the present invention. FIG. 3 is a schematic plan view showing the test substrate used in the examples.

[Sealing member]
The sealing member for sealing the sealed region of the device has at least a peripheral portion containing a thermoplastic resin. In the present invention, the peripheral portion (or outer edge portion) of the sealing member is sealed with the device. Adhere to the substrate in the area. Therefore, even if thermal bonding is used, damage to the device due to heat is small, and not only a sealing member having a low melting point or a low softening point, but a thermoplastic resin having a relatively high melting point or a high softening point can be used. Therefore, the type of thermoplastic resin is not particularly limited, and various thermoplastic resins can be used. For example, olefin resin [low density, medium density or high density polyethylene, polyethylene such as linear low density polyethylene, ethylene-propylene, etc. Ethylene copolymer of ethylene and copolymerizable monomer such as copolymer, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) acrylic acid ester copolymer, ethylene-vinyl acetate copolymer Polyethylene resins such as polypropylene; Polypropylene resins such as polypropylene and propylene-ethylene copolymers; Cyclic olefin resins such as ethylene-norbornene copolymers], acrylic resins, styrene resins, polyester resins (ethylene terephthalate) , Alkylene arylate units such as butylene terephthalate Including such copolyester), and polyamide-based resin (a copolymer polyamide resin), etc. can be used. These thermoplastic resins can be used alone or in combination of two or more.

A preferred thermoplastic resin is a thermoadhesive thermoplastic resin that can be firmly bonded at a relatively low temperature when the sealing member is thermally bonded to the substrate, for example, an olefin resin, a copolyester containing an alkylene arylate unit, particularly a film. It is a copolymerized polyamide resin from the viewpoints of strength, chemical resistance, film-forming property, adhesion to a substrate (fusibility), and the like. Moreover, the sealing member containing the copolymerized polyamide-based resin can improve adhesion to the device, can impart high impact resistance and wear resistance to the device, and can enhance the protective effect on the device. The copolymerized polyamide-based resin includes a copolymerized polyamide (thermoplastic copolymerized polyamide) and a polyamide elastomer.

The thermoplastic copolymer polyamide may be an alicyclic copolymer polyamide, but is usually an aliphatic copolymer polyamide in many cases. The copolymerized polyamide can be formed by combining a diamine component, a dicarboxylic acid component, a lactam component, and an aminocarboxylic acid component. Both the diamine component and the dicarboxylic acid component can form an amide bond of the copolymerized polyamide, and the lactam component and the aminocarboxylic acid component can each independently form an amide bond of the copolymerized polyamide. Therefore, the copolymerized polyamide can be obtained by copolymerization of a plurality of amide-forming components selected from a pair of components (both components combining a diamine component and a dicarboxylic acid component), a lactam component, and an aminocarboxylic acid component. . The copolymerized polyamide is at least one amide-forming component selected from the pair of components, lactam component, and aminocarboxylic acid component, and is different from the amide-forming component (or the same type and different in carbon number). It can be obtained by copolymerization with an amide-forming component. In addition, the lactam component and the aminocarboxylic acid component may be handled as equivalent components as long as they have the same carbon number and branched chain structure.

Therefore, when a pair of components obtained by combining a diamine component and a dicarboxylic acid component is a first amide-forming component, and a lactam component and an aminocarboxylic acid component are second amide-forming components, for example, A copolymerized polyamide comprising an amide-forming component, wherein at least one of a diamine component and a dicarboxylic acid component is composed of a plurality of components having different carbon numbers; a first amide-forming component, and a second A copolymerized polyamide with an amide-forming component (at least one component selected from a lactam component and an aminocarboxylic acid component); a second amide-forming component (at least one component selected from a lactam component and an aminocarboxylic acid component) A copolyamide formed, one of a lactam component and an aminocarboxylic acid component It may be a copolyamide of the same carbon number or different lactam component and aminocarboxylic acid component; components are different copolyamide composed of a plurality of components of the carbon number.

Examples of the diamine component include aliphatic diamine or alkylene diamine components (for example, C _4-16 alkylene diamine such as tetramethylene diamine, hexamethylene diamine, trimethyl hexamethylene diamine, octamethylene diamine, and dodecane diamine). These diamine components can be used alone or in combination of two or more. A preferred diamine component contains at least an alkylene diamine (preferably a C _6-14 alkylene diamine, more preferably a C _6-12 alkylene diamine).

If necessary, as the diamine component, an alicyclic diamine component (diaminocycloalkane such as diaminocyclohexane (diamino C _5-10 cycloalkane etc.); bis (4-aminocyclohexyl) methane, bis (4-amino-) Bis (aminocycloalkyl) alkanes such as 3-methylcyclohexyl) methane and 2,2-bis (4′-aminocyclohexyl) propane [bis (aminoC _5-8 cycloalkyl) C _1-3 alkane etc.]; hydrogenated Xylylenediamine etc.) and aromatic diamine components (metaxylylenediamine etc.) may be used in combination. The diamine component (for example, an alicyclic diamine component) may have a substituent such as an alkyl group (C _1-4 alkyl group such as a methyl group or an ethyl group).

The proportion of the alkylenediamine component is 50 to 100 mol%, preferably 60 to 100 mol% (eg 70 to 97 mol%), more preferably 75 to 100 mol% (eg 80 to 95 mol%).

Examples of the dicarboxylic acid component include aliphatic dicarboxylic acid or alkane dicarboxylic acid components (for example, about 4 to 36 carbon atoms such as adipic acid, pimelic acid, azelaic acid, sebacic acid, dodecanedioic acid, dimer acid or hydrogenated product thereof). And dicarboxylic acid or _C4-36 alkanedicarboxylic acid). These dicarboxylic acid components can be used alone or in combination of two or more. Preferred dicarboxylic acid components include C _6-36 alkane dicarboxylic acids (eg, C _6-16 alkane dicarboxylic acids, preferably C _8-14 alkane dicarboxylic acids, etc.). Further, if necessary, an alicyclic dicarboxylic acid component (such as C _5-10 cycloalkane-dicarboxylic acid such as cyclohexane-1,4-dicarboxylic acid, cyclohexane-1,3-dicarboxylic acid, etc.), aromatic dicarboxylic acid ( Terephthalic acid, isophthalic acid, etc.) may be used in combination. As the diamine component and dicarboxylic acid component, an alicyclic ring obtained by using the aliphatic diamine component and / or aliphatic dicarboxylic acid component exemplified above together with the alicyclic diamine component and / or alicyclic dicarboxylic acid component. The group polyamide resin is known as so-called transparent polyamide, and has high transparency.

The proportion of the alkanedicarboxylic acid component is 50 to 100 mol%, preferably 60 to 100 mol% (eg 70 to 97 mol%), more preferably 75 to 100 mol% (eg 80 About 95 mol%).

In the first amide-forming component, the diamine component can be used in a range of about 0.8 to 1.2 mol, preferably about 0.9 to 1.1 mol, relative to 1 mol of the dicarboxylic acid component.

Examples of the lactam component include C such as δ-valerolactam, ε-caprolactam, ω-heptalactam, ω-octalactam, ω-decane lactam, ω-undecanactam, ω-laurolactam (or ω-laurinlactam). such as _4-20 lactam. Examples of the aminocarboxylic acid component, for example, .omega.-aminodecanoic acid, .omega.-aminoundecanoic acid, C _6-20 aminocarboxylic acids such as .omega.-aminododecanoic acid can be exemplified. These lactam components and aminocarboxylic acid components can also be used alone or in combination of two or more.

Preferred lactam components include C _6-19 lactam, preferably C _8-17 lactam, more preferably C _10-15 lactam (such as laurolactam). Preferred aminocarboxylic acids are amino C _6-19 alkanecarboxylic acids, preferably amino C _8-17 alkanecarboxylic acids, more preferably amino C _10-15 alkanecarboxylic acids (aminoundecanoic acid, aminododecanoic acid, etc.). Contains.

The copolymerized polyamide may be a modified polyamide such as a polyamide having a branched chain structure using a small amount of a polycarboxylic acid component and / or a polyamine component.

A first amide-forming component (both components combining a diamine component and a dicarboxylic acid component) and a second amide-forming component (at least one amide-forming component selected from a lactam component and an aminocarboxylic acid component) The ratio (molar ratio) can be selected from the range of the former / the latter = 100/0 to 0/100, for example, 90/10 to 0/100 (for example, 80/20 to 5/95), preferably 75/25. It may be about 10/90 (for example, 70/30 to 15/85), more preferably about 60/40 to 20/80.

Furthermore, the copolymerized polyamide preferably includes a long chain component having a long chain fatty chain (long chain alkylene group or alkenylene group) as a constituent unit (or includes a unit derived from the long chain component). Such a long chain component includes a long chain fatty chain having about 8 to 36 carbon atoms or a component having an alkylene group (preferably a C _8-16 alkylene group, more preferably a C _10-14 alkylene group). Examples of the long chain component include C _8-18 alkane dicarboxylic acid (preferably C _10-16 alkane dicarboxylic acid, more preferably C _10-14 alkane dicarboxylic acid, etc.), C _9-17 lactam (preferably laurolactam, etc.) And _C11-15 lactams) and amino C _9-17 alkanecarboxylic acids (preferably amino C _11-15 alkanecarboxylic acids such as aminoundecanoic acid and aminododecanoic acid). These long chain components can be used alone or in combination of two or more. Of these long-chain components, at least one component selected from a lactam component and / or an aminoalkanecarboxylic acid component such as laurolactam, aminoundecanoic acid and aminododecanoic acid is often used. Copolyamides containing such component-derived units have high water resistance and are excellent in adhesion, wear resistance and impact resistance to electronic devices, and can effectively protect electronic devices.

The ratio of the long chain component is 10 to 100 mol% (for example, 25 to 95 mol%), preferably 30 to 90 mol% (for example, 40 to 85 mol%) with respect to the whole monomer component forming the copolymer polyamide. Mol%), more preferably about 50 to 80 mol% (for example, 55 to 75 mol%).

Further, the copolyamide may be a multi-component copolymer of the amide-forming component, for example, a binary copolymer to a quaternary copolymer, but is usually a binary copolymer to a quaternary copolymer. In many cases, the polymer is a binary copolymer or a ternary copolymer.

The copolymerized polyamide often includes, for example, an amide-forming component selected from polyamide 11, polyamide 12, polyamide 610, polyamide 612, and polyamide 1010 as a constituent unit (or a unit derived from the amide-forming component). The copolymerized polyamide may be a copolymer of a plurality of these amide-forming components, and the one or more amide-forming components and other amide-forming components (at least one selected from polyamide 6 and polyamide 66). It may be a copolymer with an amide-forming component or the like).

Specifically, examples of the copolyamide include copolyamide 6/11, copolyamide 6/12, copolyamide 66/11, copolyamide 66/12, copolyamide 610/11, copolyamide 612/11, copolyamide Polyamide 610/12, copolyamide 612/12, copolyamide 10/10/12, copolyamide 6/11/610, copolyamide 6/11/612, copolyamide 6/12/610, copolyamide 6/12/612, etc. Can be mentioned. These copolyamides can be used alone or in combination of two or more. In these copolyamides, the component separated by a slash “/” indicates an amide-forming component.

As described above, the sealing member may have at least one unit described below.

(A) a unit derived from a long chain component having a C _8-16 alkylene group (b) a unit derived from at least one component selected from C _9-17 lactam and amino C _9-17 alkanecarboxylic acid (c) Units derived from at least one component selected from laurolactam, aminoundecanoic acid and aminododecanoic acid. As a polyamide elastomer (polyamide block copolymer), a polyamide segment (for example, polyamide 11) as a hard segment (or hard block) is used. , Polyamide 12, polyamide 610, polyamide 612 and polyamide segment derived from an amide-forming component selected from polyamide 1010) and a soft block (or soft block) polyamide block copolymer, for example, polyamide Polyether block copolymer, polyamide - polyester block copolymer, a polyamide - like polycarbonate block copolymer. A typical polyamide elastomer is a polyamide-polyether block copolymer, for example, a polyether amide [eg, a polyamide block having a diamine end and a polyalkylene glycol block having a dicarboxyl end (or polyoxyalkylene block) Block copolymers, block copolymers of polyamide blocks having dicarboxyl ends and polyalkylene glycol blocks having diamine ends (or polyoxyalkylene blocks)], polyetheresteramides [polyamide blocks having dicarboxyl ends] And a block copolymer of a dialkylene-terminated polyalkylene glycol block (or polyoxyalkylene block) and the like. Examples of the polyether (polyether block) include polyalkylene glycol (for example, poly C _2-6 alkylene glycol such as polyethylene glycol, polypropylene glycol, polytetramethylene glycol, preferably poly C _2-4 alkylene glycol). Can be mentioned. The polyamide elastomer may have an ester bond.

In the polyamide elastomer, the number average molecular weight of the soft segment (polyether block or the like) can be selected from the range of, for example, about 100 to 10,000, preferably 300 to 6000 (for example, 300 to 5000), more preferably 500 to 4000 ( For example, it may be about 500 to 3000), particularly about 1000 to 2000.

In the polyamide elastomer, the ratio (weight ratio) between the polyamide block (polyamide segment) and the soft segment (or block) is, for example, the former / the latter = 75/25 to 10/90, preferably 70/30 to 15 / 85, more preferably 60/40 to 20/80 (for example, 50/50 to 25/75).

These copolyamide resins may be used alone or in combination of two or more. Of these copolymer polyamide resins, copolymer polyamides (non-polyamide elastomers or polyamide random copolymers) are preferable from the viewpoint of sealing properties of electronic devices. In particular, amide-forming components derived from polyamide 12 are constituent units. Copolyamides included as are preferred.

The amino group concentration of the copolymerized polyamide resin is not particularly limited, and may be, for example, about 10 to 300 mmol / kg, preferably about 15 to 280 mmol / kg, and more preferably about 20 to 250 mmol / kg. When the amino group concentration of the copolymerized polyamide-based resin is high, the adhesiveness can be improved when another layer (such as a protective layer described later) is laminated on the sealing member, which is advantageous.

The carboxyl group concentration of the copolymerized polyamide resin is not particularly limited, and may be, for example, about 10 to 300 mmol / kg, preferably about 15 to 280 mmol / kg, and more preferably about 20 to 250 mmol / kg. When the terminal carboxyl group concentration of the copolymerized polyamide resin is high, the thermal stability is high, which is advantageous in terms of long-term stability (continuous processability).

The number average molecular weight of the copolymerized polyamide resin can be selected from the range of, for example, about 5,000 to 200,000, for example, 6000 to 100,000, preferably 7000 to 70000 (for example, 7000 to 15000), and more preferably 8000 to 40,000 (for example, 8000 to 12000), and usually about 8000 to 30000. The molecular weight of the copolymerized polyamide resin can be measured in terms of polymethyl methacrylate by gel permeation chromatography using HFIP (hexafluoroisopropanol) as a solvent.

The amide bond content of the copolymerized polyamide-based resin can be selected, for example, from a range of 100 units or less per copolymerized polyamide-based resin, and is 30 to 90 units, preferably 40 to 80 units, from the viewpoint of device sealing performance. More preferably, it may be about 50 to 70 units (for example, 55 to 60 units). The amide bond content can be calculated, for example, by dividing the number average molecular weight by the molecular weight of the repeating unit (1 unit).

The copolymerized polyamide resin may be amorphous or may have crystallinity. The degree of crystallinity of the copolymerized polyamide resin is, for example, 20% or less (eg, 1 to 18%), preferably 15% or less (eg, 2 to 13%), more preferably 10% or less (eg, 2 to 2%). 8%). The crystallinity can be measured by a conventional method, for example, a measurement method based on density or heat of fusion, an X-ray diffraction method, an infrared absorption method, or the like.

The heat melting property of the amorphous copolymerized polyamide resin can be measured as a softening temperature with a differential scanning calorimeter, and the melting point of the crystalline copolymerized polyamide resin can be measured with a differential scanning calorimeter (DSC).

The melting point or softening point of the copolyamide resin (or copolyamide or polyamide elastomer) is 75 to 160 ° C. (eg 80 to 150 ° C.), preferably 90 to 140 ° C. (eg 95 to 135 ° C.), Preferably, it may be about 100 to 130 ° C, and is usually about 90 to 160 ° C (eg, 100 to 150 ° C). Since the copolymerized polyamide-based resin has a low melting point or softening point and high adhesiveness, it can be melted at a relatively low temperature and firmly bonded to the device surface (substrate). The melting point of the copolymerized polyamide resin means a temperature corresponding to a single peak when each component is compatible and a single peak is generated in DSC, each component is incompatible, and DSC When a plurality of peaks occur, the temperature corresponding to the peak on the high temperature side among the plurality of peaks is meant.

As described above, the copolymerized polyamide-based resin may have at least one of the following characteristics.

(1) Melting point or softening point is 75 to 160 ° C. (2) Crystallinity (3) Crystallinity and melting point 90 to 160 ° C. In the present invention, the peripheral portion of the sealing member is bonded to the device Therefore, unlike the conventional sealing method, the thermoplastic resin does not necessarily have high melt flow characteristics. The melt flow rate (MFR) of a thermoplastic resin (for example, a copolymerized polyamide resin) is 1 to 350 g / 10 minutes, preferably 3 to 300 g / 10 minutes, more preferably at a temperature of 160 ° C. and a load of 2.16 kg. It may be about 5 to 250 g / 10 minutes.

The thermoplastic resin (for example, copolymerized polyamide-based resin) may be other resin, for example, homopolyamide (for example, homopolyamide by a component forming the copolymerized polyamide) as long as the properties such as adhesion are not impaired. May be added. The proportion of the homopolyamide is 30 parts by weight or less (for example, 1 to 25 parts by weight), preferably 2 to 20 parts by weight, and more preferably about 3 to 15 parts by weight with respect to 100 parts by weight of the copolymer polyamide resin. There may be. In the copolyamide-based resin in the form of a mixture, the polyamides may be compatible with each other.

The sealing member may contain the other thermoplastic resin, for example, ethylene-vinyl acetate copolymer, if necessary. The ratio of the other resin is, for example, 100 parts by weight or less (eg, about 1 to 80 parts by weight), preferably 2 to 70 parts by weight, more preferably 2 to 50 parts per 100 parts by weight of the copolymer polyamide resin. It may be 30 parts by weight or less (for example, about 3 to 20 parts by weight).

Thermoplastic resins (for example, copolymerized polyamide-based resins) are optionally added with various additives such as fillers, stabilizers (heat stabilizers, weathering stabilizers, etc.), colorants, plasticizers, lubricants, flame retardants, An antistatic agent, a heat conductive agent, and the like may be included. The additives may be used alone or in combination of two or more. Of these additives, stabilizers, heat conducting agents and the like are widely used.

As described above, the sealing member of the present invention includes a copolymerized polyamide resin, a mixture of a plurality of copolymerized polyamide resins, or a copolymerized polyamide resin and other components (such as a homopolyamide and an additive). You may form with a mixture (copolymerization polyamide-type resin composition).

The sealing member of the present invention is formed into a film shape (or a sheet shape) or a tray shape (or a case shape). The film-like or tray-like sealing member only needs to have a peripheral portion containing the thermoplastic resin (such as a heat-adhesive resin such as a copolyamide-based resin) in order to improve the bondability with the substrate. The periphery may be in line or surface contact with the substrate of the device. Note that at least the peripheral portion of the sealing member (particularly, the contact portion with the substrate) may be formed of the thermoplastic resin, and the peripheral portion of the sealing member (contact portion with the substrate) may be formed of the thermoplastic resin. A film may be formed, but usually the entire sealing member including the peripheral portion often contains the thermoplastic resin.

The sealing member in such a form includes an inner region for forming a free space without adhering to a device (circuit or mounting component of the substrate); Peripheral edge adjacent to the inner area). In the free space, the sealing member does not adhere to the device, and stress due to the sealing member can be prevented from acting on the device (such as a mounted component in the free space). Moreover, since only the peripheral part of the sealing member can be bonded to the substrate of the device, generation of voids can be greatly reduced, and circuit corrosion and short-circuiting can be effectively prevented. In addition, the sealing region of the device can be selectively sealed. That is, the peripheral part of the desired sealing region (a specific part or all of the device) of the device can be sealed with high adhesion by the thermoplastic resin of the sealing member.

The film-like (or sheet-like) sealing member may be an unstretched film or a stretched film (uniaxial or biaxially stretched film). The stretch ratio of the film may be, for example, about 1.2 to 10 times (preferably 1.5 to 7 times, more preferably 2 to 5 times) in one direction. The film-like sealing member can be produced by using a conventional film forming method, for example, a casting method, an extrusion molding method, a blow molding method, or the like. If necessary, the film may be stretched at a predetermined magnification using a uniaxial or biaxial stretching machine.

The thickness of the single-layer film-shaped sealing member can be selected from the range of, for example, about 1 to 1000 μm, and is usually 5 to 500 μm (for example, 5 to 300 μm), preferably 10 to 250 μm (for example, 25 to 200 μm), More preferably, it may be about 50 to 200 μm (for example, 75 to 150 μm). If the thickness is too small, the mounted component may not be effectively protected in the sealed region, and if the thickness is too large, the adhesion of the sealing member to the substrate may be reduced.

The water vapor permeability (40 ° C., 90% RH) of the single-layer film-shaped sealing member is, for example, 100 g / m ² / day or less, preferably 50 g / m ² / day or less (for example, 0) in terms of 1 mm thickness. .About 0.01-30 g / m ² / day). In particular, a sealing member containing a copolymerized polyamide has excellent water vapor barrier properties, and the water vapor permeability is, for example, 0.01 to 2 g / m ² / day, preferably 0.05 to 1.5 g in terms of a thickness of 1 mm. / M ² / day, more preferably about 0.1 to 1 g / m ² / day. The water vapor permeability can be measured by a conventional method, for example, the cup method of JIS Z0208.

Further, the film-like sealing member may be a single layer film or a laminated film (or laminated sheet). The laminated film is not particularly limited as long as it includes at least a sealing layer formed of the thermoplastic resin (for example, a sealing layer formed of a copolymerized polyamide-based resin). For example, the thermoplastic resin A sealing layer including (a thermoadhesive thermoplastic resin such as a copolymerized polyamide-based resin) and a protection layered on one surface of the sealing layer and formed of a heat-resistant resin (or hydrophobic resin) Layer (heat-resistant resin layer or hydrophobic resin layer). The protective layer may be laminated over the entire surface of the sealing layer, except for the peripheral portion of the sealing layer (the portion corresponding to the peripheral portion of the sealing member) (that is, in the inner region of the sealing layer). ) A protective layer may be laminated. In the former laminated form, the peripheral portion of the sealing member can be bonded to the device with the protective layer facing away from the device, and in the latter laminated form, the peripheral portion of the sealing member is directed toward the device side. It may be glued to the device.

A plurality of protective layers may be laminated on one surface of the sealing layer. The protective layer is used to protect the device from external adverse factors such as heat and moisture. For example, the heat-resistant resin layer can prevent the film from being broken due to the adhesion of the peripheral portion, and the hydrophobic resin layer is caused by moisture. Device corrosion can be prevented and device durability can be improved.

The heat-resistant resin is not particularly limited as long as it has heat resistance enough to withstand the bonding member's bonding temperature (or heat bonding temperature). For example, fluororesin, olefin resin (cyclic olefin resin) ), Styrene resins, aromatic polyester resins, polycarbonate resins, polyurethane resins, polyamide resins, polyimide resins (polyamideimide, polyetherimide, etc.), polyacetal resins, polyphenylene ether resins, polyethers Examples include ketone resins (for example, polyether ketone (PEK), polyether ether ketone (PEEK), etc.), polyphenylene sulfide resins, polyether sulfone resins, cellulose derivatives, aromatic epoxy resins, and the like.

These heat resistant resins may be used alone or in combination of two or more. Of these heat-resistant resins, aromatic polyester resins, polycarbonate resins, polyamide resins (such as aromatic polyamides), polyphenylene ether resins, polyphenylene sulfide resins, polyimide resins, and fluorine resins are preferable. In particular, typical heat resistant resins include polyester resins (such as aromatic polyesters), polyamide resins, and fluororesins. Examples of polyester resins include polyalkylene arylate resins [homopolyesters (eg, poly C _2-4 alkylene arylates such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate), copolyesters (eg, C _2-4 alkylene). And the like)], polyarylate resins, liquid crystal polyesters, and the like. The polyester resin also includes a polyester elastomer.

As the polyester elastomer (polyester block copolymer), a polyester block copolymer composed of an aromatic polyester as a hard segment (or hard block) and a soft segment (or soft block), for example, aromatic polyester-poly Examples include ether block copolymers, aromatic polyester-aliphatic polyester block copolymers, and the like. The aromatic polyester segment (or block) can be composed of the polyalkylene arylate resin (for example, poly C _2-4 alkylene terephthalate such as polybutylene terephthalate), and the soft segment is a polyether exemplified by the polyamide elastomer (for example, , Poly C _2-6 alkylene glycol such as polytetramethylene glycol) and the like. In the polyester elastomer, the ratio of the aromatic polyester block (hard segment) is, for example, about 25 to 95% by weight, preferably about 30 to 90% by weight (for example, 50 to 85% by weight) with respect to all segments. Also good.

As the polyamide resin, the homopolyamide (for example, polyamide 11, polyamide 12, polyamide 610, polyamide 612, polyamide 1010, polyamide 1012, etc.), a copolymer different from the copolymer polyamide resin contained in the sealing member is used. Examples thereof include polyamide resins (and polyamide elastomers). The polyamide-based resin is usually a polyamide-based resin other than the copolymerized polyamide.

Examples of the fluororesin include homopolymers such as polyvinyl fluoride (PVF), polyvinylidene fluoride (PVDF), polytrifluoroethylene (PTrFE), polychlorotrifluoroethylene, polytetrafluoroethylene (PTFE), and ethylene. -Tetrafluoroethylene copolymer (ETFE), ethylene-chlorotrifluoroethylene copolymer, tetrafluoroethylene-hexafluoropropylene copolymer, tetrafluoroethylene-perfluoropropyl vinyl ether copolymer and the like.

The heat-resistant resin may be a highly hydrophobic resin such as an olefin resin, a styrene resin, or a fluororesin.

The melting point or softening point of the heat resistant resin may be, for example, 160 ° C. or higher (for example, about 165 to 250 ° C.), preferably 170 ° C. or higher (for example, about 175 to 220 ° C.). In addition, melting | fusing point or a softening point can be measured by a conventional method, for example, a differential scanning calorimeter (DSC).

The heat distortion temperature of the heat-resistant resin can be selected from the range of 160 ° C. or less, for example, under the condition of high load (1.82 MPa) in accordance with ISO 75-1, and is 40 to 155 ° C., preferably 50 to 150 ° C. It may be a degree.

The thickness of the protective layer (when a plurality of protective layers are formed, the total thickness of each protective layer) is not particularly limited as long as the peripheral portion of the laminated film can contact the device surface. It may be about 800 μm (for example, 5 to 700 μm), preferably about 10 to 600 μm (for example, 20 to 500 μm), more preferably about 30 to 400 μm (for example, 50 to 300 μm). When the thickness of the protective layer is too small, the protective layer is easily broken and the function as the protective layer is lowered. When a plurality of protective layers are formed, the thickness of each protective layer may be, for example, about 1 to 100 μm, preferably about 5 to 50 μm.

The laminated film may be, for example, a laminated film in which a protective layer is directly formed on one surface of the sealing layer, and the protective layer is formed on one surface of the sealing layer via an adhesive layer (intermediate layer). It may be a laminated film. Further, if necessary, an intermediate layer (adhesive layer) may be interposed between the plurality of protective layers. The adhesive layer is a conventional adhesive or pressure-sensitive adhesive such as vinyl chloride adhesive, vinyl acetate adhesive, olefin adhesive, acrylic adhesive, polyester adhesive, urethane adhesive, epoxy adhesive. Alternatively, a rubber adhesive may be used. The thickness of the adhesive layer is not particularly limited, and may be, for example, 1 to 50 μm (for example, 3 to 30 μm), preferably about 2 to 10 μm.

The thickness (total thickness) of the sealing member including the laminated film may be, for example, about 10 to 1000 μm, preferably 30 to 800 μm, and more preferably about 50 to 500 μm.

The thickness ratio between the sealing layer and the protective layer (when there are a plurality of protective layers and / or adhesive layers, the total thickness of each layer) is the former / the latter = 5/95 to 95/5 (for example, 10/90 to 90/90), for example, 10/90 to 90/10 (for example, 10/90 to 80/20), preferably 15/85 to 70/30 (for example, 15/85 to 60 / 40), more preferably about 20/80 to 50/50 (for example, 20/80 to 40/60).

The laminated film can improve properties such as heat resistance, chemical resistance and water resistance as compared with a single layer film. For example, the heat distortion temperature (maximum use temperature) of the laminated film is, for example, about 160 to 300 ° C., preferably 170 to 280 ° C., and more preferably about 180 to 250 ° C. When the heat distortion temperature of the single layer film is 100, the heat distortion temperature of the laminated film is, for example, about 120 to 200, preferably about 125 to 180, and more preferably about 130 to 160. The heat deformation temperature means the minimum temperature at which the film is deformed by heat treatment for 15 seconds.

In addition, the laminated film is chemically resistant to both organic components (for example, aliphatic hydrocarbons, aromatic hydrocarbons, alcohols, ketones, etc.) and inorganic components (for example, inorganic acids such as hydrochloric acid). In particular, chemical resistance against alcohols such as methanol can be improved.

Laminated films can be obtained by conventional methods such as lamination (heat lamination, dry lamination, etc.), co-extrusion using a general-purpose feedblock die or multi-manifold die, coating (including printing such as screen printing). For example, it can be prepared by laminating a sealing layer and a protective layer.

In the sealing of devices with large irregularities or undulations on the surface, the preferred form of the sealing member is a tray. This tray-shaped sealing member usually includes an accommodating portion (accommodating concave portion) that can be accommodated by covering the mounted component in accordance with the height of the mounted component of the device, and an outer peripheral edge portion (a collar portion) extending from the accommodating portion. ). The accommodating portion (accommodating concave portion) has, for example, a curved and swollen shape (a shape such as an inverted U-shaped cross section or a mountain shape), a wall surface and a ceiling wall depending on the component mounting form. The sealing member may have a single storage part (accommodation concave part), adjacent to each other or at a predetermined interval. You may have a some accommodating part (accommodating recessed part). Moreover, it is preferable that the peripheral part (ridge part) of a sealing member is surface contactable with the board | substrate of a device. The peripheral part of the film-like or tray-like sealing member may be adhered to the substrate with an adhesive if necessary, but is preferably adhered by thermal bonding. In particular, the peripheral edge portion (ridge portion) of the tray-shaped sealing member may be capable of being thermally bonded or thermally fused to the substrate of the device. It should be noted that at least the peripheral edge of the sealing member only needs to be bonded to the substrate of the device. In a sealing member having a plurality of receiving recesses, the portion between the receiving recesses is also bonded to the device substrate as necessary. It may be.

The method for molding the sealing member into a tray shape is not particularly limited, and the tray-shaped sealing member is formed of the single-layer or laminated film-shaped (or sheet-shaped) sealing member by a conventional container molding method such as pressure forming. It can be prepared by molding into a predetermined shape by a molding method such as vacuum molding. Note that the tray-shaped sealing member does not necessarily have a shape along the electronic component mounted on the electronic device.

The sealing member may be applied to both sides of the device if necessary, but is usually applied to one side of the device.

[Sealing device]
In the sealing device of the present invention, the sealed region of the device is sealed with the sealing member, but the sealing member is separated from the mounting component of the device, and the peripheral portion of the sealing member is Adhered to the device. That is, on the inner side (inner region) of the sealed region of the device, the sealing member is separated from the device (substrate circuit, mounted component, etc.) to form a free space; the periphery of the sealed region of the device In the portion, the peripheral portion of the sealing member is bonded to the substrate of the device to form a sealing portion. In such a sealing form, even if the sealing member is in physical contact with the mounting component or the like in the free space, the adhesive strength between the sealing member and the mounting component is substantially “0”. The stress by the sealing member does not substantially act on the device in the space. Furthermore, since the peripheral edge of the sealing member is in close contact with the substrate, the free space forms a buffer space filled with a gas such as air, and the mounted parts in the free space are made more effective by the buffering property of the gas. Can protect. In particular, when the sealing member is formed of a thermoplastic resin having flexibility (particularly, a thermoadhesive thermoplastic resin such as a copolymerized polyamide-based resin), the sealed area of the substrate is formed by a balloon-shaped sealing member. Even if an external force is applied, the balloon-like sealing member and the buffer space can protect the mounted components in the free space. Moreover, since the peripheral part of the sealing member is bonded to the device substrate, the generation of voids can be greatly reduced. Therefore, circuit corrosion and short circuit can be effectively prevented. In particular, when a thermoadhesive thermoplastic resin (such as the above-mentioned copolymerized polyamide resin) is used as the thermoplastic resin of the sealing member, the peripheral portion of the desired sealing region of the device is bonded to the sealing member with high adhesion. Can be sealed. In addition, a predetermined part (sealing region) of the device can be selectively sealed according to the mounting component and the mounting form of the component.

FIG. 1 is a schematic side view showing an example of the sealing device of the present invention.

In this example, a plurality of electronic components 3 a to 3 c are mounted or mounted on the substrate 2 to form the electronic device 1. On the other hand, the tray-shaped sealing member 11 covers the predetermined sealing area of the electronic device 1 and can be accommodated, and extends outward (sideward direction) from the opening periphery of the accommodating recess, and the electronic device 1 substrate 2 and a peripheral edge portion 13 that can be bonded.

And the predetermined sealing area | region of the electronic device 1 is covered with the tray-shaped sealing member 11 arrange | positioned with the opening part facing the board | substrate direction, and the peripheral part 13 of the sealing member 11 is electronic over a perimeter. It is thermally bonded to the substrate 2 of the device 1 to seal the sealing region. In such a sealing form, the mounting components 3a to 3c of the electronic device 1 are accommodated in the accommodating recess 12 of the sealing member 11, and the mounting components 3a to 3c including the substrate part 2 in the sealing region are sealed. A free space 15 is formed between the stopper member 11 and the stopper member 11.

FIG. 2 is a schematic side view showing another example of the sealing device of the present invention. In addition, the same code | symbol is attached | subjected and demonstrated to the same member or element as FIG.

In this example, the sealing member 21 includes a plurality of receiving

recesses

22a and 22b having different depths and volumes, and a plurality of receiving recesses depending on the mounting and arrangement form of the plurality of electronic components 3a to 3c in the device 1. A contact portion 24 that extends in a curved or bent direction toward the substrate and that can contact the substrate 2 of the device 1, and a peripheral portion 23 that is formed on the outer peripheral portion and can contact the device 1. In such a sealing member 21, a plurality of regions to be sealed are covered with a plurality of receiving

recesses

22 a and 22 b, and a portion (contact portion) between the peripheral edge 23 of the sealing member 21 and the plurality of receiving

recesses

22 a and 22 b. 24 can be bonded to the substrate 2 of the device 1, and free spaces (or buffer spaces) 25 a and 25 b can be formed by the receiving recesses 22 a and 22 b.

In this way, it is sufficient that at least the peripheral edge of the sealing member is bonded to the substrate of the device, and not only the sealing member having one or a plurality of housing recesses, but also a film-like sealing member, if necessary, It may be bonded (or thermally bonded) to the substrate in a spot shape or a linear shape (or a strip shape) even in the inner region of the sealing member as long as it does not adversely affect components and circuits.

In the sealing device, at least the peripheral part of the sealing member is bonded to the substrate of the device, thereby closing the sealing part in a frame shape (frame shape such as a square frame, a polygonal frame, a loop shape). (Closed sealing part) is formed. In particular, in the sealing device of the present invention, only the peripheral portion of the sealing member is often bonded (or thermally bonded) to the substrate of the device. Moreover, the peripheral part of the sealing member can be sealed (or bonded) to the substrate with a predetermined width, and may be sealed (or bonded) in a linear or belt-like form.

[Method of manufacturing sealing device]
In the method of the present invention, the predetermined sealing region of the device is covered with the sealing member separated from the mounting component in the sealing region of the device, and the peripheral portion of the sealing member is bonded to the substrate of the device. Thus, a device in which the sealed region of the device is covered and sealed with the sealing member can be manufactured. That is, in the method of the present invention, the predetermined sealing region of the device is covered with a sealing member in the form of a film (or sheet) or a tray, and the step of adhering the peripheral portion of the sealing member In the case where the peripheral portion of the sealing member is heated and melted and thermally bonded, a step of further cooling is included, and through such a step, the sealing member is formed in the region to be sealed. Can be manufactured in a form free from the mounted component, and a sealing device in which the peripheral portion of the sealed region is sealed with a sealing member can be manufactured.

Examples of the device include various organic or inorganic devices such as semiconductor elements, electroluminescence (EL) elements, light emitting diodes, precision components such as solar cells, circuit boards on which circuits (including filter circuits) are formed, Examples include electronic components (particularly precision electronic components or electronic devices) such as printed circuit boards (printed substrates) on which various electronic components or components such as electronic elements (capacitors, filters, etc.) are mounted.

In the covering step, the area to be sealed of the device may be covered with a sealing member, and the entire area of one surface of the device or a specific area of the device (electronic component mounting area, wiring area, etc.) may be covered. In this covering step, the peripheral edge of the sealing member is preferably in line or surface contact with the substrate.

In addition, when the unevenness (or undulation) due to the electronic components on the substrate is not so large, for example, a film-shaped sealing member is stacked on the substrate without being previously formed into a tray shape or a case shape, and the periphery of the sealing member By merely fusing the part (outer edge part), the electronic component or solder part in the sealed region does not adhere to the sealing member, and the effect of the present invention can be achieved. On the other hand, when the unevenness (or undulation) due to the electronic components on the substrate is large, the sealing member molded in a tray or case shape is put on the sealing region of the device, and only the outer edge portion of the sealing member is fused. Is preferred.

It should be noted that the area to be sealed of the device is usually a part that is easily damaged, for example, an electronic element mounting part or a wiring part.

The most important point in the bonding step is that the bonding area (bonding site) between the substrate and the sealing member is small, and the peripheral edge (outer edge) of the sealing member is bonded to the substrate. The method of bonding is not particularly limited, and examples thereof include heating with a laser beam and heating with a heat sealing device such as a heat sealer, and a method of heating and bonding only the bonding site is preferable. In the present invention, it is sufficient that only the adhesion portion of the peripheral edge portion (outer edge portion) of the sealed region (protected region) can be fused with heat, so that the heat damage to the electronic device is small. Therefore, it can be used even if it is not a low melting-point sealing member like the prior art.

The entire sealing member may be heated as necessary, but under the condition that the entire sealing member is melted, the sealing member is non-uniformly fused to the electronic component on the electronic device, It is not preferable because it melts and contacts a solder part or a circuit part of an electronic component, or the thickness of the sealing part can be reduced by melting, or a hole may be opened depending on circumstances. However, as long as such a problem does not occur, the sealing member may be preheated and bonded.

When laser is used for fusion, the laser is transmitted through the peripheral edge (or outer edge) of the sealing member as in normal laser welding, and the substrate is heated, and the peripheral edge of the sealing member is heated by the heat. A method of melting and fusing may be employed, but the laser intensity may be adjusted according to the type of device (for example, the color of the substrate, the presence or absence of a circuit inside the substrate, etc.). For example, if there is a display part that can absorb laser light (such as dark colored characters that can absorb laser light) on the substrate, the laser will be strongly absorbed by the display part, generating more heat than necessary. Yes, there is a possibility of fire in extreme cases.

In the present invention, unlike ordinary laser welding between thermoplastic resins, it is not necessary to increase the temperature on the substrate side, and the peripheral portion of the sealing member only needs to be heated and melted. Therefore, a thermoplastic resin composition (laser-absorbing thermoplastic resin composition) containing a colorant (pigment or dye such as carbon black) capable of absorbing laser light and a thermoplastic resin at least at the peripheral portion of the sealing member There is a preferable case in which the thermoplastic resin at the peripheral edge (or outer edge) is directly heated and welded with a laser. In addition, in the laser absorptive thermoplastic resin composition, the whole sealing member may be shape | molded and only the peripheral part (outer edge part) of a sealing member may be shape | molded. Moreover, in a laminated film or its tray-shaped molded object, you may form the resin layer (sealing layer) which contacts a board | substrate with the said laser absorptive thermoplastic resin composition.

The heating temperature of the peripheral edge (outer edge) of the sealing member is, for example, 75 to 200 ° C., preferably 80 to 180 ° C., more preferably 100 to 100 ° C., depending on the melting point and softening point of the thermoplastic resin of the sealing member. It may be about 175 ° C. (for example, 110 to 150 ° C.). In the laminated film, the heating temperature is equal to or higher than the melting point of the thermoplastic resin (for example, the melting point + 5 ° C. or higher, preferably the melting point + 10 ° C. or higher) and the melting point of the heat resistant resin forming the protective layer + 10 ° C. or lower (for example, , Melting point + 5 ° C. or lower, preferably less than the melting point). Further, the heating temperature may be usually not less than the glass transition temperature of the heat-resistant resin forming the protective layer (preferably not less than the heat distortion temperature). Heating can be performed in air or in an inert gas atmosphere. If necessary, adhesion may be performed under normal pressure, increased pressure, or reduced pressure. Furthermore, if necessary, thermal bonding may be repeated.

In the cooling step, the peripheral edge (outer edge) of the thermally bonded sealing member may be naturally cooled, cooled stepwise or continuously, or rapidly cooled.

Through such a process, it is possible to obtain a sealed device in which the peripheral edge (outer edge) of the sealing member is thermally fused to the substrate of the device.

In such a method, unlike injection molding or the like, high temperature and high pressure do not act on the device, and the peripheral portion of the sealing member is only heated, so that the device is not damaged. Moreover, since it is not necessary to fill parts and solder parts with resin and only the peripheral part of a sealing member should be adhere | attached, generation | occurrence | production of a void can be reduced significantly. Furthermore, even a specific sealed region of the device can be sealed with high adhesion and sealing properties. Note that when a thermoadhesive thermoplastic resin is used, the peripheral portion of the sealing member can be fused at a relatively low temperature, so that the device is less likely to be thermally damaged and the reliability of the device can be improved. Moreover, the device can be sealed with high reliability within a short time, and the productivity of the sealed device can be greatly improved.

Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited to these examples. In the following Examples and Comparative Examples, the same thermoplastic resin was used, and only the sealing and protection methods were changed for evaluation. The resins used in the examples and comparative examples and the evaluation methods of the respective evaluation items are as follows.

[resin]
Resin A: Copolymer polyamide (“Vestamelt X1038P1” manufactured by Evonik, containing C _10-14 alkylene group, melting point 125 ° C.)
Resin B: Copolyamide (“Vestamelt X1051” manufactured by Evonik, containing C _10-14 alkylene group, melting point 130 ° C.)
Resin C: Copolyamide (“Vestamelt X1333P1” manufactured by Evonik, containing C _10-14 alkylene group, melting point 105 ° C.)
Resin D: Copolyamide (“Vestamelt 4680” manufactured by Evonik, containing C _10-14 alkylene group, melting point 105 ° C.)
Resin E: Copolyamide (“Vestamelt X7079” manufactured by Evonik, containing C _10-14 alkylene group, melting point 130 ° C.)
Resin F: a melt blend obtained by compounding two types of copolymerized polyamides (a composition containing “Vestamelt X1038” and “Vestamelt Z2131” manufactured by Evonik in a ratio of 1/1) by a twin screw extruder things (Evonik Ltd. "Daiamide _Z1117", containing _{C 10-14} alkylene group, melting point 130 ° C.)
[Solder crack]
A flat plate (vertical 100 mm, horizontal 100 mm, thickness 3 mm) formed of polyetheretherketone resin (Evonik's “VESTAKEEP-J ZV7403”) has a predetermined four locations (vertical and horizontal ends, 30 mm inward, respectively) The test was conducted by drilling holes (diameter: 2 mm) in four places where straight lines extending in the vertical and horizontal directions intersect, and inserting a copper wire (diameter: 1 mm, length: 10 mm) and fixing with solder. A substrate was prepared. The solder used was a tin-copper-nickel alloy lead-free solder.

The obtained test substrate was sealed by the methods of Examples and Comparative Examples, and the presence or absence of cracks in the solder portion was observed with a fiberscope.

[Electrical characteristics test]
A comb-shaped electrode portion was formed between the wirings of a printed wiring board (wires attached to a glass epoxy resin substrate with copper foil) to prepare a test substrate. As shown in FIG. 3, the test substrate (thickness: 1.5 mm) has a pair of counter electrode portions (width: 4.4 mm, length: 29 mm) formed in a straight line with an interval of 20.1 mm. 31a, 31b, extended electrode portions (width 3.5 mm, length 10.5 mm) 32a, 32b extending linearly in the direction approaching each other from the ends of the pair of counter electrode portions, Connection electrode portions (width 4.4 mm, length 8.8 mm) 33a, 33b extending in the opposite direction to the pair of

counter electrode portions

31a, 31b are formed at intervals of 7.8 mm from the end portions, Comb-

like electrode portions

34a and 34b extending in a comb shape alternately in the opposing direction are formed from the pair of

counter electrode portions

31a and 31b, thereby forming a predetermined circuit. In the comb-shaped

electrode portions

34a and 34b, the length (overlap width) W of the adjacent comb teeth that overlap in the direction facing each other is 16.5 mm. In FIG. 3, the outer periphery of the film-shaped sealing member that seals the test substrate is indicated by a dotted line.

The obtained test pieces were sealed by the methods of Examples and Comparative Examples and subjected to the following tests.

In addition, as a test substrate, a test substrate (Examples 1, 2, 5 and Comparative Examples 1-6, 13-15) on which comb-shaped electrodes having a pitch (interval) of 0.4 mm were formed and a pitch of 0 were used. A test substrate on which a 25 mm comb-shaped electrode was formed (other examples and comparative examples) was used.

(1) Moisture resistance test Under conditions of 85 ° C. and 85% RH, a DC voltage of 12 V is applied to the connection electrode portion of the test substrate sealed with resin, the change in resistance value is measured, and the resistance value is 1 × The time when it became 10 ⁶ Ω or less was confirmed. The change in resistance value was confirmed up to 500 hours. The resistance value of the test substrate not sealed with resin was 5 × 10 ⁸ Ω.

(2) Heat shock test A 12V DC voltage was applied to the connection electrode part of the test substrate sealed with resin, held at -30 ° C for 1 hour, quickly heated to 40 ° C, and a humidity of 90% RH The number of times when the resistance value is 1 × 10 ⁶ Ω or less is measured by measuring the change in resistance value during this cycle, which is held for 1 hour and then cooled to −30 ° C. again. (Cycle number) was confirmed. The change in resistance value was confirmed up to 500 cycles. The resistance value of the test substrate not sealed with resin was 1.0 × 10 ⁹ Ω.

Example 1
Resin A was hot-pressed to prepare a film having a thickness of 100 μm. Then, the obtained film is cut to a size corresponding to the sealed region of each test substrate, and only the peripheral portion of the film of a predetermined size is fused to the substrate of the test substrate with a heat sealer and sealed with resin. A stopped specimen was prepared.

In the evaluation of the crack in the solder part, the test substrate is covered with a film-like sealing member cut to a size of 100 mm in length and 100 mm in width, and only the peripheral part (outer edge part having a width of about 3 mm) of the sealing member is covered. A test piece was prepared by heat-sealing the test substrate over the entire circumference and sealing with a sealing member. The film-like sealing member after heat sealing was not in contact with the copper wire, and was separated from the test substrate, the solder portion, and the copper wire without bonding except for the heat sealing portion.

Further, in the electrical characteristic test, the film-shaped sealing member cut into a size of 38 mm in length and 38 mm in width was cut and a pair of counter electrode portions and comb-shaped electrode portions (including at least comb-shaped electrode portions) of the test substrate were used. The region indicated by the dotted line of Fig. 2 is covered, and only the peripheral edge portion (outer edge portion having a width of about 3 mm) of the sealing member is heat-sealed to the substrate portion and the electrode portion of the test substrate, and fusion-sealed to prepare a test piece. . In the test piece, the film-shaped sealing member was separated from the comb-shaped electrode portion and the substrate except for the heat seal portion.

(Comparative Example 1)
A test in which each test substrate was inserted into a vertical injection molding machine, the entire test piece was overmolded with resin A and sealed with resin A under the conditions of a cylinder temperature of 200 ° C., an injection pressure of 10 MPa, and a mold temperature of 30 ° C. Pieces were prepared. The thickness of the sealed resin was about 5 mm.

(Comparative Example 2)
A powder obtained by freezing and pulverizing the resin A was spread on each test substrate and heated in an oven at 180 ° C. for 5 minutes to prepare a test piece sealed with the resin A. The thickness of the sealed resin was about 5 mm.

(Comparative Example 3)
A film having a thickness of 100 μm obtained by hot pressing the resin A was prepared. Then, the obtained film is cut into a size corresponding to the covering area of each test substrate, and a film-like sealant is placed on the test substrate and melted by heating in a 180 ° C. oven for 5 minutes. And a test piece was prepared.

(Examples 2 to 6)
In Example 1, instead of Resin A, Resin B (Example 2), Resin C (Example 3), Resin D (Example 4), Resin E (Example 5), Resin F (Example 6) A test piece was prepared in the same manner as in Example 1 except that.

(Comparative Example 4)
In Comparative Example 1, a test piece was prepared in the same manner as Comparative Example 1 except that Resin B was used instead of Resin A.

(Comparative Example 5)
In Comparative Example 2, a test piece was prepared in the same manner as Comparative Example 2 except that Resin B was used instead of Resin A.

(Comparative Example 6)
In Comparative Example 3, a test piece was prepared in the same manner as Comparative Example 3 except that Resin B was used instead of Resin A.

(Comparative Example 7)
In Comparative Example 1, a test piece was prepared in the same manner as in Comparative Example 1 except that Resin C was used instead of Resin A and the cylinder temperature was changed to 170 ° C.

(Comparative Example 8)
In Comparative Example 2, a test piece was prepared in the same manner as Comparative Example 2 except that Resin C was used instead of Resin A.

(Comparative Example 9)
In Comparative Example 3, a test piece was prepared in the same manner as in Comparative Example 3 except that Resin C was used instead of Resin A.

(Comparative Example 10)
In Comparative Example 1, a test piece was prepared in the same manner as in Comparative Example 1 except that Resin D was used instead of Resin A and the cylinder temperature was changed to 170 ° C.

(Comparative Example 11)
In Comparative Example 2, a test piece was prepared in the same manner as Comparative Example 2 except that Resin D was used instead of Resin A.

(Comparative Example 12)
In Comparative Example 3, a test piece was prepared in the same manner as Comparative Example 3 except that Resin D was used instead of Resin A.

(Comparative Example 13)
In Comparative Example 1, a test piece was prepared in the same manner as Comparative Example 1 except that Resin E was used instead of Resin A.

(Comparative Example 14)
In Comparative Example 2, a test piece was prepared in the same manner as Comparative Example 2 except that Resin E was used instead of Resin A.

(Comparative Example 15)
In Comparative Example 3, a test piece was prepared in the same manner as Comparative Example 3 except that Resin E was used instead of Resin A.

The results are shown in the table.

In the voltage application test, a test substrate having a comb electrode pitch of 0.4 mm was used.

In the moisture resistance test, in Example 1 and Example 2, it was 5 × 10 ⁸ Ω at 500 hours.

In the heat shock test, in Example 1, Example 2, and Comparative Example 1, it was 1.0 × 10 ⁹ Ω at the time of 500 cycles (500 times).

In the voltage application test, a test substrate having a comb electrode pitch of 0.25 mm was used.

In the moisture resistance test, in Example 3 and Example 4, it was 5 × 10 ⁸ Ω at 500 hours.

In the heat shock test, in Example 3, Example 4, and Comparative Example 7, it was 1.0 × 10 ⁹ Ω at the time of 500 cycles (500 times).

In the voltage application test, in Example 5 and Comparative Examples 13 to 15, a test substrate having a comb electrode pitch of 0.4 mm was used, and in Example 6, a test substrate having a comb electrode pitch of 0.25 mm was used. did.

In the moisture resistance test, in Example 5 and Example 6, it was 5 × 10 ⁸ Ω at 500 hours.

In the heat shock test, in Example 5, Example 6, and Comparative Example 13, it was 1.0 × 10 ⁹ Ω at the time of 500 cycles (500 times).

As described above, all of the embodiments can be sealed with high adhesion, and the sealed area of the substrate can be effectively protected even if only the peripheral edge of the sealing member is bonded to the substrate.

The present invention is useful for sealing electronic elements or electronic components such as semiconductor elements, EL elements, solar cells, printed circuit boards mounted with various electronic components or electronic elements, and the like.

DESCRIPTION OF SYMBOLS 1 ... Device 2 ... Board | substrate 3a-3c ... Electronic component 11, 21 ... Sealing

member

12, 22a, 22b ... Accommodating recessed

part

13, 23 ...

Peripheral part

15, 25a, 25b ... Free space

Claims

A sealing device in which a sealed area of a device is sealed with a sealing member, wherein the sealing member has a film-like or tray-like form, and at least a peripheral portion of the sealing member is thermoplastic A sealing device in which the sealing member is separated from a mounting component of the device, and a peripheral portion of the sealing member is bonded to the device;
The sealing device according to claim 1, wherein at least a peripheral portion of the sealing member includes a thermoadhesive thermoplastic resin, and only the peripheral portion of the sealing member is thermally bonded to the substrate of the device.
The sealing device according to claim 1 or 2, wherein at least a peripheral portion of the sealing member contains a copolymerized polyamide-based resin.
The film-shaped or tray-shaped sealing member includes a copolyamide-based resin having a peripheral portion capable of making line contact or surface contact with the substrate of the device and having at least one of the following characteristics: The sealing device according to any one of the above.
(1) Melting point or softening point is 75 to 160 ° C. (2) Crystallinity (3) Crystallinity and melting point 90 to 160 ° C.
The sealing device according to any one of claims 1 to 4, wherein the sealing member is a copolymerized polyamide resin of a binary copolymer to a quaternary copolymer and has at least one unit below.
(A) a unit derived from a long chain component having a C 8-16 alkylene group (b) a unit derived from at least one component selected from C 9-17 lactam and amino C 9-17 alkanecarboxylic acid (c) Units derived from at least one component selected from laurolactam, aminoundecanoic acid and aminododecanoic acid
6. The sealing member according to claim 1, wherein the sealing member includes a sealing layer containing a copolymerized polyamide resin and a protective layer laminated on one surface of the sealing layer and formed of a heat resistant resin. The sealing device according to 1.
The sealing device according to claim 6, wherein the heat resistant resin has at least a melting point or a softening point of 170 ° C. and is at least one selected from a polyester resin, a polyamide resin, and a fluororesin.
The sealing device according to any one of claims 1 to 7, wherein the sealing member has a thickness of 10 to 1000 µm.
A method for manufacturing a sealed device in which a sealed region of a device is sealed with a sealing member, wherein the sealing member has a film shape or a tray shape, and at least a peripheral portion of the sealing member Includes a thermoplastic resin, and the sealing member is separated from the device mounting component inside the sealed region, and the peripheral portion of the sealing member is adhered to the substrate of the device. A method of manufacturing a device having a sealed area covered and sealed.
10. The sealing member covers at least a peripheral area of the device with a sealing member containing a copolymerized polyamide-based resin, and the peripheral edge of the sealing member is thermally bonded to the substrate of the device for cooling. the method of.
A sealing member for sealing an area to be sealed of a device, which is formed into a film shape or a tray shape, and includes a thermoplastic resin at a peripheral edge; is released without adhering to a mounting component of the device A sealing member comprising an inner region for forming a free space, and a peripheral portion that can be bonded to the substrate of the device.
The sealing member according to claim 11, further comprising a device substrate and a thermally bondable peripheral portion, wherein at least the peripheral portion includes a copolymerized polyamide resin.